LFBGA Field Programmable Gate Arrays (FPGA) 1,286

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

MPF100TS-FCSG325I

Microchip Technology

FPGA

Ball

325

LFBGA

Square

Plastic/Epoxy

Yes

1.03 V

CMOS

170

1

Grid Array, Low Profile, Fine Pitch

BGA325,21X21,20

.97 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B325

1.45 mm

11 mm

It also Operates at 1.05 V nominal supply

170

11 mm

XC6SLX45T-3CSG324C

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

43661

Yes

1.26 V

3411

CMOS

190

1.2

1.2,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0.21 ns

3411 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

862 MHz

30 s

190

260 °C (500 °F)

15 mm

XC6SLX9-L1CSG225C

Xilinx

FPGA

Other

Ball

225

LFBGA

Square

Plastic/Epoxy

9152

Yes

1.05 V

715

CMOS

160

1

1,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA225,15X15,32

Field Programmable Gate Arrays

.95 V

.8 mm

85 °C (185 °F)

0.46 ns

715 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

3

1.4 mm

13 mm

No

e1

30 s

160

260 °C (500 °F)

13 mm

XC7S6-L1CSGA225I

Xilinx

FPGA

Industrial

Ball

225

LFBGA

Square

Plastic/Epoxy

6000

Yes

.98 V

469

100

0.95

Grid Array, Low Profile, Fine Pitch

BGA225,15X15,32

.92 V

.8 mm

100 °C (212 °F)

1.27 ns

469 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

1.4 mm

13 mm

e1

1098 MHz

100

13 mm

10CL016YU256I7G

Intel

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

1.25 V

963

1.2

Grid Array, Low Profile, Fine Pitch

1.15 V

.8 mm

100 °C (212 °F)

963 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B256

1.5 mm

14 mm

14 mm

10M16SCU324I7G

Intel

FPGA

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

16000

Yes

3.15 V

1000

320

3

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

2.85 V

.8 mm

100 °C (212 °F)

1000 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.55 mm

15 mm

Also Operates at 3.3 V nominal supply

320

15 mm

5CEBA2U15C6N

Intel

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.13 V

CMOS

176

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

No

176

15 mm

LAXP2-8E-5MN132E

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

AEC-Q100

86

8000

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

8000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LCMXO1200C-3BN256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

1200

Yes

3.465 V

150

211

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

211

260 °C (500 °F)

14 mm

LCMXO2-4000HC-5BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

4320

Yes

3.465 V

206

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

2.375 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO2-4000HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000HE-6MG184C

Lattice Semiconductor

FPGA

Other

Ball

184

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

150

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA184,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B184

3

1.5 mm

8 mm

No

e1

150

8 mm

LCMXO2280C-5MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

285 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO3D-9400HC-5BG400I

Lattice Semiconductor

FPGA

Industrial

Ball

400

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

335

2.5

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

2.375 V

.8 mm

100 °C (212 °F)

7 ns

1175 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

Also Operates at 3.3 V nominal supply

335

17 mm

LCMXO3D-9400ZC-2BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

206

2.5

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

2.375 V

.8 mm

85 °C (185 °F)

7 ns

1175 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B256

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

206

14 mm

LCMXO3L-1300C-6BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

1300

Yes

3.465 V

160

206

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO3L-6900C-6BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

3.465 V

858

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

85 °C (185 °F)

858 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

260 °C (500 °F)

14 mm

LCMXO640C-3MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

640

Yes

3.465 V

80

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

80 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO640C-3MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

640

Yes

3.465 V

80

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

80 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LFE5UM-85F-8MG285I

Lattice Semiconductor

FPGA

Industrial

Ball

285

LFBGA

Square

Plastic/Epoxy

Yes

1.155 V

10500

1.1

Grid Array, Low Profile, Fine Pitch

1.045 V

.5 mm

100 °C (212 °F)

10500 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B285

3

1.3 mm

10 mm

e1

30 s

260 °C (500 °F)

10 mm

LIFCL-40-7BG400C

Lattice Semiconductor

FPGA

Other

Ball

400

LFBGA

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

74

1

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B400

3

1.7 mm

17 mm

30 s

74

260 °C (500 °F)

17 mm

M2GL005-VF256IX417

Microchip Technology

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

1.26 V

161

1.2

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

1.56 mm

14 mm

161

14 mm

M2GL010T-VFG400

Microchip Technology

FPGA

Other

Ball

400

LFBGA

Square

Plastic/Epoxy

12084

Yes

1.26 V

195

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B400

3

1.51 mm

17 mm

No

195

17 mm

M2GL025-1VFG256

Microchip Technology

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

1.26 V

1.2

Tray

Grid Array, Low Profile, Fine Pitch

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

3

1.56 mm

14 mm

14 mm

M2GL025T-VFG400I

Microchip Technology

FPGA

Industrial

Ball

400

LFBGA

Square

Plastic/Epoxy

27696

Yes

1.26 V

CMOS

207

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

Field Programmable Gate Arrays

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B400

3

1.51 mm

17 mm

No

207

17 mm

M2S005-1VF400

Microchip Technology

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

6060

Yes

1.26 V

171

1.2

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B400

1.51 mm

17 mm

30 s

171

240 °C (464 °F)

17 mm

M2S005-1VFG400

Microchip Technology

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

6060

Yes

1.26 V

171

1.2

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B400

3

1.51 mm

17 mm

40 s

171

250 °C (482 °F)

17 mm

M2S005-VF400

Microchip Technology

FPGA

Other

Ball

400

LFBGA

Square

Plastic/Epoxy

4956

Yes

1.26 V

CMOS

160

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B400

1.51 mm

17 mm

No

e0

30 s

160

240 °C (464 °F)

17 mm

M2S060-VF400I

Microchip Technology

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

56520

Yes

1.26 V

207

1.2

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B400

1.51 mm

17 mm

30 s

207

240 °C (464 °F)

17 mm

M2S060T-1VF400I

Microchip Technology

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

56520

Yes

1.26 V

207

1.2

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B400

1.51 mm

17 mm

30 s

207

240 °C (464 °F)

17 mm

M2S060T-VF400

Microchip Technology

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

56520

Yes

1.26 V

207

1.2

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B400

1.51 mm

17 mm

30 s

207

240 °C (464 °F)

17 mm

M2S060TS-VF400I

Microchip Technology

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

56520

Yes

1.26 V

207

1.2

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B400

1.51 mm

17 mm

30 s

207

240 °C (464 °F)

17 mm

MPF050T-FCSG325E

Microchip Technology

FPGA

Ball

325

LFBGA

Square

Plastic/Epoxy

48000

Yes

1.03 V

CMOS

164

1

Grid Array, Low Profile, Fine Pitch

BGA325,21X21,20

.97 V

.5 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B325

1.45 mm

11 mm

It also Operates at 1.05 V nominal supply

164

11 mm

MPF100TLS-FCSG325I

Microchip Technology

FPGA

Ball

325

LFBGA

Square

Plastic/Epoxy

Yes

1.03 V

CMOS

170

1

Grid Array, Low Profile, Fine Pitch

BGA325,21X21,20

.97 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B325

1.45 mm

11 mm

It also Operates at 1.05 V nominal supply

170

11 mm

XA7A35T-1CSG324Q

Xilinx

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

33280

Yes

1.05 V

2600

HKMG

AEC-Q100

210

1

1 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.95 V

.8 mm

125 °C (257 °F)

1.27 ns

2600 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

1098 MHz

30 s

210

260 °C (500 °F)

15 mm

XC6SLX25T-N3CSG324I

Xilinx

FPGA

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

24051

Yes

1.26 V

1879

CMOS

190

1.2

1.2,1.2/3.3,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.14 V

.8 mm

100 °C (212 °F)

0.26 ns

1879 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

806 MHz

30 s

190

260 °C (500 °F)

15 mm

XC6SLX45T-2CSG324C

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

43661

Yes

1.26 V

3411

CMOS

190

1.2

1.2,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0.26 ns

3411 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

667 MHz

30 s

190

260 °C (500 °F)

15 mm

XC6SLX9-3CSG324C

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

9152

Yes

1.26 V

715

CMOS

200

1.2

1.2,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0.21 ns

715 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

862 MHz

30 s

200

260 °C (500 °F)

15 mm

XC6SLX9-L1CSG324I

Xilinx

FPGA

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

9152

Yes

1.05 V

715

CMOS

200

1

1,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.95 V

.8 mm

100 °C (212 °F)

0.46 ns

715 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

30 s

200

260 °C (500 °F)

15 mm

XC7A15T-2CSG324I

Xilinx

FPGA

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

16640

Yes

1.05 V

1300

250

1

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

.95 V

.8 mm

100 °C (212 °F)

1.05 ns

1300 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

e1

1286 MHz

30 s

250

260 °C (500 °F)

15 mm

XC7A35T-3CSG324E

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

33280

Yes

1.05 V

2600

250

1

1 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.95 V

.8 mm

100 °C (212 °F)

0.94 ns

2600 CLBS

0 °C (32 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

1412 MHz

30 s

250

260 °C (500 °F)

15 mm

10M16DAU324I6G

Intel

FPGA

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

16000

Yes

1.25 V

1000

320

1.2

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

1.15 V

.8 mm

100 °C (212 °F)

1000 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.55 mm

15 mm

320

15 mm

LCMXO2-2000HE-4BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

2112

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO3D-9400HC-5BG400C

Lattice Semiconductor

FPGA

Other

Ball

400

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

335

2.5

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

2.375 V

.8 mm

85 °C (185 °F)

7 ns

1175 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

Also Operates at 3.3 V nominal supply

335

17 mm

LCMXO3D-9400ZC-2BG400C

Lattice Semiconductor

FPGA

Other

Ball

400

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

335

2.5

Grid Array, Low Profile, Fine Pitch

BGA400,20X20,32

2.375 V

.8 mm

85 °C (185 °F)

7 ns

1175 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

Also Operates at 3.3 V nominal supply

335

17 mm

LCMXO3D-9400ZC-3BG256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

206

2.5

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

2.375 V

.8 mm

100 °C (212 °F)

6.7 ns

1175 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B256

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

206

14 mm

LCMXO3L-1300C-6BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

3.465 V

160

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

85 °C (185 °F)

160 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

260 °C (500 °F)

14 mm

LCMXO3LF-2100C-5BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

2100

Yes

3.465 V

264

206

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.