Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
324 |
Yes |
5.25 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.6 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
MAX available 16000 Logic gates |
e0 |
83 MHz |
30 s |
196 |
225 °C (437 °F) |
24 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
3000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.5 ns |
196 CLBS, 3000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 5000 Logic gates |
e3 |
179 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
64 |
CMOS |
2000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
64 CLBS, 2000 Gates |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Typical gates = 2000-3000 |
20 mm |
|||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.1 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
113 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
192 CLBS, 50000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
1500 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
7 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G100 |
1.7 mm |
14 mm |
No |
360 flip-flops; typical gates = 1500-2000 |
100 MHz |
14 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
324 |
CMOS |
10000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.6 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 16000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 7000-20000 |
e0 |
217 MHz |
30 s |
160 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
33192 |
Yes |
1.26 V |
3688 |
CMOS |
1600000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
125 °C (257 °F) |
4.88 ns |
3688 CLBS, 1600000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.25 V |
196 |
CMOS |
117 |
6000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 10000 Logic gates |
e0 |
83 MHz |
30 s |
117 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
657 MHz |
30 s |
80 |
260 °C (500 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
122 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e0 |
323 MHz |
30 s |
122 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
Max usable 6000 Logic gates |
e3 |
370 MHz |
30 s |
260 °C (500 °F) |
24 mm |
|||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
120 |
CMOS |
4000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
4.6 ns |
120 CLBS, 4000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 6000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.6 mm |
14 mm |
No |
70 MHz |
14 mm |
||||||||||||||||||||||||||
Xilinx |
FPGA |
Commercial Extended |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
864 |
52000 |
1.8 |
Flatpack, Low Profile, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
864 CLBS, 52000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 150000 |
e0 |
357 MHz |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
500000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
125 °C (257 °F) |
4.88 ns |
1164 CLBS, 500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
448 |
CMOS |
200000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
448 CLBS, 200000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
667 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
400 |
CMOS |
7000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 20000 |
e3 |
166 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
5.25 V |
256 |
CMOS |
128 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2 ns |
256 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e0 |
125 MHz |
30 s |
128 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
144 |
CMOS |
2000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 3000 Logic gates |
e3 |
135 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
196 |
CMOS |
3000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
2.7 ns |
196 CLBS, 3000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 5000 Logic gates |
e3 |
111 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 6000-10000 |
e0 |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
3.6 V |
224 |
CMOS |
120 |
3500 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
70 °C (158 °F) |
6.7 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
80 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 6000-10000 |
e0 |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
196 |
10000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
30000 equivalent gates available |
e0 |
30 s |
196 |
225 °C (437 °F) |
20 mm |
|||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
3.6 V |
320 |
CMOS |
144 |
5000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
6.7 ns |
320 CLBS, 5000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
80 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
238 |
Yes |
5.25 V |
100 |
CMOS |
77 |
2500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 ns |
100 CLBS, 2500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
360 flip-flops; typical gates = 2500-3000 |
e0 |
133.3 MHz |
30 s |
77 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.5 V |
196 |
CMOS |
148 |
6000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
5.6 ns |
196 CLBS, 6000 Gates |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
MAX available 10000 Logic gates |
e0 |
83 MHz |
30 s |
148 |
225 °C (437 °F) |
24 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.3 ns |
400 CLBS, 7000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 10000 Logic gates |
e0 |
200 MHz |
30 s |
160 |
225 °C (437 °F) |
24 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
657 MHz |
80 |
20 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.75 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 6000 Logic gates |
e3 |
323 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
370 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
238 |
Yes |
5.25 V |
100 |
CMOS |
77 |
2500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.5 ns |
100 CLBS, 2500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
360 flip-flops; typical gates = 2500-3000 |
e0 |
133.3 MHz |
30 s |
77 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
70 °C (158 °F) |
64 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G64 |
1.27 mm |
10 mm |
No |
MAX 64 I/OS; 1300 to 7500 available gates |
10 mm |
|||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 10000 Logic gates |
e0 |
179 MHz |
30 s |
160 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
98 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.7 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
294 MHz |
30 s |
98 |
225 °C (437 °F) |
20 mm |
||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
370 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.25 V |
196 |
CMOS |
117 |
6000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.6 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 10000 Logic gates |
e0 |
83 MHz |
30 s |
117 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
612 |
250000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
4.34 ns |
612 CLBS, 250000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
135 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.2 ns |
320 CLBS, 5000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
323 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
238 |
Yes |
5.25 V |
100 |
CMOS |
77 |
2500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
6 ns |
100 CLBS, 2500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
360 flip-flops; typical gates = 2500-3000 |
e0 |
90.9 MHz |
30 s |
77 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.6 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
300 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.26 ns |
300 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.