LGA Field Programmable Gate Arrays (FPGA) 6

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Maximum Clock Frequency	No. of Outputs	Length
RT3PE3000L-1LG484E	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	38535V;38534K;883S	341	3000000	1.2	1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Bottom	S-XBGA-N484	3.83 mm	23 mm	No		250 MHz	341	23 mm
RT3PE3000L-LG484B	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2	1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Bottom	S-XBGA-N484	3.83 mm	23 mm	No		250 MHz	341	23 mm
RT4G150-LG1657B	Microchip Technology	FPGA		No Lead	1657	LGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	720		1.2		Grid Array	LGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Bottom	S-CBGA-N1657	3.51 mm	42.5 mm				720	42.5 mm
RTAX2000S-1LG624E	Microchip Technology	FPGA	Military	No Lead	624	LGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5	1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Bottom	S-CBGA-N624	2.96 mm	32.5 mm	No	250000 ASIC gates also available		684	32.5 mm
RTAX2000S-LG624E	Microsemi	FPGA	Military	No Lead	624	LGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5	1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Bottom	S-CBGA-N624	2.96 mm	32.5 mm	No	250000 ASIC gates also available		684	32.5 mm
RTAX2000SLG624E	Microchip Technology	FPGA	Military	No Lead	624	LGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5	1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Bottom	S-CBGA-N624	2.96 mm	32.5 mm	No	250000 ASIC gates also available		684	32.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.