TFBGA Field Programmable Gate Arrays (FPGA) 1,339

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	No. of Outputs	Length
5CGXBC5F7M11C8	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXBC4E6M11C8N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXFC4E7M11C6N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXBC5C6M13I7	Altera	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm				Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5D7M11C8N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CEBA4M13C6N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4D6M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4C7M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGTFD5F5M11I7N	Altera	FPGA	Industrial	Ball	301	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908	CMOS	129	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA301,21X21,20	Field Programmable Gate Arrays	1.07 V	.5 mm	100 °C (212 °F)	2908 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm	No	129	11 mm
5CGXBC4E7M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5A7M13C6N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5D6M13I7N	Altera	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm				Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC4C6M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC4F7M11I7	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm				Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXFC4B6M13C6N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4D7M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC4D7M13C7	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4F6M11C6	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXBC4A6M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CEFA4M13C8N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4D6M13C7	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4E6M13C8N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC5E7M11I7	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm				Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXFC4E7M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5F7M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC4F7M11C7N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
EP4CE15M9I7N	Altera	FPGA		Ball	256	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm				Bottom	S-PBGA-B256	1.2 mm	9 mm			9 mm
5CGXBC4D6M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5E7M13I7	Altera	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm				Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC5D7M11C7N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
EP3C16M164C7	Altera	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	92	1.2	1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B164	1.2 mm	8 mm	No	92	8 mm
EP3C10M164C7	Altera	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	106	1.2	1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B164	1.2 mm	8 mm	No	106	8 mm
5CGXFC4D6M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4E7M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXFC4A7M13C6N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5A6M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CEFA4M13I7N	Altera	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm				Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4B7M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4A6M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC4E6M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXFC4D6M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4E7M11C6N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CEFA2M13A7	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.