Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
120 |
CMOS |
4000 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.5 V |
.5 mm |
5.6 ns |
120 CLBS, 4000 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 6000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
14 mm |
||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 6000-10000 |
e0 |
14 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
500000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
125 °C (257 °F) |
4.88 ns |
1164 CLBS, 500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
14 mm |
||||||||||||
Xilinx |
FPGA |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G64 |
1.2 mm |
10 mm |
No |
70 MHz |
10 mm |
||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.5 V |
144 |
CMOS |
82 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.7 ns |
144 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
270 MHz |
30 s |
82 |
240 °C (464 °F) |
14 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
54 |
1500 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3.3 ns |
100 CLBS, 1500 Gates |
Tin Lead |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
Max usable 2000 Logic gates |
e0 |
227 MHz |
30 s |
54 |
240 °C (464 °F) |
10 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
657 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
30 s |
160 |
240 °C (464 °F) |
14 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
192 CLBS, 50000 Gates |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
657 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G64 |
1.2 mm |
10 mm |
No |
10 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
54 |
1500 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
Max usable 2000 Logic gates |
e0 |
323 MHz |
30 s |
54 |
240 °C (464 °F) |
10 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
7000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
400 CLBS, 7000 Gates |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
400 |
7000 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.5 V |
.5 mm |
400 CLBS, 7000 Gates |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
500000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
4.88 ns |
1164 CLBS, 500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
14 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.8 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
MAX available 3000 Logic gates |
e0 |
83 MHz |
30 s |
84 |
240 °C (464 °F) |
10 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
3000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 3000-9000 |
e3 |
217 MHz |
30 s |
260 °C (500 °F) |
14 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 6000-10000 |
e0 |
14 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.6 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
MAX available 3000 Logic gates |
e0 |
83 MHz |
30 s |
84 |
240 °C (464 °F) |
10 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
64 |
CMOS |
2000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 2000-3000 |
e0 |
14 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
152 |
Yes |
3.6 V |
64 |
CMOS |
64 |
1000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 1600 Logic gates |
e0 |
217 MHz |
30 s |
64 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.6 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
MAX available 3000 Logic gates |
e0 |
83 MHz |
30 s |
84 |
240 °C (464 °F) |
10 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e4 |
14 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
100 |
2000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
14 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
196 |
CMOS |
6000 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.5 V |
.5 mm |
5.6 ns |
196 CLBS, 6000 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 10000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3.8 ns |
64 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 2000-3000 |
e0 |
83 MHz |
30 s |
84 |
240 °C (464 °F) |
14 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
64 |
CMOS |
2000 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.6 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 3000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
14 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
466 |
Yes |
3.6 V |
196 |
CMOS |
77 |
3000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
217 MHz |
30 s |
77 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
196 |
CMOS |
6000 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.5 V |
.5 mm |
4.6 ns |
196 CLBS, 6000 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 10000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
100 |
CMOS |
1500 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.5 V |
.5 mm |
5.1 ns |
100 CLBS, 1500 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Max usable 2000 Logic gates |
e3 |
113 MHz |
30 s |
260 °C (500 °F) |
14 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
1.6 ns |
196 CLBS, 3000 Gates |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAXIMUM usable gates 10000 |
e0 |
125 MHz |
30 s |
112 |
240 °C (464 °F) |
14 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
3.6 V |
64 |
CMOS |
64 |
1000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 1600 Logic gates |
e0 |
179 MHz |
30 s |
64 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
||||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
77 |
10000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
576 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e3 |
217 MHz |
30 s |
77 |
260 °C (500 °F) |
14 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 1500-2000 |
e0 |
188 MHz |
30 s |
80 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.5 V |
144 |
CMOS |
82 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
5.1 ns |
144 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
113 MHz |
30 s |
82 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
192 CLBS, 50000 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
14 mm |
|||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.6 ns |
196 CLBS, 3000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
166 MHz |
30 s |
112 |
240 °C (464 °F) |
14 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
4.6 ns |
64 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 3000 Logic gates |
e0 |
83 MHz |
30 s |
84 |
240 °C (464 °F) |
14 mm |
||||||||
|
Xilinx |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
AEC-Q100 |
173 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
125 °C (257 °F) |
480 CLBS, 200000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
125 MHz |
30 s |
173 |
260 °C (500 °F) |
14 mm |
||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4032 |
Yes |
1.26 V |
448 |
CMOS |
68 |
200000 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.71 ns |
448 CLBS, 200000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e4 |
667 MHz |
62 |
14 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.