Renesas Electronics Field Programmable Gate Arrays (FPGA) 281

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	No. of Outputs	Length
UPD66207(256PBGA)	Renesas Electronics
UPD66208(500ABGA)	Renesas Electronics
UPD66209(160FPBGA)	Renesas Electronics
UPD66209(208QFP)	Renesas Electronics
CP20840CPGA223A-0I	Renesas Electronics	FPGA	Industrial	Pin/Peg	223	PGA	Square	Ceramic	6740	No		CMOS	180		5		5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin/Lead	Perpendicular	S-XPGA-P223			No	e0	180
CP20420CQFP160A-0M	Renesas Electronics	FPGA	Military	Gull Wing	160	QFP	Square	Ceramic	3584	Yes		CMOS	130		5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin/Lead	Quad	S-XQFP-G160			No	e0	130
CX3422	Renesas Electronics
CP20840CQFP208A-0M	Renesas Electronics	FPGA	Military	Gull Wing	208	QFP	Square	Ceramic	6740	Yes		CMOS	180		5		5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin/Lead	Quad	S-XQFP-G208			No	e0	180
MG75NB02(BGA)	Renesas Electronics
UPD66207(324PBGA)	Renesas Electronics
UPD66206(208QFP)	Renesas Electronics
UPD66208(352ABGA)	Renesas Electronics
UPD66206(208FPBGA)	Renesas Electronics
MG74NB02(BGA)	Renesas Electronics
MG75NB38(BGA)	Renesas Electronics
UPD65676GDH54	Renesas Electronics	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes		CMOS	448		5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G160			No		448
UPD66205(100LQFP)	Renesas Electronics
MG75NB32(BGA)	Renesas Electronics
MG74NB20(BGA)	Renesas Electronics
MG73NB20(BGA)	Renesas Electronics
CP21200CQFP208A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	208	QFP	Square	Ceramic	8960	Yes		CMOS	203		5		5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)		0 °C (32 °F)	Tin/Lead	Quad	S-XQFP-G208			No	e0	203
MG73NB40(BGA)	Renesas Electronics
MG74NB40(BGA)	Renesas Electronics
5962-96A0301V9X	Renesas Electronics																														No
MG73NB14(BGA)	Renesas Electronics
5962-96A0101V9A	Renesas Electronics																									Tin Lead					Yes	e0
MG73NB02(BGA)	Renesas Electronics
MG74NB38(QFP)	Renesas Electronics
MG73NB10(QFP)	Renesas Electronics
MG74NB02(QFP)	Renesas Electronics
MG73NB18(BGA)	Renesas Electronics
UPD66209(144LQFP)	Renesas Electronics
UPD66206(449PBGA)	Renesas Electronics
MG74NB08(QFP)	Renesas Electronics
MG73NB18(QFP)	Renesas Electronics
MG75NB16(QFP)	Renesas Electronics
UPD66205(449PBGA)	Renesas Electronics
UPD65881GB-110-8ES-A	Renesas Electronics	FPGA		Gull Wing	44	LQFP	Square	Plastic/Epoxy		Yes	5.5 V	CMOS		4704	5	Tray		Flatpack, Low Profile	QFP44,.47SQ,32		4.5 V	.8 mm		4704 Gates			Quad	S-PQFP-G44	1.6 mm	10 mm				10 mm
UPD65652GN	Renesas Electronics	FPGA	Industrial	Gull Wing	184	QFP	Square	Plastic/Epoxy		Yes		CMOS	220		5		5 V	Flatpack	QFP184,1.4SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G184			No		220
UPD66209(208FPBGA)	Renesas Electronics
UPD65672GN	Renesas Electronics	FPGA	Industrial	Gull Wing	184	QFP	Square	Plastic/Epoxy		Yes		CMOS	368		5		5 V	Flatpack	QFP184,1.4SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G184			No		368

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.