Field Programmable Gate Arrays (FPGA)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
AGLN250V2-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm
APA1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	56320	Yes	2.7 V		CMOS		158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
EP2AGX190FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612			612		0.9			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.55 mm	35 mm						612		35 mm
EP2AGZ225HF40I3N	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	224000	Yes	.93 V		CMOS		734		.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		3.5 mm	40 mm	No		e1	500 MHz		734		40 mm
EP2C15AF256C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS		152		1.2		1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		903 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		144		17 mm
EP2S30F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	13552	CMOS		500		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	13552 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz		492		35 mm
EP3C25F324C7	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		215		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP3SL50F780C4N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900			488		0.9		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1			488		29 mm
EP4CE15F23C8LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963			346		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		346		23 mm
EP4CE55F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491			327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE6E22A7N	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392			91		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
EP4CE6E22C8L	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392			91		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	362 MHz		91		20 mm
EP4CGX150DF27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	149760	Yes	1.25 V	149760			393		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			149760 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	472.5 MHz	30 s	393	260 °C (500 °F)	27 mm
EP4CGX22CF19C8N	Intel	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330			150		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1330 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz		150		19 mm
LCMXO1200C-3BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			211		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LCMXO2-4000HE-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V				206		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3D-9400HC-5BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			206		2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3L-2100E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3L-6900C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858					2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3LF-2100E-5UWG49ITR1K	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264			38		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1			38	260 °C (500 °F)	3.185 mm
LFD2NX-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI		23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE5U-45F-7BG256C	Lattice Semiconductor	FPGA																											Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5U-85F-6BG381C	Lattice Semiconductor	FPGA																														3									260 °C (500 °F)
LFE5U-85F-8BG554I	Lattice Semiconductor	FPGA																											Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5UM-25F-7BG381C	Lattice Semiconductor	FPGA																														3									260 °C (500 °F)
LFMXO5-25-9BBG400C	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI		252		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm						252		17 mm
LFXP6C-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	720	Yes	3.465 V	720	CMOS		100		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.44 ns	720 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	375 MHz	40 s	100	260 °C (500 °F)	20 mm
M1A3PE3000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
M1AGL600V5-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
M2GL010TS-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL050TS-1VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2S005S-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V				209		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	209	250 °C (482 °F)	23 mm
M2S025T-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF100T-1FCG484T2	Microchip Technology	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS		284		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				284		23 mm
MPF300TL-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		512		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF300TLS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF300TS-FCV484M	Microchip Technology	FPGA	Military	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF500T-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TLFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TL-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
XA6SLX100-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS	AEC-Q100	326				1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz	30 s	326	250 °C (482 °F)
XC3S200-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		173	200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	480 CLBS, 200000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	630 MHz	30 s	173	260 °C (500 °F)	17 mm
XC7A100T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A25T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A35T-L1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250		0.95			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XCAU15P-1SBVB484I	Xilinx	FPGA
XCKU035-1SFVA784C	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95		0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XCKU035-2FBVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700			520		.95		0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.