J Bend Programmable Logic Devices (PLD) 2,387

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
PA7540J-15L	Diodes Incorporated	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS	22		5	5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 20 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No		e3	71.4 MHz		22	260 °C (500 °F)	11.5062 mm		20
PA7572J-20L	Diodes Incorporated	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS	24	PLA-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	124	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.369 mm	16.586 mm	No		e3	66.6 MHz		24	260 °C (500 °F)	16.586 mm		24
PEEL22CV10AJI-10	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz		10		11.5062 mm		10
PEEL18LV8ZJ-15L	Diodes Incorporated	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3	3/3.3 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	31.25 MHz		8	260 °C (500 °F)	8.9662 mm		10
PEEL18LV8ZJI-35L	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3	3/3.3 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 10 I/O	7	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	17.9 MHz		8	260 °C (500 °F)	8.9662 mm		10
PA7536JI-15L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	26		5	5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Mixed	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No		e3	83.3 MHz		12	260 °C (500 °F)	11.5062 mm		12
PEEL22CV10AJI-10L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	11.5062 mm		10
XC9536XV-7PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS			2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3032C-12PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	47 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC73108-20WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 37 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz				29.21 mm	No	37
XC7336-7WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	125 MHz				16.51 mm	No	32
XC7236-25WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	36	CMOS			5	5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks		33 MHz				16.51 mm	No	30
XC9572F-15PCG84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	56 MHz				29.3116 mm		69
XC7236A-16WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V	36	CMOS			5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		60 MHz				16.51 mm	No	30
XCR5032-7PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			91 MHz				16.5862 mm		32
XCR5064-10PC68C	Xilinx	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No			77 MHz				24.2316 mm	No	48
XCR3032XL-10PCG44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3	95 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	36
XC7336Q-15PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC7336-5PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes		36	CMOS				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		No
XC7372-15WC84C	Xilinx	UV PLD	Commercial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				29.21 mm	No	37
XCR5032C-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	32	CMOS			5	5 V	Chip Carrier	QFP44,.5SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	59 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC7236-30PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	48 ns	Yes	5.5 V	36	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks	e0	25 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XCR3032C-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	58.8 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC7354-10WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	22 ns	Yes	5.5 V	54	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 42 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops	e0	76.9 MHz				24.13 mm	No	42
XCR22V10-10PC28C	Xilinx	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No			83 MHz				11.5062 mm		10
XC2C64-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e0		30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XCR22V10-7PC28C	Xilinx	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No			103 MHz		10		11.5062 mm		10
XC9536XV-3PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3.5 ns	Yes	2.62 V					2.5		Chip Carrier				Macrocell	2.37 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm		34
XC2C64-5PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V		CMOS			1.8		Chip Carrier				Macrocell	1.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm		33
XC7354-10WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	22 ns	Yes	5.25 V	54	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 25 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	76.9 MHz				16.51 mm	No	25
XC7372-15WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				29.21 mm	No	37
XC7336-15PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC9536F-15PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	56 MHz				16.5862 mm		34
XC9536F-15PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR3064A-12PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS			3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XCR5064-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC7272A-16WC68C	Xilinx	UV PLD	Commercial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V	72	CMOS			5	5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 38 I/O	8	0 °C (32 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		55 MHz				24.13 mm	No	38
XC7336Q-12PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR3064XL-7PCG44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	119 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	36
XC7372-7WC68C	Xilinx	UV PLD	Commercial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	18.5 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 25 I/O	10	0 °C (32 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		95.2 MHz				24.13 mm	No	25
XCR3128-12PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	66 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	64
XC9536F-5PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS			5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz	30 s		245 °C (473 °F)	16.5862 mm		34
XC7272-30PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	48 ns	Yes		72	CMOS			5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0						No
XC95108F-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC7272A-20PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	32 ns	Yes	5.5 V	72	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 42 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells	e0	50 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	42
XC7336-7PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC9572-10PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572F-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic	7.5 ns	Yes		72	CMOS				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No				1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		Yes

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.