No Lead Programmable Logic Devices (PLD) 472

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC2C64A-7QFG48I	Xilinx	Flash PLD	Industrial	No Lead	48	VQCCN	Square		7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Chip Carrier, Very Thin Profile	LCC48,.27SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 37 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	7 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		260 °C (500 °F)	7 mm	Yes	37
XC2C64A-7QFG48C	Xilinx	Flash PLD	Commercial	No Lead	48	VQCCN	Square		7.5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Chip Carrier, Very Thin Profile	LCC48,.27SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 37 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	7 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		260 °C (500 °F)	7 mm	Yes	37
XC2C32A-6QFG32I	Xilinx	Flash PLD	Industrial	No Lead	32	SON	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Small Outline	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	21 I/O		-40 °C (-40 °F)	Matte Tin	Dual	S-PDSO-N32	3	1 mm	5 mm	No	Real Digital Design Technology	e3	300 MHz	30 s		260 °C (500 °F)	5 mm	Yes	21
XC2C64A-5QFG48C	Xilinx	Flash PLD	Commercial	No Lead	48	VQCCN	Square		5 ns	Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Chip Carrier, Very Thin Profile	LCC48,.27SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 37 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	7 mm	No	Real Digital Design Technology	e3	333 MHz	30 s		260 °C (500 °F)	7 mm	Yes	37
SLG46826V	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	19			13	PLA-TYPE	2.5			Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		Yes	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Quad	R-XQCC-N20	1	.6 mm	2 mm						15		3 mm	No	13
XC2C32A-6QFG32C	Xilinx	Flash PLD	Commercial	No Lead	32	SON	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Small Outline	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	21 I/O		0 °C (32 °F)	Matte Tin	Dual	S-PDSO-N32	3	1 mm	5 mm	No	Real Digital Design Technology	e3	300 MHz	30 s		260 °C (500 °F)	5 mm	Yes	21
SLG46826VTR	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	19			13	PLA-TYPE	2.5	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		Yes	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						15		3 mm	No	13
PAL16R4AMFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.03 mm	8.89 mm	No		e0	25 MHz		8		8.89 mm	No	4
SLG46110V	Renesas Electronics	OT PLD		No Lead	12	VQCCN	Square			Yes	1.89 V	7			8	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC12,.06SQ,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 7 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N12	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				7		1.6 mm	No	7
SLG46120V	Renesas Electronics	OT PLD		No Lead	12	VQCCN	Square			Yes	1.89 V	12			10	PLA-TYPE	1.8			Chip Carrier	LCC12,.06SQ,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 9 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N12	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				9		1.6 mm	No	9
SLG46121V	Renesas Electronics	OT PLD		No Lead	12	VQCCN	Square			Yes	1.89 V	12			9	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC12,.06SQ,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N12	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				8		1.6 mm	No	8
SLG46855VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	5.5 V	15			11	PLA-TYPE	2.5	Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 10 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14		.6 mm	1.6 mm						11		2 mm	No	11
SLG47004V	Renesas Electronics	OT PLD		No Lead	24	VQCCN	Square			Yes	5.5 V	20			8	PLA-TYPE	2.5			Chip Carrier, Very Thin Profile	LCC24,.12SQ,16		Yes	Macrocell	2.4 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 7 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N24	1	.6 mm	3 mm						7		3 mm	No	7
SLG46855V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	5.5 V	15			11	PLA-TYPE	2.5			Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 10 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm						11		2 mm	No	11
SLG46534V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	19			12	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC14,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				11		2.2 mm	No	11
SLG46534VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	19			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				11		2.2 mm	No	11
5962-89839142A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20				No		e0							8
5962-89841113A	Defense Logistics Agency	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28				No		e0	50 MHz						10
SLG46538V	Renesas Electronics	OT PLD		No Lead	20	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		3 mm	No	16
SLG46880-AP	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12		AEC-Q100	20		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		No	Macrocell	2.3 V		.5 mm	125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Quad	S-XQCC-N32		.8 mm	5 mm						20		5 mm	No	12
SLG46880V	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12			18	PLA-TYPE	2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
SLG46880VTR	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12			18	PLA-TYPE	2.5	Box, Tape and Reel, 13 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
5962-89839022A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.54 mm	8.89 mm	No	1 External Clock; Register Preload	e0	33.3 MHz				8.89 mm		8
ATF22V10C-10NM/883	Microchip Technology	Flash PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 10 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.54 mm	11.4554 mm	No			90 MHz		10		11.455 mm		10
SLG46538M	Renesas Electronics	OT PLD		No Lead	22	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC22,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N22		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		2.2 mm	No	16
SLG46580V	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	15			9	PLA-TYPE	3.3			Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						8		3 mm	No	8
SLG46580VTR	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	15			9	PLA-TYPE	3.3	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						8		3 mm	No	8
SLG46108V	Renesas Electronics	OT PLD		No Lead	8	VQCCN	Rectangular			Yes	1.89 V	7			6	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC8,.039X.047,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 5 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N8	1	.6 mm	1 mm		Can also operate at 3.3 V or 5 V supply				5		1.2 mm	No	5
SLG46140V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	8			12	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46140VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	8			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46538MTR	Renesas Electronics	OT PLD		No Lead	22	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8	Tape and Reel, 7 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC22,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N22		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		2.2 mm	No	16
5962-89841063A	Defense Logistics Agency	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28		1.9812 mm	11.43 mm	Yes		e0	76.9 MHz				11.43 mm		10
ISPLSI1024-60LJI	Lattice Semiconductor	EE PLD	Industrial	No Lead	68	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	96	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-N68	3	4.57 mm	24.2316 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	24.2316 mm	No	48
5962-89839032A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.54 mm	8.89 mm	No	1 External Clock; Register Preload	e0	41.6 MHz				8.89 mm		8
ISPGAL22V10AC-5LN	Lattice Semiconductor	EE PLD		No Lead	32	HVQCCN	Square		5 ns	Yes	1.95 V		CMOS		22	PAL-TYPE	1.8		1.8 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32(UNSPEC)	Programmable Logic Devices		Macrocell	1.65 V	132	.5 mm		11 Dedicated Inputs, 10 I/O	11		Tin Lead	Quad	S-XQCC-N32	1	1 mm	5 mm	No		e0	143 MHz		10	240 °C (464 °F)	5 mm		10
ISPLSI1024-60LJ	Lattice Semiconductor	EE PLD	Commercial	No Lead	68	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	96	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-N68	3	4.57 mm	24.2316 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	24.2316 mm	No	48
TIBPAL20R6-10MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No	Register Preload; Power-Up Reset		50 MHz		8		11.43 mm		2
TIBPAL16R8-7MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL		8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No	Power-Up Reset; Register Preload		74 MHz		8		8.89 mm		0
TIBPALR19L8MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No					8		11.43 mm		6
5962-85155222A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			74 MHz		8		8.89 mm		4
TIBPAL20L10-25MFKB	Texas Instruments	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	25 ns	Yes			TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		40	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No					10
TIBPALT19R6MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes			TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No					8
TIBPAL16R8-20MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		TTL		8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No	Power-Up Reset		41.6 MHz		8		8.89 mm		0
5962-87671193X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Chip Carrier				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			74 MHz						0
TIBPAL16L8-15MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			50 MHz		8		8.89 mm		6
5962-85155082X	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5			Chip Carrier			No	Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20				Yes			25 MHz		4			No	4
5962-85155212A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883	8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			74 MHz		8		8.89 mm		0
TIBPAL16R6-30MFHB	Texas Instruments	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic		Yes			TTL	38535Q/M;38534H;883B	10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N20				No					6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.