Through-Hole Programmable Logic Devices (PLD) 1,819

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL16V8-20LJM	Texas Instruments	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
TIBPAL20R4-20MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No		e0	40 MHz	8	32.005 mm	No	4
8412904LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		MIL-STD-883 Class B			5			In-Line				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			Yes			28.5 MHz				4
TIBPAL16R8-12CJ	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.25 V	TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	Power-Up Reset		62 MHz	8	24.195 mm		0
5962-8515501RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5			In-Line			No	Combinatorial	4.5 V			125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20			Yes				8		No	6
TICPAL22V10Z-35JT	Texas Instruments		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	45 ns	No		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No			20 MHz	10
TIBPAL20R8-7MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		74 MHz	8	32.005 mm		0
TIBPAL16R8-25CJ	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V	TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	Power-Up Reset		30 MHz	8	24.195 mm		0
TIBPALT19R4CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 4 I/O	0	0 °C (32 °F)		Dual	R-PDIP-T24			No	1 External Clock; Register Preload		30 MHz	8			4
SN54PL16R8-1J	Texas Instruments	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic		No		TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No			35 MHz	8
5962-8605301LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-STD-883			5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			22 MHz				10
TIBPAL20X4CJT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No			35 MHz	10
TIFPLA839CJT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V	TTL		14	PLA-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	32	2.54 mm	70 °C (158 °F)	14 Dedicated Inputs, 0 I/O	14	0 °C (32 °F)		Dual	R-GDIP-T24			No				6			0
TIBPAL20R8-10MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			50 MHz	8	32.005 mm		0
5962-8515509RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL	MIL-STD-883			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20			No							6
TICPAL16R6-55CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V	CMOS		16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20			No	Register Preload		16 MHz	6			2
SN54LS336J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
SN74LS336NP1	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No				6
TIBPAL20X8-25MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	40	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 2 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	Power-Up Reset; 1 External Clock; Register Preload		25 MHz	10			2
PAL16R6AMJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	38535Q/M;38534H;883B	10	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	25 MHz	6	24.195 mm	No	2
EP910PC-30	Texas Instruments	OT PLD	Commercial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	33 ns	No	5.25 V	CMOS		36	PAL-TYPE	5		5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.75 V	240	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T40			No	24 Macrocell; Configurable I/O		33.3 MHz	24			24
5962-8515514RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-STD-883	8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			48 MHz	8			0
TIBPSG507AMJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		13	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				80	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			33 MHz	8
TIBPAL20L8-25CNT3	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24							8
TIBPAL16R8-12MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	Power-Up Reset; Register Preload		48 MHz	8	24.195 mm		0
PAL16L8A-2MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	16 MHz	8	24.195 mm	No	6
JM38510/50607BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			25 MHz				2
8412901LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24			Yes							6
8412906LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.5 V	TTL				5			In-Line				Mixed	4.5 V		2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 2 I/O	10	-55 °C (-67 °F)		Dual	R-PDIP-T24	4.064 mm	7.62 mm				15.4 MHz		30.378 mm		2
TIBPAL16R4-10MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.5 V	TTL		12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	Power-Up Reset; Register Preload		52.5 MHz	8	24.195 mm		4
SNC54LS336J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	MIL-STD-883 Class B (Modified)	12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
SNJ54LS334J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
8103614RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	Yes			16 MHz	8			4
TIBPAL20R4-25CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-GDIP-T24			No	Register Preload; Power-Up Reset		25 MHz	8			4
TIBPALT19R8CJW	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V	TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 0 I/O	0	0 °C (32 °F)		Dual	R-GDIP-T24			No	1 External Clock; Register Preload		30 MHz	8			0
82S105ACN3	Texas Instruments	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No		TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T28						12.5 MHz	8
TIBPAL20L10CNT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No				10
5962-8515508RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5			In-Line			No	Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20			Yes	Power-Up Reset		25 MHz	4		No	4
TIB82S167BCNT3	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		TTL		14	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24						30 MHz	6
PAL16R8ACJ	Texas Instruments	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No		TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T20			No			35 MHz	8
M38510/50804BLX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular		15 ns	No	5.5 V	CMOS	MIL-M-38510 Class B			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-XDIP-T24			No			50 MHz				10
PAL20L8AJM/883C	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		TTL	MIL-STD-883 Class C	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0		8
PAL20R6A-2CJW	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		14	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No			18 MHz	8
PAL20R4A-2CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18 MHz	8
EP630-25IJT	Texas Instruments	UV PLD	Industrial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			40 MHz	16	32.005 mm		16
TICPAL22V10Z-25NT	Texas Instruments		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			28.5 MHz	10
JM38510/50504BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	1 External Clock; Register Preload	e0	40 MHz		32.005 mm		4
SN74PL16R8-2N	Texas Instruments	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No		TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T20			No			25 MHz	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.