Commercial Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

GAL39V18-35QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

CMOS

20

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

75

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

29 MHz

10

GAL6001S-35HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

40 ns

No

CMOS

20

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

75

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

22.9 MHz

10

GAL16V8S-20QC1

STMicroelectronics

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

33.3 MHz

8

GAL16V8-20QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

33.3 MHz

8

GAL16V8-25QD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

28.5 MHz

8

GAL16V8-25HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

28.5 MHz

8

GAL16V8-15HD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

15 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

41.6 MHz

8

GAL20V8AS-15HC1J

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

11.5062 mm

8

GAL20V8AS-20HC1J

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

11.5062 mm

8

GAL20V8S-15EB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

41.6 MHz

8

GAL16V8S-20HC1

STMicroelectronics

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

33.3 MHz

8

GAL39V18-15HF1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

15 ns

No

CMOS

20

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

75

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

67 MHz

10

GAL39V18-30HZ1

STMicroelectronics

EE PLD

Commercial

No Lead

QCCN

Ceramic

30 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LCC(UNSPEC)

Programmable Logic Devices

75

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

33 MHz

10

GAL20V8-20HF1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

33.3 MHz

8

PZ3128AS7BE-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

95 MHz

20 mm

96

PZ5064C10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

64 Macrocells

77 MHz

16.5862 mm

32

PZ3128AS12BE

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

63 MHz

20 mm

96

PZ5128-S10BB2-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

71 MHz

28 mm

96

PZ5128-S10BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

71 MHz

14 mm

80

PZ3064AS7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

111 MHz

16.5862 mm

32

PZ3064A7BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

105 MHz

14 mm

64

PZ5032-7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

80 MHz

10 mm

32

PZ3064-12A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

67 MHz

16.5862 mm

32

PZ3064-12A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

67 MHz

29.3116 mm

64

PZ3064-10BC-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

80 MHz

10 mm

32

PZ5128CS10BP-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

71 MHz

14 mm

80

PZ5064-7A68-T

NXP Semiconductors

EE PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 48 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

105 MHz

24.2316 mm

48

PZ5032CS6A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

111 MHz

16.5862 mm

32

PZ5064CS7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

64 Macrocells

105 MHz

16.5862 mm

32

PZ3128AS12BE-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

63 MHz

20 mm

96

PZ5128-S12BB1-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

63 MHz

20 mm

80

PZ5064-7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

105 MHz

16.5862 mm

32

PZ3128-S12A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

66 MHz

29.3116 mm

64

PZ3032CS8BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

91 MHz

10 mm

32

PZ5032-10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

59 MHz

16.5862 mm

32

PZ3128-S15BB2-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

59 MHz

28 mm

96

P5Z22V10-DDH-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

83 MHz

7.8 mm

10

PZ5064C10BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

77 MHz

14 mm

64

PZ3064-12BB

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.63 V

CMOS

3.3

Flatpack

Macrocell

2.97 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

67 MHz

20 mm

64

PZ3032AS6A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

111 MHz

16.5862 mm

32

PZ5032-10BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

PZ3128-S15BB1-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

59 MHz

20 mm

80

PZ5128-S10BB2

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

71 MHz

28 mm

96

PZ5064-10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

77 MHz

16.5862 mm

32

PZ3064A7BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

105 MHz

10 mm

32

P3Z22V10-BD

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

69 MHz

15.4 mm

10

PZ5128-S7BB1-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

87 MHz

20 mm

80

PZ5064-10BB1-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

77 MHz

20 mm

64

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.