Commercial Extended Programmable Logic Devices (PLD) 580

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL22V10D-10LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	83.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
EPM240T100C5	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS		80		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
GAL22V10D-15LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz	30 s	10	260 °C (500 °F)	31.75 mm		10
GAL22V10D-15QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	10	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz		10		31.75 mm	No	10
GAL22V10D-7LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	111 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
EPM240T100C3	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4.7 ns	Yes	2.625 V	192	CMOS		80		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
GAL22V10D-10QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	83.3 MHz		10		31.75 mm		10
GAL22V10D-15LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	55.5 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
PALCE22V10-10JC	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5316 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	76.9 MHz		10		11.5316 mm		10
GAL22V10D-5LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	142.8 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
GAL22V10D-25QJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	33.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
GAL22V10D-25LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	33.3 MHz		10		31.75 mm		10
EPM570F256C3	Intel	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns	Yes	2.625 V	440	CMOS		160		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			160		17 mm	Yes	160
TICPAL22V10Z-25CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock	e4	31.2 MHz		10		31.64 mm		10
GAL22V10D-4LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	167 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
EPM2210F324C5	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns	Yes	2.625 V	1700	CMOS		272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
PML2552-35KA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V		CMOS				5		Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-CQCC-J68		4.83 mm	24.065 mm	No			50 MHz				24.065 mm		24
EPM240T100C4	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6.1 ns	Yes	2.625 V	192	CMOS		80		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
GAL22V10D-25QJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells; Shared Input/Clock	e0	33.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
PALCE22V10-10JCR	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V			75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28				No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		76.9 MHz						10
PALCE22V10-10JCT	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.572 mm	11.5316 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		76.9 MHz				11.5316 mm		10
TIBPAL16L8-25CN	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T20		5.08 mm	7.62 mm	No		e4	30 MHz		8		25.4 mm		6
EPM1270T144C5	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS		116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM2210F324C3	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	7 ns	Yes	2.625 V	1700	CMOS		272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM2210F324C4	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns	Yes	2.625 V	1700	CMOS		272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM240GT100C5	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.89 V	192	CMOS		80		1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0			80		14 mm	Yes	80
EPM1270T144C3	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6.2 ns	Yes	2.625 V	980	CMOS		116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM1270T144C4	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns	Yes	2.625 V	980	CMOS		116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
GAL20V8C-10LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	58.8 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
TIBPAL16L8-25CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQCC-J20	3	4.57 mm	8.965 mm	No		e4	30 MHz	30 s	8	245 °C (473 °F)	8.965 mm		6
GAL20V8C-10LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL22V10D-25QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	33.3 MHz		10		31.75 mm		10
EPM570T100C5	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS		76		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			76		14 mm	Yes	76
GAL26CLV12D-5LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V		CMOS		26	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	122	1.27 mm	75 °C (167 °F)	13 Dedicated Inputs, 12 I/O	13	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.57 mm	11.5062 mm	No	Programmable Output Polarity	e0	143 MHz	30 s	12	225 °C (437 °F)	11.5062 mm		12
GAL22V10D-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	33.3 MHz	30 s	10	225 °C (437 °F)	31.75 mm		10
GAL20V8B-25QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL20V8B-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	45.5 MHz		8		31.75 mm		8
GAL18V10B-20LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	96	2.54 mm	75 °C (167 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20	1	4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	41.6 MHz		10		26.125 mm		10
GAL20V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
PLS100N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	50 ns	No	5.25 V		TTL		16	PLA-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices		Combinatorial	4.75 V	48	2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28				No	Tri-State Output				8				0
GAL20VP8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	40 MHz		8		31.855 mm		8
GAL22V10D-10QJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
GAL22V10D-10QJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	83.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
GAL22V10D-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	55.5 MHz		10		31.75 mm		10
PALCE16V8H-25PC/4	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		4.953 mm	7.62 mm	No		e0	37 MHz		8		26.1366 mm		8
GAL16V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		26.125 mm		8
GAL20V8B-15LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	45.5 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8B-25LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	37 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.