132 Programmable Logic Devices (PLD) 31

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
LCMXO2-640HC-4MG132C	Lattice Semiconductor	Flash PLD	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	7.24 ns		Yes	3.462 V				79		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also operates at 3.3 V nominal supply	e1		30 s	79	250 °C (482 °F)	8 mm		80
XC2C256-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 106 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XC2C256-7CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	300 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XC2C128-7CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	119 MHz	30 s	100	260 °C (500 °F)	8 mm	Yes	100
XC2C128-6CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	152 MHz	30 s	100	260 °C (500 °F)	8 mm	Yes	100
LC4128ZC-75MN132I	Lattice Semiconductor	EE PLD		Ball	132	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128			100	PAD-TYPE	1.8		1.8 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 96 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	111 MHz	40 s	96	260 °C (500 °F)	8 mm	Yes	96
XC2C128-7CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	119 MHz	30 s	100	240 °C (464 °F)	8 mm	Yes	100
LC4128ZC-75MN132C	Lattice Semiconductor	EE PLD		Ball	132	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128			100	PAD-TYPE	1.8		1.8 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 96 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	111 MHz	40 s	96	260 °C (500 °F)	8 mm	Yes	96
XC2C256-6CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XC2C256-7CP132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 106 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	106	240 °C (464 °F)	8 mm	Yes	106
XC2C128-7CPGG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B132		1.1 mm	8 mm	No		e3	119 MHz		100		8 mm		100
XC2C256-5CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	5 ns		Yes	1.9 V	256	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1		30 s		260 °C (500 °F)	8 mm	Yes	106
XC2C128-4CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	4.5 ns		Yes	1.9 V	128	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0		30 s		240 °C (464 °F)	8 mm	Yes	100
XC2C256-7CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	106	240 °C (464 °F)	8 mm	Yes	106
XC2C256-6CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0	139 MHz	30 s	106	240 °C (464 °F)	8 mm	Yes	106
XC2C128-7CPGG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B132		1.1 mm	8 mm	No		e3	119 MHz		100		8 mm		100
XC2C256-5CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	5 ns		Yes	1.9 V	256	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	8 mm	Yes	106
XC2C128-4CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	4.5 ns		Yes	1.9 V	128	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1		30 s		260 °C (500 °F)	8 mm	Yes	100
XC2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	119 MHz	30 s	100	260 °C (500 °F)	8 mm	Yes	100
XC2C128-6CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	152 MHz	30 s	100	240 °C (464 °F)	8 mm	Yes	100
XA2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XA2C128-8CPG132Q	Xilinx	Flash PLD	Automotive	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS	AEC-Q100			1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XC2C128-7CP132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	119 MHz	30 s	100	240 °C (464 °F)	8 mm	Yes	100
EPX780QC132-15Z	Altera	OT PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	18 ns	80	Yes	5.25 V		CMOS		104		5		5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz		104	220 °C (428 °F)	24.13 mm		80
EPX780QI132-15	Altera	OT PLD	Industrial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	15 ns	80	Yes	5.5 V		CMOS		104		5		5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		.635 mm	85 °C (185 °F)	22 Dedicated Inputs, 80 I/O	22	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	58.8 MHz		104	220 °C (428 °F)	24.13 mm		80
EPX780QC132-15	Altera	OT PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	18 ns	80	Yes	5.25 V		CMOS		104		5		5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz		104	220 °C (428 °F)	24.13 mm		80
EPX780QC132-10Z	Altera	OT PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	12 ns	80	Yes	5.25 V		CMOS		104		5		5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	71.4 MHz		104	220 °C (428 °F)	24.13 mm		80
EPX780QC132-10	Altera	OT PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	12 ns	80	Yes	5.25 V		CMOS		104		5		5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	71.4 MHz		104	220 °C (428 °F)	24.13 mm		80
EPX880QC132-10	Altera	Flash PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	10 ns	80	Yes	5.25 V		CMOS		104		5		3.3/5,5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	95.2 MHz	30 s	104	220 °C (428 °F)	24.13 mm		80
EPX880QI132-12	Altera	Flash PLD	Industrial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	12 ns	80	Yes	5.25 V		CMOS		104		5		3.3/5,5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	85 °C (185 °F)	22 Dedicated Inputs, 80 I/O	22	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	80 MHz		104	220 °C (428 °F)	24.13 mm		80
EPX780QC132-12	Altera	OT PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	15 ns	80	Yes	5.25 V		CMOS		104		5		5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	58.8 MHz		104	220 °C (428 °F)	24.13 mm		80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.