Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
CMOS |
AEC-Q100 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Real digital design technology, XILIK00255-1 |
e3 |
141 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
118 |
|||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
384 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
118 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
384 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
118 |
|||||||||||
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
2.62 V |
288 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
100 MHz |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
117 |
||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
119 MHz |
20 mm |
Yes |
108 |
|||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
128 |
CMOS |
100 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
152 MHz |
100 |
20 mm |
Yes |
100 |
||||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
144 |
BGA |
Square |
Plastic/Epoxy |
15.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
30 s |
260 °C (500 °F) |
12 mm |
117 |
||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
384 |
CMOS |
118 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
112 MHz |
118 |
20 mm |
Yes |
118 |
||||||||
Xilinx |
UV PLD |
Commercial |
Pin/Peg |
144 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
No |
5.25 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Window |
PGA144,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 78 I/O |
12 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P144 |
1 |
3.683 mm |
39.624 mm |
No |
108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops |
55.6 MHz |
39.624 mm |
No |
78 |
|||||||||||||
|
Xilinx |
EE PLD |
Commercial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
119 MHz |
30 s |
260 °C (500 °F) |
12 mm |
Yes |
108 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
1.9 V |
128 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
100 |
||||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
384 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
118 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
144 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
222.2 MHz |
30 s |
260 °C (500 °F) |
12 mm |
Yes |
117 |
|||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
175 MHz |
20 mm |
Yes |
108 |
|||||||||||
|
Xilinx |
EE PLD |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
20 mm |
108 |
|||||||||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
119 MHz |
20 mm |
Yes |
108 |
|||||||||||
Xilinx |
Flash PLD |
Industrial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
2.62 V |
144 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
125 MHz |
30 s |
240 °C (464 °F) |
12 mm |
Yes |
117 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.62 V |
2.5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
2.37 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
117 |
|||||||||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
384 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
83 MHz |
20 mm |
Yes |
118 |
|||||||||||
Xilinx |
UV PLD |
Industrial |
Pin/Peg |
144 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
36 ns |
No |
5.5 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Window |
PGA144,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 78 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P144 |
3.683 mm |
39.624 mm |
No |
108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops |
e0 |
45.5 MHz |
39.624 mm |
No |
78 |
||||||||||||
|
Xilinx |
EE PLD |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
120 |
|||||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.6 V |
2.5 |
Grid Array, Thin Profile, Fine Pitch |
Registered |
2.4 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
12 mm |
117 |
|||||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
144 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
222.2 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
117 |
|||||||||
Xilinx |
EE PLD |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
95 MHz |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
108 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
144 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
222.2 MHz |
30 s |
240 °C (464 °F) |
12 mm |
Yes |
117 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
144 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
222.2 MHz |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
117 |
||||||||||
Xilinx |
UV PLD |
Commercial |
Pin/Peg |
144 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
5.25 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Window |
PGA144,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 78 I/O |
12 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P144 |
1 |
3.683 mm |
39.624 mm |
No |
108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops |
35.7 MHz |
39.624 mm |
No |
78 |
|||||||||||||
Xilinx |
EE PLD |
Industrial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
119 MHz |
30 s |
240 °C (464 °F) |
12 mm |
Yes |
108 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
2.62 V |
288 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
208 MHz |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
117 |
||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.6 V |
2.5 |
Grid Array, Thin Profile, Fine Pitch |
Registered |
2.4 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
12 mm |
117 |
|||||||||||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
154 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
120 |
|||||||||
Xilinx |
UV PLD |
Commercial |
Pin/Peg |
144 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
36 ns |
No |
5.25 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Window |
PGA144,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 78 I/O |
12 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P144 |
1 |
3.683 mm |
39.624 mm |
No |
108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops |
45.5 MHz |
39.624 mm |
No |
78 |
|||||||||||||
Xilinx |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
320 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 3 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
111 MHz |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
3 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.62 V |
144 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
117 |
|||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
2.62 V |
288 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
125 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
117 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
144 |
CMOS |
AEC-Q100 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
30 s |
260 °C (500 °F) |
12 mm |
Yes |
117 |
|||||||||
|
Xilinx |
EE PLD |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Nickel/Palladium/Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
20 mm |
120 |
|||||||||||||||||||
Xilinx |
EE PLD |
Commercial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
95 MHz |
30 s |
240 °C (464 °F) |
12 mm |
Yes |
108 |
||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
154 MHz |
20 mm |
Yes |
120 |
|||||||||||
|
Xilinx |
EE PLD |
Automotive |
Gull Wing |
144 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Macrocell |
3 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
164 |
|||||||||||||||||||
Xilinx |
Flash PLD |
Commercial |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
144 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
138.88 MHz |
30 s |
117 |
240 °C (464 °F) |
12 mm |
Yes |
117 |
||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
1.9 V |
128 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
30 s |
225 °C (437 °F) |
20 mm |
Yes |
100 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
116.3 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
120 |
||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
37.5 MHz |
20 s |
102 |
220 °C (428 °F) |
20 mm |
102 |
|||||||||||
Altera |
Loadable PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4160 |
Yes |
2.625 V |
CMOS |
95 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
2.375 V |
.5 mm |
4 Dedicated Inputs, 101 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
95 |
220 °C (428 °F) |
20 mm |
101 |
||||||||||||||||
|
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 117 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can Also Be Used 24000 Logic Gates |
e3 |
133 MHz |
20 mm |
117 |
||||||||||||||||||
Altera |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
3.56 ns |
2560 |
Yes |
1.89 V |
CMOS |
84 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 92 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
160 MHz |
20 s |
84 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||
|
Altera |
Loadable PLD |
Other |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
2.02 ns |
Yes |
1.89 V |
CMOS |
1.8 |
Grid Array, Low Profile |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 93 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
1.7 mm |
13 mm |
No |
e1 |
160 MHz |
13 mm |
93 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.