32 Programmable Logic Devices (PLD) 11

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC2C32A-6QFG32I	Xilinx	Flash PLD	Industrial	No Lead	32	SON	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Small Outline	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	21 I/O		-40 °C (-40 °F)	Matte Tin	Dual	S-PDSO-N32	3	1 mm	5 mm	No	Real Digital Design Technology	e3	300 MHz	30 s		260 °C (500 °F)	5 mm	Yes	21
XC2C32A-6QFG32C	Xilinx	Flash PLD	Commercial	No Lead	32	SON	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Small Outline	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	21 I/O		0 °C (32 °F)	Matte Tin	Dual	S-PDSO-N32	3	1 mm	5 mm	No	Real Digital Design Technology	e3	300 MHz	30 s		260 °C (500 °F)	5 mm	Yes	21
SLG46880-AP	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12		AEC-Q100	20		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		No	Macrocell	2.3 V		.5 mm	125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Quad	S-XQCC-N32		.8 mm	5 mm						20		5 mm	No	12
SLG46880V	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12			18	PLA-TYPE	2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
SLG46880VTR	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12			18	PLA-TYPE	2.5	Box, Tape and Reel, 13 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
ISPGAL22V10AC-5LN	Lattice Semiconductor	EE PLD		No Lead	32	HVQCCN	Square		5 ns	Yes	1.95 V		CMOS		22	PAL-TYPE	1.8		1.8 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32(UNSPEC)	Programmable Logic Devices		Macrocell	1.65 V	132	.5 mm		11 Dedicated Inputs, 10 I/O	11		Tin Lead	Quad	S-XQCC-N32	1	1 mm	5 mm	No		e0	143 MHz		10	240 °C (464 °F)	5 mm		10
XC2C32A-4QFG32C	Xilinx	Flash PLD	Commercial	No Lead	32	SON	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Small Outline	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	21 I/O		0 °C (32 °F)	Matte Tin	Dual	S-PDSO-N32	3	1 mm	5 mm	No	Real Digital Design Technology	e3	450 MHz	30 s		260 °C (500 °F)	5 mm	Yes	21
XC2C32A-3QFG32C	Xilinx	Flash PLD	Commercial	No Lead	32	SON	Square	Plastic/Epoxy	3 ns	Yes	1.9 V		CMOS				1.8			Small Outline				Macrocell	1.7 V			70 °C (158 °F)	21 I/O		0 °C (32 °F)	Matte Tin	Dual	S-PDSO-N32	3			No		e3	500 MHz						21
SLG46881V	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12			18	PLA-TYPE	2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
SLG46881VTR	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12			18	PLA-TYPE	2.5	Box, Tape and Reel, 13 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.16SQ,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	2 Dedicated Inputs, 12 I/O	2	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	.6 mm	4 mm						20		4 mm	No	12
SLG46880-APTR	Renesas Electronics	OT PLD		No Lead	32	HVQCCN	Square			Yes	5.5 V	12		AEC-Q100	20		2.5	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		No	Macrocell	2.3 V		.5 mm	125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Quad	S-XQCC-N32		.8 mm	5 mm						20		5 mm	No	12

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.