356 Programmable Logic Devices (PLD) 294

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K100EBC356-1XN

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.73 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPF10K50SBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

12.5 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EP20K200BC356-1V

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

0.3 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 279 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

100 MHz

271

220 °C (428 °F)

35 mm

279

EP20K200BC356-1X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

271

220 °C (428 °F)

35 mm

277

EP20K100BC356-2N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

246

260 °C (500 °F)

35 mm

252

EPF10K200SBI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K30BI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

17.2 ns

Yes

5.5 V

CMOS

5

Grid Array, Low Profile

Registered

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPF10K200SBC356-2N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPF10K130EBC356-2X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EPF10K30ABI356-1

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

11 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EP20K100EBC356-2

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

238

220 °C (428 °F)

35 mm

246

EP20K200EBC356-1X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.58 ns

8320

Yes

1.89 V

CMOS

263

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

263

220 °C (428 °F)

35 mm

271

EPF10K50EBI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

10 ns

2880

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 220 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

220

220 °C (428 °F)

35 mm

220

EP20K60EBC356-3N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

35 mm

196

EPF10K50SBI356-2X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

9.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

220

EPF10K30BC356-5

Altera

Loadable PLD

Commercial

Ball

356

HLBGA

Square

Plastic/Epoxy

27 ns

Yes

5.25 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

35 mm

EP20K200BC356-3

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.6 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

271

220 °C (428 °F)

35 mm

277

EPF10K30BM356-4

Altera

Loadable PLD

Military

Ball

356

HLBGA

Square

Plastic/Epoxy

23.8 ns

Yes

5.5 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

60.6 MHz

35 mm

EP20K200EBI356-1

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

263

2.5

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 271 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

263

220 °C (428 °F)

35 mm

271

EPF10K130EBI356-3X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K200EBC356ES

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K200BI356-1X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 277 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

271

220 °C (428 °F)

35 mm

277

EP20K100BC356-1X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.5 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

246

220 °C (428 °F)

35 mm

252

EPF10K50VBC356-4

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K100EBI356-3X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K200BI356-2X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 277 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

271

220 °C (428 °F)

35 mm

277

EPF10K100EBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPM9560ABC356-15

Altera

EE PLD

Commercial

Ball

356

HLBGA

Square

Plastic/Epoxy

16.6 ns

Yes

5.25 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 212 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

560 Macrocells

e1

220 °C (428 °F)

35 mm

212

EPF10K50SBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

220

EP20K200EBC356-2XN

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.97 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EPF10K130EBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EPF10K130EBI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K200CB356C7N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.7 mm

35 mm

No

e1

35 mm

271

EPF10K130EBC356-3X

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EP20K200EBC356-3N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

271

EP20K60EBC356-3X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

220 °C (428 °F)

35 mm

196

EPF10K30ABI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

13 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPF10K50VBC356-1N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

274

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e1

30 s

274

260 °C (500 °F)

35 mm

274

EPF10K50VBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

3.6 V

CMOS

310

3.3

3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

310

220 °C (428 °F)

35 mm

274

EPF10K100ABI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.8 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K60EBC356-1N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.72 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

35 mm

196

EPF10K30BI356-4

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

21.1 ns

1728

Yes

5.5 V

CMOS

246

5

3.3/5,5 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

62.89 MHz

246

220 °C (428 °F)

35 mm

246

EP20K100EBC356-3X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

2.2 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

220 °C (428 °F)

35 mm

246

EP20K160EBC356-2N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.93 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

160 MHz

35 mm

271

EP20K200CB356C8N

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

1.78 ns

Yes

1.89 V

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 271 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.7 mm

35 mm

No

e1

35 mm

271

EP20K200BC356-2X

Altera

Loadable PLD

Other

Ball

356

LBGA

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 277 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

271

220 °C (428 °F)

35 mm

277

EPF10K100EBC356-2

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EP20K100EBI356-2X

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

238

220 °C (428 °F)

35 mm

246

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.