484 Programmable Logic Devices (PLD) 338

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF10K100EFC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V	CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	338	220 °C (428 °F)	23 mm	338
EP20K100EFI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell				4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3			No		e0				220 °C (428 °F)		246
EPF10K200SFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	369	220 °C (428 °F)	23 mm	369
EP20K200CFC484-9	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	376
EPF10K30AFC484-1N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz	40 s		260 °C (500 °F)	23 mm	246
EP20K200FC484-1X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V	CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	376	220 °C (428 °F)	23 mm	382
EP20K200FC484-1XV	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm	382
EP1M120F484C8AES	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	303 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e0					23 mm	303
EPF10K50EBC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 254 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						254
EP20K200FC484-2N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V	CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		30 s	376	260 °C (500 °F)	23 mm	382
EPXA1F484C3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0				220 °C (428 °F)	23 mm	186
EP1K30FI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	171
EPF10K130EFI484-2X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	369
EPF10K130EFI484-1X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	369
EP20K200EBC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes				1.8		Grid Array			Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						376
EP20K200FC484-1XN	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V	CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		30 s	376	260 °C (500 °F)	23 mm	382
EPF10K100EFC484-1N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V	CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	338	260 °C (500 °F)	23 mm	338
EPF10K30AFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz	40 s		260 °C (500 °F)	23 mm	246
EP20K160EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.55 ns	6400	Yes	1.89 V	CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	308	220 °C (428 °F)	23 mm	316
EPF10K100EFI484-3X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	338
EP1M120F484C6	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy		4800	Yes	1.89 V	CMOS	303	1.8	1.5/3.3,1.8 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	303	220 °C (428 °F)	23 mm	303
EP1M120FI484-7	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 303 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	303
EPF10K100EFI484-2X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	338
EPF10K130EBC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						369
EPF10K30EFC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,50	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm	220
EPF10K130EFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	369	260 °C (500 °F)	23 mm	369
EPF10K200SFC484-1X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V	CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	369	220 °C (428 °F)	23 mm	369
EPF10K50EFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	2880 Logic Elements	e0	140 MHz	20 s	254	220 °C (428 °F)	23 mm	254
EPF10K50VFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	14 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 291 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	291
EP20K160EFC484-3X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm	316
EPF10K30EFI484-2X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V	CMOS		2.5		Grid Array			Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	220
EPF10K130EBC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						369
EPF10K30AFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	3.6 V	CMOS		3.3		Grid Array			Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz	40 s		260 °C (500 °F)	23 mm	246
EP20K30EFC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm	128
EP1K50FI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	249 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	37.5 MHz		249	220 °C (428 °F)	23 mm	249
EPF10K30EFI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V	CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm	220
EPF10K50EFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8.5 ns	2880	Yes	2.7 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254	220 °C (428 °F)	23 mm	254
EPF10K130EBI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V			2.5		Grid Array			Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						369
EPF10K50SFC484-3X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V	CMOS		2.5		Grid Array			Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	254
EP20K30EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V			1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm	128
EPF10K100AFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	3.6 V	CMOS	369	3.3	2.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	4992 Logic Elements; 624 Labs	e1	80 MHz	30 s	369	260 °C (500 °F)	23 mm	369
EP20K100FC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	252
EP20K100BI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						252
EP1M120FC484-6	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V	CMOS		1.8		Grid Array			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm	303
EP20K200EFI484-1	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy		8320	Yes		CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell		1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1			368	220 °C (428 °F)		376
EP20K100FI484-1	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm	252
EP20K160EFC484-2X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V	CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	308	220 °C (428 °F)	23 mm	316
EP20K200BI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V			2.5		Grid Array			Macrocell	2.375 V			4 Dedicated Inputs, 382 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484				No		e1						382

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.