600 Programmable Logic Devices (PLD) 69

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K250ABC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

12160

Yes

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

45 mm

470

EPF10K130EBI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

16 ns

6656

Yes

2.7 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

424 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K130VBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

3.6 V

CMOS

470

3.3

3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K200SBI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

16 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K250EBI600-1

Altera

Loadable PLD

Industrial

Ball

600

HBGA

Square

Plastic/Epoxy

12160

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Heat Sink/Slug

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K130EBC600-3N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K250ABI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200SBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.8 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K200SBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K100ABC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e1

45 mm

406

EPF10K200EBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K250ABC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

12160

Yes

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

45 mm

470

EPF10K200EBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200EBI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

16 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K200EBC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.4 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K130EBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K130EBC600-1X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.3 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K250EBC600-2

Altera

Loadable PLD

Commercial

Ball

600

HBGA

Square

Plastic/Epoxy

12160

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Heat Sink/Slug

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K250EBC600-3

Altera

Loadable PLD

Commercial

Ball

600

HBGA

Square

Plastic/Epoxy

12160

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array, Heat Sink/Slug

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K130VBI600-4

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

24.2 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200SBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K130EBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K130EBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K100ABI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

17 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 406 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

406

EPF10K200SBI600-1X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200SBI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K250ABC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

12160

Yes

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

45 mm

470

EPF10K130EBC600-3X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K130EBI600-2X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

12 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

424 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K130EBC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.3 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K130EBC600-2X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

424

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

424

220 °C (428 °F)

45 mm

424

EPF10K200SBC600-1X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.3 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K200SBC600-3X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K100ABC600-1N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e1

45 mm

406

EPF10K200SBI600-3X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200SBI600-2

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

12 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K200EBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.8 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

9984 Logic Elements

e0

140 MHz

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K130EBI600-1X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

424 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K200SBC600-2X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K130VBI600-2

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K100ABC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

4992

Yes

3.6 V

CMOS

406

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

406

220 °C (428 °F)

45 mm

406

EPF10K130VBI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

19.1 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K130EBI600-3X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

424 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K200SBC600-3N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K130VBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

6656

Yes

3.6 V

CMOS

470

3.3

3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K250ABI600-3

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

20 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200EBI600-2

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

9984 Logic Elements

e0

140 MHz

20 s

470

220 °C (428 °F)

45 mm

470

EPF10K100ABI600-2

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

3.6 V

CMOS

406

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 406 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

406

220 °C (428 °F)

45 mm

406

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.