64 Programmable Logic Devices (PLD) 68

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC9572XL-10VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
5M80ZE64C5N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	54
5M160ZE64C5N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	118.3 MHz				7 mm	Yes	54
5M40ZE64C5N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz				7 mm		54
5M80ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V	.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	54
XC9572XL-10VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
5M160ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V	.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	118.3 MHz				7 mm	Yes	54
5M40ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	118.3 MHz				7 mm		54
5M40ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm		54
XC9572XL-10VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		36		10 mm	Yes	52
5M160ZE64A5N	Intel	Flash PLD	Industrial	Gull Wing	64	QFP	Square	Plastic	14 ns	Yes		128	CMOS	AEC-Q100			1.2/3.3,1.8 V	Flatpack	TQFP64,.35SQ,16	Programmable Logic Devices	Yes			.4 mm	105 °C (221 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G64				No								Yes
XC9536XL-10VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
XC9572XL-7VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	125 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
XC9572XL-7VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e0	125 MHz	30 s	36	240 °C (464 °F)	10 mm	Yes	52
5M80ZE64A5N	Intel	Flash PLD	Industrial	Gull Wing	64	QFP	Square	Plastic	14 ns	Yes		64	CMOS	AEC-Q100			1.8,1.2/3.3 V	Flatpack	TQFP64,.35SQ,16	Programmable Logic Devices	Yes			.4 mm	105 °C (221 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G64				No								Yes
5M40ZE64A5N	Intel	Flash PLD	Automotive	Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	1.89 V					1.8		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	125 °C (257 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm			e3					7 mm		54
XC9572XL-7VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	125 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
XC9536XL-7VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
XC9536XL-10VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
LC4032ZE-7MN64C	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	32	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm		4 Dedicated Inputs, 32 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	5 mm	Yes	32
5M160ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm	Yes	54
5M80ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm	Yes	54
LC4032ZE-7MN64I	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	32	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm		4 Dedicated Inputs, 32 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	5 mm	Yes	32
5M40ZM64I5N	Intel	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm		30
5M40ZM64C4N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	184.1 MHz				4.5 mm		30
5M40ZM64C5N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64	3	1.2 mm	4.5 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	4.5 mm		30
5M80ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
XC9572XL-5VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	178.6 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
XC9572XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	125 MHz		36		10 mm	Yes	52
5M40ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
5M160ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
5M160ZE64C5	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
XC9572XL-10VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		36		10 mm	Yes	52
5M160ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M40ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M80ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
XC9572XL-5VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	72	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	178.6 MHz		36		10 mm	Yes	52
5M80ZE64C5	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
LC4064ZE-7MN64I	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm		4 Dedicated Inputs, 48 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	5 mm	Yes	48
5M80ZM64I5N	Intel	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm	Yes	30
XC9536XL-10VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells	e4	100 MHz		36		10 mm	Yes	36
LC4032ZE-5MN64C	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	5.8 ns	Yes	1.9 V	32	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm		4 Dedicated Inputs, 32 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	149 MHz	40 s		260 °C (500 °F)	5 mm	Yes	32
XC9536XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	125 MHz		36		10 mm	Yes	36
5M40ZM64C4	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	184.1 MHz				4.5 mm		30
5M80ZM64C5N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm	Yes	30
XA9572XL-15VQG64Q	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XC9536XL-7VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e0	138.88 MHz	30 s	36	240 °C (464 °F)	10 mm	Yes	36
XC9536XL-10VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS		36	3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	100 MHz		36		10 mm	Yes	36

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.