780 Programmable Logic Devices (PLD) 18

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EP1M350FC780-7	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FC780-8A	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FC780-6	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FI780-7A	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350F780C7N	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1	40 s		245 °C (473 °F)	29 mm	486
EP1M350FC780-7A	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FI780-7	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FI780-6	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FI780-5	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350F780I6	Altera	Loadable PLD	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	14400	Yes	1.89 V	CMOS	486	1.8	1.5/3.3,1.8 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	Mixed	1.71 V	1 mm	100 °C (212 °F)	0 Dedicated Inputs, 486 I/O	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e0		486	220 °C (428 °F)	29 mm	486
EP1M350F780C7	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy	14400	Yes	1.89 V	CMOS	486	1.8	1.5/3.3,1.8 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e0		486	220 °C (428 °F)	29 mm	486
EP1M350F780I6N	Altera	Loadable PLD		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O		Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e1				29 mm	486
EP1M350FI780-8A	Altera	Loadable PLD		Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 486 I/O		Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350F780C5N	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1	40 s		245 °C (473 °F)	29 mm	486
EP1M350F780C6	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy	14400	Yes	1.89 V	CMOS	486	1.8	1.5/3.3,1.8 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e0		486	220 °C (428 °F)	29 mm	486
EP1M350F780C6N	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array			Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1	40 s		245 °C (473 °F)	29 mm	486
EP1M350FC780-5	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	1.89 V	CMOS		1.8		Grid Array, Heat Sink/Slug			Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No	e1				29 mm	486
EP1M350F780C5	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy	14400	Yes	1.89 V	CMOS	486	1.8	1.5/3.3,1.8 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e0		486	220 °C (428 °F)	29 mm	486

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.