DFP Programmable Logic Devices (PLD) 209

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

5962-8515508SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

Yes

e0

25 MHz

8

13.09 mm

No

4

5962-8515513SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

14 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

48 MHz

8

6

8103614SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

16 MHz

8

4

PAL16R8AMWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

25 MHz

8

0

82S105/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

10.5 MHz

0

5962-8670901YX

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Glass-Sealed

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDFP-F28

No

0

82S100/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

PLUS405/BYA

NXP Semiconductors

OT PLD

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Flatpack

16 Dedicated Inputs

16

Dual

R-CDFP-F28

No

30 MHz

82S101/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

5962-8670901YA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Glass-Sealed

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Tin Lead

Dual

R-GDFP-F28

No

e0

0

82S105/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

10.5 MHz

0

S82S102R/883B

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

16

PAD-TYPE

5

5 V

Flatpack

FL28,.4

Programmable Logic Devices

9

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDFP-F28

No

e0

9

82S101/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

PLHS18P8A/BSA

NXP Semiconductors

OT PLD

Flat

20

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

30 ns

Yes

Flatpack

Combinatorial

10 Dedicated Inputs, 8 I/O

10

Dual

R-CDFP-F20

No

8

82S100/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

CPL16R6-25DC

Samsung

Commercial

Flat

20

DFP

Rectangular

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDFP-F20

3

No

e0

28.5 MHz

6

CPL16R6-35DC

Samsung

Commercial

Flat

20

DFP

Rectangular

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDFP-F20

3

No

e0

18 MHz

6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.