HFQFP Programmable Logic Devices (PLD) 531

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K50RI240-4N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	5.25 V		CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e3	62.89 MHz		189		32 mm		189
EPF10K50VRI240-4N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	3.6 V		CMOS	189	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K100ARI240-3N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	189	3.3	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K20RI208-4N	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	147	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	67.11 MHz		147		28 mm		147
EPF10K50RC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	5.25 V		CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e3	66.67 MHz		189		32 mm		189
EPF10K50VRC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.5 ns	2880	Yes	3.6 V		CMOS	189	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K20RC240-4	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	67.11 MHz		189		32 mm		189
EPF10K20RC240-4N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e3	67.11 MHz		189		32 mm		189
EPF10K50VRI240-4	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	3.6 V		CMOS	189	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189		32 mm		189
EPF10K20RC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS	147	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	71.43 MHz		147		28 mm		147
EPF10K30RI240-4N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e3	62.89 MHz		189		32 mm		189
EPF10K100ARI240-3	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	189	3.3	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189		32 mm		189
EPF10K20RI208-4	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	147	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	67.11 MHz		147		28 mm		147
EPF10K30RI208-4N	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	147	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	62.89 MHz		147		28 mm		147
EPF10K20RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	71.43 MHz		189		32 mm		189
EPF10K30RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e0	66.67 MHz		189		32 mm		189
EPF10K20RC208-4N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	147	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	67.11 MHz		147		28 mm		147
EPF10K40RC208-3	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	2304	Yes	5.25 V		CMOS	147	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz		147		28 mm		147
EPF10K50RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e0	66.67 MHz		189		32 mm		189
EPF10K100ARC240-1N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	4992	Yes	3.6 V		CMOS	189	3.3	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K30RC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e3	66.67 MHz		189		32 mm		189
EPF10K30RC240-4	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189	5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e0	62.89 MHz		189		32 mm		189
XH95432-10HQ304C	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 232 I/O	0		Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		232
XC95288-10HQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	288	CMOS		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	168
XC95576-12HQG304	Xilinx	Flash PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		232 I/O			Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No	3.3 or 5 V I/O Capability	e3	100 MHz				40 mm		232
XH95180-10HQG208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XC95288-15HQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	28 mm		168
XH95288-7HQG208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XC95576-12HQ304C	Xilinx	Flash PLD	Commercial	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	12 ns		Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 232 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		232
XH95576-10HQ304C	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 232 I/O	0		Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		232
XH95216-7HQG208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XH95288-10HQG304I	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 192 I/O	0		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		192
XC95288-20HQ208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	20 ns		Yes	5.5 V	288	CMOS		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XC95288-10HQG304C	Xilinx	Flash PLD	Commercial	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	10 ns		Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		192
XH95180-10HQ208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC95288-15HQ208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	288	CMOS		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	288 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XH95432-10HQG304I	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 232 I/O	0		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		232
XC95288-15HQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	288	CMOS		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XH95180-7HQG208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XH95216-7HQ208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC95288-10HQ208	Xilinx	Flash PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 167 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e0					28 mm		167
XC95288-20HQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	288	CMOS		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XH95432-7HQG304I	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 232 I/O	0		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		232
XH95288-7HQ208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC95288-20HQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	50 MHz	30 s		245 °C (473 °F)	28 mm		168
XH95576-10HQG304C	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 232 I/O	0		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		232
XH95216-7HQG208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XH95180-7HQ208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes			CMOS		5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.