HLBGA Programmable Logic Devices (PLD) 30

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K50BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns	2880	Yes	5.5 V		CMOS	274	5	3.3/5,5 V	Grid Array, Heat Sink/Slug, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 274 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	57.8 MHz	274	220 °C (428 °F)	35 mm		274
EPF10K40BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K20BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K10BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K10BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K40BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K10BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K20BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K30BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K40BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K30BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K40BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K40BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K20BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K30BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K30BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPM9560ABC356-15	Altera	EE PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	16.6 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 212 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	560 Macrocells	e1			220 °C (428 °F)	35 mm		212
EPF10K20BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K10BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPM9320ABC356-15	Altera	EE PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	16 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	320 Macrocells; 484 Flip Flops; 20 Labs; Configurable I/O operation with 3.3 V or 5 V	e1			220 °C (428 °F)	35 mm		168
EPF10K20BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K50BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns	2880	Yes	5.25 V		CMOS	274	5	3.3/5,5 V	Grid Array, Heat Sink/Slug, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	57.8 MHz	274	220 °C (428 °F)	35 mm		274
EPF10K20BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K50BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 310 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2880 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm		310
EPF10K10BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPF10K10BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
EPF10K50BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 310 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2880 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm		310
EPM9560ABI356-15	Altera	EE PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	16.6 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 212 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	560 Macrocells	e1				35 mm		212
EPF10K40BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
EPM9320ABC356-7	Altera	EE PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	8.2 ns		Yes	5.25 V	320	CMOS		5	3.3/5,5 V	Grid Array, Heat Sink/Slug, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	1.63 mm	35 mm	No	320 Macrocells; 484 Flip Flops; 20 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			220 °C (428 °F)	35 mm	Yes	168

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.