QCCN Programmable Logic Devices (PLD) 379

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

GAL20V8-20HZ1

STMicroelectronics

EE PLD

Commercial

No Lead

28

QCCN

Square

Ceramic

20 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

33.3 MHz

8

GAL20V8-35QZ1

STMicroelectronics

EE PLD

Commercial

No Lead

28

QCCN

Square

Ceramic

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

18.1 MHz

8

GAL39V18-30HZ1

STMicroelectronics

EE PLD

Commercial

No Lead

QCCN

Ceramic

30 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LCC(UNSPEC)

Programmable Logic Devices

75

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

33 MHz

10

5962-9176008M3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

7.5 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

71 MHz

10

5962-8768201M2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

10

PLUS405/B3A

NXP Semiconductors

OT PLD

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Chip Carrier

16 Dedicated Inputs

16

Quad

S-CQCC-N28

No

30 MHz

82S101/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

82S100/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

82S153A/B2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

10

5962-86709013C

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

0

82S100/B3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

82S105/B3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

10.5 MHz

0

5962-8768201M2X

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

10

82S101/B3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

5962-86709013A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

0

5962-9176007M3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

55 MHz

10

PLHS18P8A/B2A

NXP Semiconductors

OT PLD

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

Chip Carrier

10 Dedicated Inputs, 8 I/O

10

Quad

S-CQCC-N20

No

8

5962-9176007M3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

55 MHz

10

5962-86709013X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

5962-8670901Y3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

5962-8670901Y3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

82S105/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

10.5 MHz

0

5962-9176008M3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

7.5 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

71 MHz

10

5962-9233807M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

2

5962-9233804M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

87 MHz

8.89 mm

4

5962-9233802M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

87 MHz

8.89 mm

0

5962-9233805M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

8.89 mm

6

5962-9233804M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

87 MHz

8.89 mm

4

5962-9233801M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

e0

8.89 mm

6

5962-9233806M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

0

5962-01-421-4812

Infineon Technologies

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

20 ns

Yes

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

28.5 MHz

6

5962-9233808M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

4

5962-88713082X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

22 MHz

8.89 mm

4

5962-9233803M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

87 MHz

8.89 mm

2

5962-9233805M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

e0

8.89 mm

6

5962-9233808M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

105.3 MHz

8.89 mm

4

5962-9233801M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

8.89 mm

6

5962-9233803M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

87 MHz

8.89 mm

2

5962-88713082A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

e0

22 MHz

8.89 mm

4

5962-9233806M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

105.3 MHz

8.89 mm

0

5962-9233802M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

87 MHz

8.89 mm

0

5962-9233807M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

105.3 MHz

8.89 mm

2

HPL4-16RC4-9

Renesas Electronics

OT PLD

Industrial

No Lead

20

QCCN

Square

Ceramic

Yes

5.5 V

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 4 I/O

-40 °C (-40 °F)

Quad

S-XQCC-N20

No

5 MHz

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.