SSOP Programmable Logic Devices (PLD) 16

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PLC18V8ZIADB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

7.2 mm

8

P3C18V8ZIDB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

2.7 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

7.2 mm

8

PLC18V8Z35DB-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.75 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

21 MHz

7.2 mm

8

PLC18V8Z25DB-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.75 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

7.2 mm

8

P3C18V8ZIADB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

45 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

18 MHz

7.2 mm

8

PLC18V8ZIDB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline, Shrink Pitch

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

18 MHz

8

7.2 mm

8

LVT16V8-7DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

9 ns

Yes

3.6 V

BICMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

91 MHz

7.2 mm

8

P3C18V8Z40DB-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

22 MHz

7.2 mm

8

P3C18V8Z35DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

45 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

2.7 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

21 MHz

7.2 mm

8

PLC18V8ZIADB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

8

7.2 mm

8

PLC18V8Z35DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Programmable Logic Devices

Macrocell

4.75 V

74

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

21 MHz

8

7.2 mm

8

LVT16V8-6DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

7 ns

Yes

3.6 V

BICMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

111 MHz

7.2 mm

8

PLC18V8Z25DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Programmable Logic Devices

Macrocell

4.75 V

74

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

8

7.2 mm

8

PLC18V8ZIDB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

18 MHz

7.2 mm

8

P3C18V8Z40DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

22 MHz

7.2 mm

8

P3C18V8ZIADB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

45 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

18 MHz

7.2 mm

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.