TSSOP Programmable Logic Devices (PLD) 97

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ATF22V10C-10XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	132	.65 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No		e3	90 MHz		10		7.8 mm		10
ATF22V10CQZ-20XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		e3	38.5 MHz		10		7.8 mm		10
SLG46826G	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19			13	PLA-TYPE	2.5			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		Yes	Macrocell	2.3 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
SLG46824G	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19			13	PLA-TYPE	2.5			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		Yes	Macrocell	2.3 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
ATF750CL-15XU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	10	CMOS				5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		e3	44 MHz				7.8 mm	No	10
SLG46620-AG	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	3.6 V	1		AEC-Q100	18	PLA-TYPE	3.3			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		No	Macrocell	1.71 V		.65 mm	105 °C (221 °F)	1 Dedicated Inputs, 17 I/O	1	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						17		6.5 mm	No	17
ATF16V8BQL-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
ATF16V8CZ-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
SLG46827-AG	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19		AEC-Q100	13	PLA-TYPE	3.3			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		No	Macrocell	2.3 V		.65 mm	105 °C (221 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
ATF22V10C-10XC	Atmel	Flash PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.75 V	132	.65 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No	Shared Input/Clock	e0	90 MHz		10	240 °C (464 °F)	7.8 mm		10
ATF22LV10CQZ-30XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No		e3	25 MHz		10		7.8 mm		10
ATF22LV10C-10XU	Microchip Technology	Flash PLD	Other	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No	10 Macrocells	e3	71.4 MHz		10		7.8 mm		10
P3C18V8ZIDH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	50 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	2.7 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz				6.5 mm		8
P3C18V8Z40DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		22 MHz				6.5 mm		8
P5Z22V10-DDH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			83 MHz				7.8 mm		10
P3Z22V10IBDH-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			65 MHz				7.8 mm		10
P3C18V8Z40DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		22 MHz				6.5 mm		8
PLC18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		8		6.5 mm		8
P3Z22V10-BDH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			69 MHz				7.8 mm		10
P5Z22V10-7DH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			103 MHz				7.8 mm		10
PLC18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz				6.5 mm		8
P3C18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz				6.5 mm		8
PLC18V8Z25DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz				6.5 mm		8
PLC18V8ZIDH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No			18 MHz		8		6.5 mm		8
P3Z22V10-DDH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			83 MHz				7.8 mm		10
P5Z22V10IDDH	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	11 ns	Yes	5.5 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			74 MHz				7.8 mm		10
P3Z22V10-DDH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			83 MHz				7.8 mm		10
P3C18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	2.7 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz				6.5 mm		8
P3Z22V10IBDH	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			65 MHz				7.8 mm		10
P3Z22V10-BDH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			69 MHz				7.8 mm		10
PLC18V8Z25DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		8		6.5 mm		8
935206130112	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No							6.5 mm		8
PLC18V8ZIDH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No			18 MHz				6.5 mm		8
P5Z22V10-DDH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			83 MHz				7.8 mm		10
PLC18V8Z35DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e4	21 MHz				6.5 mm		8
PLC18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e4	21 MHz		8		6.5 mm		8
P5Z22V10IDDH-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	11 ns	Yes	5.5 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			74 MHz				7.8 mm		10
P5Z22V10-7DH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			103 MHz				7.8 mm		10
P3C18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V		CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz				6.5 mm		8
PEEL18LV8ZT-15	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS		18	PAL-TYPE	3		3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	2.7 V	113	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	31.25 MHz		8		6.5 mm		8
PEEL18CV8TI-15	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	41.6 MHz		8		6.5 mm		8
PEEL16CV8T-25L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	64	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	28.5 MHz		8	260 °C (500 °F)	6.5 mm		8
PEEL18CV8ZTI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	113	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	33.3 MHz		8		6.5 mm		8
PEEL22CV10AT-25L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS				5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz	40 s		260 °C (500 °F)	7.8 mm		10
PEEL18LV8ZT-25	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	3.6 V		CMOS		18	PAL-TYPE	3		3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	2.7 V	113	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	25 MHz		8		6.5 mm		8
PEEL18CV8T-10	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	83.3 MHz		8		6.5 mm		8
PEEL18LV8ZTI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS		18	PAL-TYPE	3		3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	2.7 V	113	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	31.25 MHz		8	260 °C (500 °F)	6.5 mm		8
PEEL18CV8TI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	6.5 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.