Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Atmel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
83.3 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
83.3 MHz |
240 °C (464 °F) |
14 mm |
Yes |
64 |
|||||||||||
Atmel |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
8 Macrocells |
e0 |
100 MHz |
8 |
25.908 mm |
8 |
||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
45 MHz |
8 |
25.908 mm |
8 |
||||||||||
Atmel |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.57 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock |
e0 |
125 MHz |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
|||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.57 mm |
29.3116 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
29.3116 mm |
Yes |
64 |
||||||||||
Atmel |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
125 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
100 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
100 MHz |
240 °C (464 °F) |
14 mm |
Yes |
64 |
|||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
60 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
32 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
10 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
32 |
||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
5 |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
240 °C (464 °F) |
14 mm |
Yes |
80 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
100 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
83.3 MHz |
240 °C (464 °F) |
14 mm |
Yes |
64 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
128 |
5 |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
41.7 MHz |
240 °C (464 °F) |
14 mm |
Yes |
80 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
Shared Input/Clock |
e0 |
90 MHz |
10 |
31.877 mm |
10 |
||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
e0 |
55.5 MHz |
10 |
31.877 mm |
10 |
||||||||||||
Atmel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
125 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
Flash PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
45 MHz |
8 |
25.908 mm |
8 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
55.5 MHz |
10 |
31.877 mm |
10 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
128 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
41.7 MHz |
225 °C (437 °F) |
29.3115 mm |
Yes |
64 |
|||||||||||
Atmel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e0 |
83.3 MHz |
225 °C (437 °F) |
29.3115 mm |
Yes |
64 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
10 |
CMOS |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
44 MHz |
31.877 mm |
No |
10 |
||||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
83.3 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.57 mm |
16.5862 mm |
No |
e0 |
83.3 MHz |
225 °C (437 °F) |
16.5862 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
83.3 MHz |
225 °C (437 °F) |
20 mm |
Yes |
64 |
|||||||||||
Atmel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.57 mm |
16.5862 mm |
No |
e0 |
60 MHz |
225 °C (437 °F) |
16.5862 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
10 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.572 mm |
11.5062 mm |
No |
e0 |
55 MHz |
225 °C (437 °F) |
11.5062 mm |
No |
10 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
8 Macrocells |
e0 |
68 MHz |
8 |
31.877 mm |
8 |
||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
8 Macrocells |
e0 |
45 MHz |
8 |
31.877 mm |
8 |
||||||||||
Atmel |
Flash PLD |
Commercial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
.65 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
2 |
1.2 mm |
4.4 mm |
No |
Shared Input/Clock |
e0 |
90 MHz |
10 |
240 °C (464 °F) |
7.8 mm |
10 |
|||||||||
Atmel |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
10 |
CMOS |
MIL-STD-883 Class B |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; Variable Product Terms |
e0 |
45 MHz |
30 s |
240 °C (464 °F) |
32 mm |
No |
10 |
|||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
68 MHz |
8 |
25.908 mm |
8 |
||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
10 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.572 mm |
11.5062 mm |
No |
e0 |
44 MHz |
225 °C (437 °F) |
11.5062 mm |
No |
10 |
|||||||||||
Atmel |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
62.5 MHz |
225 °C (437 °F) |
16.586 mm |
No |
32 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
40 MHz |
10 mm |
No |
32 |
||||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
83.3 MHz |
10 mm |
Yes |
32 |
||||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 48 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
4.57 mm |
24.2316 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
24.2316 mm |
Yes |
48 |
||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
14 mm |
Yes |
80 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
100 MHz |
225 °C (437 °F) |
20 mm |
Yes |
80 |
||||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
83.3 MHz |
240 °C (464 °F) |
14 mm |
Yes |
80 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.