Broadcom Programmable Logic Devices (PLD) 17

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PLX464I-45	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	15 MHz	8		8
PLX448P-45	Broadcom	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.25 V	8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.699 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	16.7 MHz	8	31.75 mm	8
PLX448I-55	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0		8		8
PLX464-45	Broadcom		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	15 MHz	8		8
PLX448JC-45	Broadcom	OT PLD	Commercial	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.25 V	8	CMOS	26	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	88	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28	5.59 mm	11.6332 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	16.7 MHz	8	11.6332 mm	8
PLX464M-55	Broadcom		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T24		7.98 mm	No		e0		8	31.14 mm	8
PLX464-25	Broadcom		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	28.5 MHz	8		8
PLX464WJC-25	Broadcom		Commercial	J Bend	28	QCCJ	Square	Ceramic		Yes		8	CMOS	26	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices			88	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Quad	S-XQCC-J28		11.638 mm	No		e0	28.5 MHz	8	11.638 mm	8
PLX448JC-25	Broadcom		Commercial	J Bend	28	QCCJ	Square	Ceramic		Yes		8	CMOS	26	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices			88	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Quad	S-XQCC-J28		11.638 mm	No		e0	28.5 MHz	8	11.638 mm	8
PLX464I-55	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0		8		8
PLX464WJC-45	Broadcom	UV PLD	Commercial	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.25 V	8	CMOS	26	PAL-TYPE	5	5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	88	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28	5.59 mm	11.6332 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	16.7 MHz	8	11.6332 mm	8
PLX448JC-35	Broadcom		Commercial	J Bend	28	QCCJ	Square	Ceramic		Yes		8	CMOS	26	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices			88	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Quad	S-XQCC-J28		11.638 mm	No		e0	18 MHz	8	11.638 mm	8
PLX464WJC-35	Broadcom		Commercial	J Bend	28	QCCJ	Square	Ceramic		Yes		8	CMOS	26	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices			88	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Quad	S-XQCC-J28		11.638 mm	No		e0	18 MHz	8	11.638 mm	8
PLX448M-65	Broadcom	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	65 ns	No	5.5 V	8	CMOS	26	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	88	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.3 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	11.1 MHz	8	32.2 mm	8
PLX464P-45	Broadcom	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.25 V	8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.699 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	16.7 MHz	8	31.75 mm	8
PLX448I-45	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	15 MHz	8		8
PLX464-35	Broadcom		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	18 MHz	8		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.