Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
2.54 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
e0 |
41.6 MHz |
8 |
26.162 mm |
8 |
|||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
2.54 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
e3 |
41.6 MHz |
8 |
260 °C (500 °F) |
26.162 mm |
8 |
|||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
113 |
2.54 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
e0 |
33.3 MHz |
8 |
26.162 mm |
8 |
|||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
31.75 mm |
10 |
||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
90.9 MHz |
10 |
31.75 mm |
10 |
||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
2.64 mm |
7.5 mm |
No |
e3 |
83.3 MHz |
8 |
260 °C (500 °F) |
12.8 mm |
8 |
|||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
18 |
PAL-TYPE |
3 |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
2.7 V |
113 |
.65 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1.1 mm |
4.4 mm |
No |
e0 |
31.25 MHz |
8 |
6.5 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
4.369 mm |
8.9662 mm |
No |
e0 |
83.3 MHz |
8 |
8.9662 mm |
8 |
||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Macrocell |
4.5 V |
124 |
.8 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
12 mm |
No |
e3 |
66.6 MHz |
40 s |
24 |
260 °C (500 °F) |
12 mm |
24 |
||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
90.9 MHz |
10 |
31.75 mm |
10 |
||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
1.27 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
No |
e0 |
28.5 MHz |
8 |
12.8 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
113 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
No |
e0 |
33.3 MHz |
8 |
12.8 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
2.64 mm |
7.5 mm |
No |
e3 |
83.3 MHz |
8 |
260 °C (500 °F) |
12.8 mm |
8 |
|||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
No |
e0 |
83.3 MHz |
8 |
12.8 mm |
8 |
||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
90.9 MHz |
260 °C (500 °F) |
31.75 mm |
10 |
|||||||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
3.6 V |
CMOS |
18 |
PAL-TYPE |
3 |
3/3.3 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
2.7 V |
113 |
2.54 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
e0 |
31.25 MHz |
8 |
26.162 mm |
8 |
|||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
.65 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1.1 mm |
4.4 mm |
No |
e0 |
41.6 MHz |
8 |
6.5 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
5 |
5 V |
Small Outline |
SOP28,.4 |
Field Programmable Gate Arrays |
Mixed |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G28 |
2.64 mm |
7.5 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
17.9 mm |
12 |
|||||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
5 |
5 V |
In-Line |
DIP24,.3 |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 20 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
e0 |
71.4 MHz |
22 |
31.75 mm |
20 |
|||||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
.65 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
1.1 mm |
4.4 mm |
No |
e3 |
28.5 MHz |
8 |
260 °C (500 °F) |
6.5 mm |
8 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
3 |
4.369 mm |
8.9662 mm |
No |
e3 |
83.3 MHz |
8 |
260 °C (500 °F) |
8.9662 mm |
8 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
33.3 MHz |
40 s |
260 °C (500 °F) |
11.5062 mm |
10 |
||||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.5 V |
113 |
.65 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1.1 mm |
4.4 mm |
No |
e0 |
33.3 MHz |
8 |
6.5 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
35 ns |
Yes |
3.6 V |
CMOS |
18 |
PAL-TYPE |
3 |
3/3.3 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
2.7 V |
113 |
1.27 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
No |
e0 |
17.9 MHz |
8 |
12.8 mm |
8 |
||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline, Thin Profile, Shrink Pitch |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
1.1 mm |
4.4 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
33.3 MHz |
40 s |
260 °C (500 °F) |
7.8 mm |
10 |
||||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
2.64 mm |
7.5 mm |
No |
e3 |
41.6 MHz |
8 |
260 °C (500 °F) |
12.8 mm |
8 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
1.27 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
3 |
4.369 mm |
8.9662 mm |
No |
e3 |
83.3 MHz |
8 |
260 °C (500 °F) |
8.9662 mm |
8 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
133 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
e3 |
33.3 MHz |
10 |
260 °C (500 °F) |
31.75 mm |
10 |
|||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
2.64 mm |
7.5 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
10 |
15.4 mm |
10 |
|||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
1.27 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
4.369 mm |
8.9662 mm |
No |
e0 |
83.3 MHz |
8 |
8.9662 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
133 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
33.3 MHz |
10 |
260 °C (500 °F) |
11.5062 mm |
10 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
2.64 mm |
7.5 mm |
No |
e3 |
28.5 MHz |
8 |
260 °C (500 °F) |
12.8 mm |
8 |
|||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
117 MHz |
10 |
31.75 mm |
10 |
||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
3.6 V |
CMOS |
18 |
PAL-TYPE |
3 |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
2.7 V |
113 |
.65 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1.1 mm |
4.4 mm |
No |
e0 |
25 MHz |
8 |
6.5 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.75 V |
74 |
.65 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1.1 mm |
4.4 mm |
No |
e0 |
83.3 MHz |
8 |
6.5 mm |
8 |
||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Mixed |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
11.5062 mm |
12 |
|||||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 10 I/O |
7 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
3 |
4.369 mm |
8.9662 mm |
No |
e3 |
28.5 MHz |
8 |
260 °C (500 °F) |
8.9662 mm |
10 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
2.64 mm |
7.5 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
90.9 MHz |
260 °C (500 °F) |
15.4 mm |
10 |
|||||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
18 |
PAL-TYPE |
3 |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
2.7 V |
113 |
.65 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
1.1 mm |
4.4 mm |
No |
e3 |
31.25 MHz |
8 |
260 °C (500 °F) |
6.5 mm |
8 |
|||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
.65 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
1.1 mm |
4.4 mm |
No |
e3 |
41.6 MHz |
8 |
260 °C (500 °F) |
6.5 mm |
8 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline, Thin Profile, Shrink Pitch |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
1.1 mm |
4.4 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
117 MHz |
260 °C (500 °F) |
7.8 mm |
10 |
|||||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
2.54 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
e0 |
41.6 MHz |
8 |
26.162 mm |
8 |
|||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
3.6 V |
CMOS |
22 |
PAL-TYPE |
3 |
3/3.3 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
2.7 V |
133 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
7.62 mm |
No |
e0 |
25 MHz |
10 |
31.75 mm |
10 |
|||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
26 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Mixed |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
11.5062 mm |
12 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.