Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
No |
e0 |
77 MHz |
10 mm |
No |
32 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
No |
e3 |
100 MHz |
260 °C (500 °F) |
10 mm |
No |
32 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
128 |
LFQFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP128,.64SQ,16 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.4 mm |
70 °C (158 °F) |
3 Dedicated Inputs, 96 I/O |
3 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
No |
e0 |
57 MHz |
30 s |
240 °C (464 °F) |
14 mm |
No |
96 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
18 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
50 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
160 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 144 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells |
e0 |
69 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
144 |
|||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
384 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
67 MHz |
30 s |
225 °C (437 °F) |
17 mm |
Yes |
192 |
||||||||||
Lattice Semiconductor |
EE PLD |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
32 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.8 mm |
105 °C (221 °F) |
2 Dedicated Inputs, 30 I/O |
2 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
86 MHz |
30 s |
30 |
240 °C (464 °F) |
10 mm |
Yes |
30 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.7 V |
64 |
36 |
PAD-TYPE |
2.5 |
2.5 V |
Flatpack, Thin Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.3 V |
83 |
.5 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
No |
e3 |
156 MHz |
40 s |
32 |
260 °C (500 °F) |
7 mm |
Yes |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.95 V |
64 |
32 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.65 V |
83 |
.8 mm |
90 °C (194 °F) |
2 Dedicated Inputs, 30 I/O |
2 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
156 MHz |
40 s |
30 |
260 °C (500 °F) |
10 mm |
Yes |
30 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.9 V |
64 |
74 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
90 °C (194 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
156 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
64 |
36 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Thin Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
130 °C (266 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
No |
e3 |
111 MHz |
40 s |
32 |
260 °C (500 °F) |
7 mm |
Yes |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
5.8 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
4 Dedicated Inputs, 32 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
No |
e3 |
149 MHz |
40 s |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
74 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
90 °C (194 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
156 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
|||||||
Lattice Semiconductor |
EE PLD |
Gull Wing |
128 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
96 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP128,.64SQ,16 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.4 mm |
105 °C (221 °F) |
4 Dedicated Inputs, 92 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
No |
e0 |
111 MHz |
30 s |
92 |
240 °C (464 °F) |
14 mm |
Yes |
92 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
128 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
96 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP128,.64SQ,16 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.4 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 92 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
No |
e3 |
111 MHz |
40 s |
92 |
260 °C (500 °F) |
14 mm |
Yes |
92 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Ball |
132 |
LFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
100 |
PAD-TYPE |
1.8 |
1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA132,14X14,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 96 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
No |
e1 |
111 MHz |
40 s |
96 |
260 °C (500 °F) |
8 mm |
Yes |
96 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
74 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
105 °C (221 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
111 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
||||||
|
Lattice Semiconductor |
EE PLD |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
132 |
PAD-TYPE |
3.3 |
3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
1 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e1 |
111 MHz |
40 s |
128 |
260 °C (500 °F) |
17 mm |
Yes |
128 |
|||||||
Lattice Semiconductor |
EE PLD |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
132 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
130 °C (266 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
No |
e0 |
111 MHz |
30 s |
128 |
256 °C (492.8 °F) |
21 mm |
Yes |
128 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
132 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
130 °C (266 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
No |
e3 |
111 MHz |
40 s |
128 |
260 °C (500 °F) |
21 mm |
Yes |
128 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
512 |
212 |
PAD-TYPE |
3.3 |
3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
1 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 208 I/O |
4 |
0 °C (32 °F) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e1 |
156 MHz |
40 s |
208 |
260 °C (500 °F) |
17 mm |
Yes |
208 |
|||||||
Lattice Semiconductor |
EE PLD |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
212 |
PAD-TYPE |
3.3 |
3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
1 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 208 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e0 |
111 MHz |
30 s |
208 |
225 °C (437 °F) |
17 mm |
Yes |
208 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
0 Dedicated Inputs, 141 I/O |
0 |
Tin/Silver/Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
40 s |
250 °C (482 °F) |
17 mm |
Yes |
141 |
|||||||||||||
Lattice Semiconductor |
Flash PLD |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
4.9 ns |
256 |
Yes |
3.465 V |
CMOS |
78 |
1.8 |
1.8/3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,14X14,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
7 Dedicated Inputs, 78 I/O |
7 |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.35 mm |
8 mm |
No |
It can also operate at 2.5 V and 3.3 V |
e0 |
388 MHz |
30 s |
78 |
240 °C (464 °F) |
8 mm |
78 |
||||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.57 mm |
29.3116 mm |
No |
e0 |
37 MHz |
30 s |
225 °C (437 °F) |
29.3116 mm |
No |
64 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
62.5 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
32 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e0 |
62.5 MHz |
30 s |
240 °C (464 °F) |
7 mm |
Yes |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
384 |
CMOS |
PAL-TYPE |
3.3 |
3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
62.5 MHz |
40 s |
250 °C (482 °F) |
17 mm |
Yes |
192 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
PAL-TYPE |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
62.5 MHz |
40 s |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
64 |
CMOS |
PAL-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e3 |
105 MHz |
40 s |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
PAL-TYPE |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
76.9 MHz |
40 s |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
128 |
CMOS |
PAL-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
52.6 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
64 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
32 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
52.6 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
52.6 MHz |
240 °C (464 °F) |
10 mm |
Yes |
32 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.57 mm |
29.3116 mm |
No |
e0 |
58.8 MHz |
30 s |
225 °C (437 °F) |
29.3116 mm |
No |
64 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e0 |
55.6 MHz |
30 s |
240 °C (464 °F) |
14 mm |
Yes |
68 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
512 |
CMOS |
5 |
5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
55.6 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
160 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 104 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
83.3 MHz |
225 °C (437 °F) |
20 mm |
Yes |
104 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
100 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
64 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e0 |
37 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
|||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
80 |
1.27 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e0 |
37 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
|||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
83.3 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
33.3 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
26 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
136 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e0 |
71.4 MHz |
30 s |
12 |
225 °C (437 °F) |
11.5062 mm |
12 |
|||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
6 Dedicated Inputs, 48 I/O |
6 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
4.57 mm |
24.2316 mm |
No |
4 External Clocks |
e0 |
38 MHz |
30 s |
225 °C (437 °F) |
24.2316 mm |
No |
48 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.