Samsung Programmable Logic Devices (PLD) 274

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs
CPL20L8-15NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	CMOS	12	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	72	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0		8
CPL20R8L25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered		2.54 mm	125 °C (257 °F)	-55 °C (-67 °F)		Dual	R-XDIP-T24		No		22 MHz	8
CPL20R8L-20WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered	72	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3	No	e0	33.3 MHz	8
CPL16R6L-25NI	Samsung		Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	105 °C (221 °F)	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0	28.5 MHz	6
CPL20R6-15NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	CMOS	14	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0		8
CPL20L10L-15WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	40	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3	No	e0		10
CPL20L10L-20WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	40	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3	No	e0		10
CPL16R4L-25NLC	Samsung		Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3	No	e0	28.5 MHz	4
CPL20R4L-35NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	60	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0	18 MHz	8
CPL22V10L25WM	Samsung
CPL20L8L-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	CMOS	12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	72	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0		8
CPL16R4-20NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0	33.3 MHz	4
CPL16R4L25DM	Samsung
CPL20L8L-15NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	CMOS	12	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	72	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0		8
CPL20R4-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered	60	2.54 mm	125 °C (257 °F)	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3	No	e0	22 MHz	8
CPL16R4-35DC	Samsung		Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20	3	No	e0	18 MHz	4
CPL1648L35DM	Samsung
CPL16V8L25WM	Samsung
CPL20L10-30NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	40	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0		10
CPL20R6-35NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No	CMOS	14	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0		8
CPL20R8-15NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	72	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0	41.6 MHz	8
CPL16R6-35PLC	Samsung		Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3	No	e0	18 MHz	6
CPL20L8L-15WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No	CMOS	12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	72	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3	No	e0		8
CPL16R4-25NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0	28.5 MHz	4
CPL20R4-15NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	60	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0	41.6 MHz	8
CPL20L10-15NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	40	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0		10
CPL20L10-35NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	40	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0		10
CPL20R6-25PLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered		1.27 mm	70 °C (158 °F)	0 °C (32 °F)		Quad	S-PQCC-J28		No		28.5 MHz	8
CPL20L10L25PLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial		1.27 mm	70 °C (158 °F)	0 °C (32 °F)		Quad	S-PQCC-J28		No		28.5 MHz	10
CPL20R8-35NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered	72	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0	18 MHz	8
CPL16R8-25NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0	28.5 MHz	8
CPL1648L25DM	Samsung
CPL16R6L-20NLC	Samsung		Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3	No	e0	33.3 MHz	6
CPL20L10-35DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	CMOS	20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Combinatorial	40	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	3	No	e0		10
CPL16R6L25DM	Samsung
CPL16L8-20NLC	Samsung		Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Combinatorial	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3	No	e0		8
CPL20R6-25NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	CMOS	14	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0		8
CPL16R6L-20WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3	No	e0	33.3 MHz	6
CPL16R8-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	125 °C (257 °F)	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3	No	e0	16.5 MHz	8
CPL20R8L-20NLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	72	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0	33.3 MHz	8
CPL16R6-20NLC	Samsung		Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3	No	e0	33.3 MHz	6
CPL16L8-15NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0		8
CPL20R6L-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	CMOS	14	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3	No	e0		8
CPL16R6-20NC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0	33.3 MHz	6
CPL16R8L-35DC	Samsung		Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy		Yes	CMOS	16	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Registered	64	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20	3	No	e0	18 MHz	8
CPL16V8-25NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3	No	e0	28.5 MHz	8
CPL22V10-25PLC	Samsung		Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes	CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	132	1.27 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	3	No	e0		10
CPL16L8L-20WC	Samsung		Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No	CMOS	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	64	2.54 mm	70 °C (158 °F)	0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3	No	e0		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.