Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
100 GΩ |
0.88 in (22.35 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
16 |
50 V |
Low Profile |
0.14 in (3.556 mm) |
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|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box; Tube |
0.878 in (22.3 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
100 mA |
Wire |
50 mΩ |
Copper Alloy |
16 |
24 V |
Approval: UL |
e4 |
0.157 in (3.988 mm) |
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|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box; Tube |
0.278 in (7.06 mm) |
7.06 in (179.324 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Wire |
50 mΩ |
Copper Alloy |
4 |
24 V |
Approval: UL |
0.157 in (3.988 mm) |
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TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
0.484 in (12.29 mm) |
10.16 in (258.064 mm) |
Tape Sealed |
Gold |
0.256 in (6.5 mm) |
0.1A@5VDC |
60 °C (140 °F) |
100 mA |
-10 °C (14 °F) |
100 mA |
Wire |
100 mΩ |
Copper Alloy |
16 |
50 V |
0.15 in (3.81 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.761 in (19.34 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
14 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
20 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.561 in (14.26 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
10 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.861 in (21.88 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
16 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
5 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.561 in (14.26 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
10 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.761 in (19.34 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
14 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.48 in (12.2 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
8 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
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|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.681 in (17.3 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Beryllium Copper |
12 |
5 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.261 in (6.64 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
4 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.961 in (24.42 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
18 |
24 V |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.661 in (16.8 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
12 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.361 in (9.18 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
6 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.461 in (11.72 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
8 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.361 in (9.18 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
6 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
8.9 in (226.06 mm) |
Dust Proof |
0.252 in (6.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.661 in (16.8 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
12 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
20 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.461 in (11.72 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
8 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.261 in (6.64 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
4 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.961 in (24.42 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
18 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.861 in (21.88 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
16 |
24 V |
e4 |
0.126 in (3.2 mm) |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.