Through Hole-Right Angle DIP & SIP Switches 122

Reset All
Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

435802-9

TE Connectivity

Through Hole-Right Angle

7000 Cycle(s)

100 GΩ

0.88 in (22.35 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.29 in (7.36 mm)

0.025A@24VDC

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

100 mΩ

Copper Alloy

16

50 V

Low Profile

0.14 in (3.556 mm)

ADP0804

TE Connectivity

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

Box; Tube

0.878 in (22.3 mm)

8.15 in (207.01 mm)

Gold over Nickel

0.236 in (6 mm)

0.1A@24VDC

85 °C (185 °F)

1 A

-30 °C (-22 °F)

Gold - with Nickel barrier

100 mA

Wire

50 mΩ

Copper Alloy

16

24 V

Approval: UL

e4

0.157 in (3.988 mm)

ADPA0204

TE Connectivity

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

Box; Tube

0.278 in (7.06 mm)

7.06 in (179.324 mm)

Gold over Nickel

0.236 in (6 mm)

0.1A@24VDC

85 °C (185 °F)

1 A

-30 °C (-22 °F)

100 mA

Wire

50 mΩ

Copper Alloy

4

24 V

Approval: UL

0.157 in (3.988 mm)

DTS4SD

TE Connectivity

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

0.484 in (12.29 mm)

10.16 in (258.064 mm)

Tape Sealed

Gold

0.256 in (6.5 mm)

0.1A@5VDC

60 °C (140 °F)

100 mA

-10 °C (14 °F)

100 mA

Wire

100 mΩ

Copper Alloy

16

50 V

0.15 in (3.81 mm)

A6ER-7101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.761 in (19.34 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

14

24 V

e4

0.126 in (3.2 mm)

A6ER-0104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

1.061 in (26.96 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

20

24 V

e4

0.126 in (3.2 mm)

A6ER-5101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.561 in (14.26 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

10

24 V

e4

0.126 in (3.2 mm)

A6ER-8104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.861 in (21.88 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

16

24 V

e4

0.126 in (3.2 mm)

A6DR-0100

Omron

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

1.079 in (27.4 mm)

8.9 in (226.06 mm)

Dust Proof

0.252 in (6.4 mm)

0.1A@5VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

100 mA

Solder

100 mΩ

Beryllium Copper

20

5 V

Sealed Construction

e4

0.181 in (4.597 mm)

A6ER-5104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.561 in (14.26 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

10

24 V

e4

0.126 in (3.2 mm)

A6ER-7104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.761 in (19.34 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

14

24 V

e4

0.126 in (3.2 mm)

A6DR-4100

Omron

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

0.48 in (12.2 mm)

8.9 in (226.06 mm)

Dust Proof

0.252 in (6.4 mm)

0.1A@5VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

30 mA

Solder

100 mΩ

Beryllium Copper

8

30 V

Sealed Construction

e4

0.181 in (4.597 mm)

A6DR-6100

Omron

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

0.681 in (17.3 mm)

8.9 in (226.06 mm)

Dust Proof

0.252 in (6.4 mm)

0.1A@5VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

100 mA

Solder

100 mΩ

Beryllium Copper

12

5 V

Sealed Construction

e4

0.181 in (4.597 mm)

A6ER-2104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.261 in (6.64 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

4

24 V

e4

0.126 in (3.2 mm)

A6ER-9101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.961 in (24.42 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

200 mΩ

18

24 V

0.126 in (3.2 mm)

A6ER-6101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.661 in (16.8 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

12

24 V

e4

0.126 in (3.2 mm)

A6ER-3101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.361 in (9.18 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

6

24 V

e4

0.126 in (3.2 mm)

A6ER-4101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.461 in (11.72 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

8

24 V

e4

0.126 in (3.2 mm)

A6ER-3104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.361 in (9.18 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

6

24 V

e4

0.126 in (3.2 mm)

A6DR-8100

Omron

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

0.882 in (22.4 mm)

8.9 in (226.06 mm)

Dust Proof

0.252 in (6.4 mm)

0.03A@30VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

30 mA

Solder

100 mΩ

Beryllium Copper

16

30 V

Sealed Construction

e4

0.181 in (4.597 mm)

A6ER-6104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.661 in (16.8 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

12

24 V

e4

0.126 in (3.2 mm)

A6ER-0101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

1.061 in (26.96 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

20

24 V

e4

0.126 in (3.2 mm)

A6ER-4104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.461 in (11.72 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

8

24 V

e4

0.126 in (3.2 mm)

A6ER-2101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.261 in (6.64 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

4

24 V

e4

0.126 in (3.2 mm)

A6ER-9104

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.961 in (24.42 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

18

24 V

e4

0.126 in (3.2 mm)

A6ER-8101

Omron

Through Hole-Right Angle

1000 Cycle(s)

100 MΩ

0.861 in (21.88 mm)

10.8 in (274.32 mm)

Bottom Sealed

0.402 in (10.2 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

16

24 V

e4

0.126 in (3.2 mm)

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.