Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
1.28 in (32.5 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.281 in (7.14 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
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|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
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TE Connectivity |
Through Hole-Straight |
2.4 in (60.96 mm) |
12.42 in (315.468 mm) |
0.319 in (8.1 mm) |
Solder |
C42315-A1347 |
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|
Apem Components |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.854 in (21.7 mm) |
9.7 in (246.38 mm) |
Epoxy Terminal Sealed |
Gold over Nickel |
0.381 in (9.68 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-25 °C (-13 °F) |
Gold - with Nickel barrier |
25 mA |
Solder |
MPG |
50 mΩ |
Brass |
16 |
24 V |
UL94V-0 Materials used |
e4 |
0.118 in (2.997 mm) |
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|
Wurth Elektronik |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.39 in (9.9 mm) |
3.84 in (97.536 mm) |
Gold |
0.224 in (5.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
2 |
24 V |
0.146 in (3.708 mm) |
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|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.937 in (23.8 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.554 in (14.0716 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.382 in (9.7 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
6 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.737 in (18.72 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.98 in (24.9 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
18 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
12 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.737 in (18.72 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Tape Sealed |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
2 |
24 V |
With Seal Tape |
e4 |
||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.78 in (19.8 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
14 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
8 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
20 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.596 in (15.14 mm) |
6 in (152.4 mm) |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6TR |
24 V |
Low Profile |
e4 |
|||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.378 in (9.6 mm) |
7.5 in (190.5 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.254 in (6.4516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.295 in (7.5 mm) |
4.48 in (113.792 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
1.075 in (27.3 mm) |
7.5 in (190.5 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.261 in (6.64 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
4 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.737 in (18.72 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
1.037 in (26.34 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
20 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.754 in (19.1516 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.561 in (14.26 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
10 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.976 in (24.8 mm) |
7.5 in (190.5 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.861 in (21.88 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
16 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.361 in (9.18 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
6 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.681 in (17.3 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
12 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.654 in (16.6116 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.454 in (11.5316 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.295 in (7.5 mm) |
4.48 in (113.792 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.461 in (11.72 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
8 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
1.054 in (26.7716 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
12 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.796 in (20.22 mm) |
6 in (152.4 mm) |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6TR |
24 V |
Low Profile |
e4 |
|||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.878 in (22.3 mm) |
7.5 in (190.5 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
12 |
24 V |
With Seal Tape |
e4 |
||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.961 in (24.42 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
18 |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.776 in (19.7 mm) |
7.5 in (190.5 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.681 in (17.3 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
12 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.