.7 W Resistor Networks & Arrays 6

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Part	Manufacturer	Resistor Type	Mounting Type	Resistance	Rated Power Dissipation (P)	Maximum Operating Temperature	Tolerance	Element Power Dissipation	Rated Temperature	No. of Functions	Technology	Shape (Package)	No. of Elements	Construction	Packing Method	Size Code	Network Type	Temperature Coef Tracking	No. of Terminals	Package Style (Meter)	Terminal Shape	Sub-Category	First Element Resistance	Minimum Operating Temperature	Temperature Coef (ppm/Cel)	Terminal Finish	Second or Last Element Resistance	Height (Package)	Manufacturer Series	Operating Voltage	Additional Features	Length (Package)	JESD-609 Code	Series	Width (Package)
GUS-SS7BLF-02-1871-B	Tt Electronics Plc	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	1870 ohm	.7 W	125 Cel	.1 %	.05 W	70 Cel	1	TANTALUM NITRIDE/NICKEL CHROME	RECTANGULAR PACKAGE	13	Miniature	TR; TUBE	1534	BUSSED	5 ppm/Cel	14	SMT	GULL WING	Array/Network Resistors	1870 ohm	-55 Cel	50	Matte Tin (Sn)		1.626 mm	SOIC	100 V	PRECISION	8.661 mm	e3	SOIC	3.886 mm
GUS-SS7BLF-02-1871-D	Tt Electronics Plc	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	1870 ohm	.7 W	125 Cel	.5 %	.05 W	70 Cel	1	TANTALUM NITRIDE/NICKEL CHROME	RECTANGULAR PACKAGE	13	Miniature	TR; TUBE	1534	BUSSED	5 ppm/Cel	14	SMT	GULL WING	Array/Network Resistors	1870 ohm	-55 Cel	50	Matte Tin (Sn)		1.626 mm	SOIC	100 V	PRECISION	8.661 mm	e3	SOIC	3.886 mm
GUS-SS7BLF-02-8871-B	Tt Electronics Plc	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	8870 ohm	.7 W	125 Cel	.1 %	.05 W	70 Cel	1	TANTALUM NITRIDE/NICKEL CHROME	RECTANGULAR PACKAGE	13	Miniature	TR; TUBE	1534	BUSSED	5 ppm/Cel	14	SMT	GULL WING	Array/Network Resistors	8870 ohm	-55 Cel	50	Matte Tin (Sn)		1.626 mm	SOIC	100 V	PRECISION	8.661 mm	e3	SOIC	3.886 mm
GUS-SS7BLF-02-8871-F	Tt Electronics Plc	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	8870 ohm	.7 W	125 Cel	1 %	.05 W	70 Cel	1	TANTALUM NITRIDE/NICKEL CHROME	RECTANGULAR PACKAGE	13	Miniature	TR; TUBE	1534	BUSSED	5 ppm/Cel	14	SMT	GULL WING	Array/Network Resistors	8870 ohm	-55 Cel	50	Matte Tin (Sn)		1.626 mm	SOIC	100 V	PRECISION	8.661 mm	e3	SOIC	3.886 mm
GS7ALF013570BAT	Tt Electronics Plc	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	357 ohm	.7 W	125 Cel	.1 %	.1 W	70 Cel	7	THIN FILM		1	Rectangular	Tube	3415	ISOLATED	5 ppm/Cel	14	SMT	GULL WING		357 ohm	-55 Cel	100	Matte Tin (Sn)	357 ohm	1.626 mm		100 V		8.661 mm	e3		3.886 mm
GS7ALF033570BAT	Tt Electronics Plc	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	357 ohm	.7 W	125 Cel	.1 %	.1 W	70 Cel	7	THIN FILM		1	Rectangular	Tube	3415	ISOLATED	5 ppm/Cel	14	SMT	GULL WING		357 ohm	-55 Cel	25	Matte Tin (Sn)	357 ohm	1.626 mm		100 V		8.661 mm	e3		3.886 mm

Resistor Networks & Arrays

Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.

Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.

Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.

Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.