Part | RoHS | Manufacturer | Resistor Type | Mounting Type | Resistance | Rated Power Dissipation (P) | Maximum Operating Temperature | Tolerance | Spacing (Lead) | Element Power Dissipation | Rated Temperature | No. of Functions | Technology | Shape (Package) | No. of Elements | Construction | Packing Method | Size Code | Network Type | Temperature Coef Tracking | No. of Terminals | Package Style (Meter) | Terminal Shape | Sub-Category | Dimensions | First Element Resistance | Minimum Operating Temperature | Temperature Coef (ppm/Cel) | Terminal Finish | Second or Last Element Resistance | Length (Lead) | Height (Package) | Manufacturer Series | Operating Voltage | Additional Features | Length (Package) | JESD-609 Code | Series | Reference Standard | Width (Package) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
10000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
10000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
4700 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
4700 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
1000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
1000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
330 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
330 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
2200 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
2200 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
6800 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
6800 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
22000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
4700 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
4700 ohm |
-55 Cel |
100 |
Matte Tin (Sn) |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e3 |
2.16 mm |
||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
1000000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
1000000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Conformal |
BULK |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
22000 ohm |
-55 Cel |
100 |
Tin/Lead (Sn/Pb) |
3.43 mm |
5.08 mm |
100 V |
22.81 mm |
e0 |
2.49 mm |
|||||||||
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
22000 ohm |
-55 Cel |
100 |
TIN LEAD |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e0 |
2.16 mm |
|||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
22000 ohm |
-55 Cel |
100 |
Matte Tin (Sn) |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e3 |
2.16 mm |
||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
270 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
270 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
470 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
470 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
AMMO PACK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
22000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
15000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
15000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
27000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
27000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
100000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
100000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
3300 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
3300 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
220000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
220000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
47000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
47000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
1000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
1000 ohm |
-55 Cel |
100 |
MATTE TIN |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e3 |
2.16 mm |
||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
10000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
10000 ohm |
-55 Cel |
100 |
Matte Tin (Sn) |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e3 |
2.16 mm |
||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
2200 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
2200 ohm |
-55 Cel |
100 |
Matte Tin (Sn) |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e3 |
2.16 mm |
||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
18000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
18000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
56 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
56 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
560 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
560 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
1200 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Molded |
8808 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
1200 ohm |
-55 Cel |
100 |
Matte Tin (Sn) |
3.43 mm |
4.95 mm |
100 V |
22.45 mm |
e3 |
2.16 mm |
||||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
1200 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
1200 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
180 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
180 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
20000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
BULK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
20000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
|||||||
|
Bourns |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
10000 ohm |
1.13 W |
125 Cel |
2 % |
2.54 mm |
.2 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
Epoxy Resin |
AMMO PACK |
9010 |
BUSSED |
50 ppm/Cel |
9 |
SIP |
FLAT |
Array/Network Resistors |
10000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER |
3.3 mm |
8.89 mm |
100 V |
22.81 mm |
e1 |
2.49 mm |
Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.
Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.
Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.
Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.