Part | RoHS | Manufacturer | Resistor Type | Mounting Type | Resistance | Rated Power Dissipation (P) | Maximum Operating Temperature | Tolerance | Spacing (Lead) | Element Power Dissipation | Rated Temperature | No. of Functions | Technology | Shape (Package) | No. of Elements | Construction | Packing Method | Size Code | Network Type | Temperature Coef Tracking | No. of Terminals | Package Style (Meter) | Terminal Shape | Sub-Category | Dimensions | First Element Resistance | Minimum Operating Temperature | Temperature Coef (ppm/Cel) | Terminal Finish | Second or Last Element Resistance | Length (Lead) | Height (Package) | Manufacturer Series | Operating Voltage | Additional Features | Length (Package) | JESD-609 Code | Series | Reference Standard | Width (Package) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
5000 ohm |
150 Cel |
.01 % |
METAL FOIL |
Chip |
TR |
1505 |
Divider |
3 |
SMT |
Array/Network Resistors |
-55 Cel |
0.2 |
.64 mm |
22 V |
3.81 mm |
VFCD 1505 (Z-FOIL) |
1.27 mm |
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|
Vishay Precision Group |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
5000 ohm |
.1 W |
125 Cel |
.05 % |
.05 W |
70 Cel |
1 |
METAL FOIL |
RECTANGULAR PACKAGE |
2 |
Non Inductive |
TR |
1116 |
DIVIDER |
1 ppm/Cel |
3 |
SMT |
J BEND |
Array/Network Resistors |
5000 ohm |
-55 Cel |
2 |
SILVER |
5000 ohm |
1.6 mm |
25 V |
HIGH-PRECISION, NON-INDUCTIVE |
4.06 mm |
e4 |
2.69 mm |
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|
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
5000 ohm |
.4 W |
150 Cel |
.1 % |
.1 W |
70 Cel |
4 |
THIN FILM |
RECTANGULAR PACKAGE |
1 |
Rectangular |
TR |
1915 |
ISOLATED |
5 ppm/Cel |
8 |
DIP |
GULL WING |
Array/Network Resistors |
5000 ohm |
-55 Cel |
25 |
MATTE TIN |
5000 ohm |
1.73 mm |
100 V |
4.9 mm |
e3 |
3.9 mm |
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|
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
5000 ohm |
.1 W |
125 Cel |
.02 % |
METAL FOIL |
Molded |
Waffle Pack |
2016 |
Isolated |
8 |
DIP |
Array/Network Resistors |
-55 Cel |
0.2 |
1.73 mm |
5 mm |
SMNZ (Z-FOIL) |
3.99 mm |
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|
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
5000 ohm |
.05 W |
125 Cel |
.02 % |
METAL FOIL |
Non Inductive |
TR |
1611 |
Divider |
3 |
SMT |
Array/Network Resistors |
-55 Cel |
2 |
Silver (Ag) |
1.6 mm |
25 V |
4.06 mm |
e4 |
DSMZ (Z-FOIL) |
2.69 mm |
|||||||||||||||||
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
5000 ohm |
.1 W |
125 Cel |
.02 % |
METAL FOIL |
Molded |
TR |
2016 |
Isolated |
8 |
DIP |
Array/Network Resistors |
-55 Cel |
0.2 |
Tin/Lead (Sn/Pb) |
1.73 mm |
5 mm |
e0 |
SMNZ (Z-FOIL) |
3.99 mm |
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|
Tt Electronics Plc |
ARRAY/NETWORK RESISTOR |
5000 ohm |
.125 W |
125 Cel |
.1 % |
Chip |
TR |
1105 |
Divider |
3 |
SMT |
Array/Network Resistors |
-55 Cel |
25 |
MATTE TIN |
.775 mm |
DIV23 |
100 V |
2.858 mm |
e3 |
DIV23 |
1.295 mm |
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|
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
5000 ohm |
.4 W |
150 Cel |
.5 % |
.1 W |
70 Cel |
4 |
THIN FILM |
RECTANGULAR PACKAGE |
1 |
Rectangular |
Tube |
1915 |
ISOLATED |
5 ppm/Cel |
8 |
DIP |
GULL WING |
Array/Network Resistors |
5000 ohm |
-55 Cel |
25 |
MATTE TIN |
5000 ohm |
1.73 mm |
100 V |
4.9 mm |
e3 |
3.9 mm |
||||||||
|
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
5000 ohm |
.4 W |
125 Cel |
.1 % |
.1 W |
70 Cel |
10 |
THIN FILM |
RECTANGULAR PACKAGE |
1 |
Molded Case |
TR |
1534 |
ISOLATED |
5 ppm/Cel |
20 |
DIP |
GULL WING |
Array/Network Resistors |
5000 ohm |
-55 Cel |
25 |
Matte Tin (Sn) |
1.58 mm |
100 V |
8.74 mm |
e3 |
3.91 mm |
Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.
Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.
Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.
Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.