.02 % Resistor Networks & Arrays 9

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Part	Manufacturer	Resistor Type	Mounting Type	Resistance	Rated Power Dissipation (P)	Maximum Operating Temperature	Tolerance	Rated Temperature	No. of Functions	Technology	No. of Elements	Construction	Packing Method	Size Code	Network Type	Temperature Coef Tracking	No. of Terminals	Package Style (Meter)	Terminal Shape	Sub-Category	Minimum Operating Temperature	Temperature Coef (ppm/Cel)	Terminal Finish	Length (Lead)	Height (Package)	Operating Voltage	Length (Package)	JESD-609 Code	Series	Width (Package)
Y1365V0008QT9R	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		10000 ohm	.1 W	125 Cel	.02 %			METAL FOIL		Molded	TR	2016	Isolated		8	DIP		Array/Network Resistors	-55 Cel	2			1.73 mm		5 mm		SMN	3.99 mm
Y1747V0019QT9W	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		5000 ohm	.1 W	125 Cel	.02 %			METAL FOIL		Molded	Waffle Pack	2016	Isolated		8	DIP		Array/Network Resistors	-55 Cel	0.2			1.73 mm		5 mm		SMNZ (Z-FOIL)	3.99 mm
Y4485V0002QT9R	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		5000 ohm	.05 W	125 Cel	.02 %			METAL FOIL		Non Inductive	TR	1611	Divider		3	SMT		Array/Network Resistors	-55 Cel	2	Silver (Ag)		1.6 mm	25 V	4.06 mm	e4	DSMZ (Z-FOIL)	2.69 mm
Y1747V0191QT9W	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		1000 ohm	.1 W	125 Cel	.02 %			METAL FOIL		Molded	Waffle Pack	2016	Isolated		8	DIP		Array/Network Resistors	-55 Cel	0.2			1.73 mm		5 mm		SMNZ (Z-FOIL)	3.99 mm
Y1747V0008QT9W	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		10000 ohm	.1 W	125 Cel	.02 %			METAL FOIL		Molded	Waffle Pack	2016	Isolated		8	DIP		Array/Network Resistors	-55 Cel	0.2			1.73 mm		5 mm		SMNZ (Z-FOIL)	3.99 mm
Y4485V0004QT9R	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		1000 ohm	.05 W	125 Cel	.02 %			METAL FOIL		Non Inductive	TR	1611	Divider		3	SMT		Array/Network Resistors	-55 Cel	2	Silver (Ag)		1.6 mm	25 V	4.06 mm	e4	DSMZ (Z-FOIL)	2.69 mm
Y5076V0314QV0L	Vishay Precision Group	ARRAY/NETWORK RESISTOR	THROUGH HOLE MOUNT			125 Cel	.02 %	25 Cel	1	METAL FOIL	2	Rectangular	BULK		DIVIDER	.1 ppm/Cel	3	Radial	WIRE		-55 Cel	2		19.05 mm	10.92 mm	200 V	11.05 mm			4.7 mm
Y4485V0001QT9R	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		10000 ohm	.05 W	125 Cel	.02 %			METAL FOIL		Non Inductive	TR	1611	Divider		3	SMT		Array/Network Resistors	-55 Cel	2	Silver (Ag)		1.6 mm	25 V	4.06 mm	e4	DSMZ (Z-FOIL)	2.69 mm
Y1747V0019QT0R	Vishay Intertechnology	ARRAY/NETWORK RESISTOR		5000 ohm	.1 W	125 Cel	.02 %			METAL FOIL		Molded	TR	2016	Isolated		8	DIP		Array/Network Resistors	-55 Cel	0.2	Tin/Lead (Sn/Pb)		1.73 mm		5 mm	e0	SMNZ (Z-FOIL)	3.99 mm

Resistor Networks & Arrays

Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.

Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.

Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.

Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.