Part | RoHS | Manufacturer | Resistor Type | Mounting Type | Resistance | Rated Power Dissipation (P) | Maximum Operating Temperature | Tolerance | Spacing (Lead) | Element Power Dissipation | Rated Temperature | No. of Functions | Technology | Shape (Package) | No. of Elements | Construction | Packing Method | Size Code | Network Type | Temperature Coef Tracking | No. of Terminals | Package Style (Meter) | Terminal Shape | Sub-Category | Dimensions | First Element Resistance | Minimum Operating Temperature | Temperature Coef (ppm/Cel) | Terminal Finish | Second or Last Element Resistance | Length (Lead) | Height (Package) | Manufacturer Series | Operating Voltage | Additional Features | Length (Package) | JESD-609 Code | Series | Reference Standard | Width (Package) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE Connectivity |
FIXED RESISTOR |
THROUGH HOLE MOUNT |
.2 W |
125 Cel |
5 % |
70 Cel |
1 |
THICK FILM |
RECTANGULAR PACKAGE |
5 |
BULK, BOX |
BUSSED |
6 |
FLAT |
15.24mm x 2.5mm |
10000 ohm |
-55 Cel |
200 |
100 V |
||||||||||||||||||||
|
TE Connectivity |
FIXED RESISTOR |
THROUGH HOLE MOUNT |
.2 W |
125 Cel |
5 % |
70 Cel |
1 |
THICK FILM |
RECTANGULAR PACKAGE |
8 |
BULK, BOX |
BUSSED |
9 |
FLAT |
22.86mm x 2.5mm |
1000 ohm |
-55 Cel |
200 |
100 V |
||||||||||||||||||||
|
TE Connectivity |
FIXED RESISTOR |
THROUGH HOLE MOUNT |
.125 W |
125 Cel |
5 % |
70 Cel |
4 |
THICK FILM |
RECTANGULAR PACKAGE |
1 |
BULK, BOX |
ISOLATED |
8 |
FLAT |
20.32mm x 2.5mm |
22000 ohm |
-55 Cel |
200 |
100 V |
||||||||||||||||||||
TE Connectivity |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
.2 W |
5 % |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
BULK |
BUSSED |
9 |
FLAT |
22000 ohm |
100 |
||||||||||||||||||||||||||
TE Connectivity |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
.2 W |
5 % |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
8 |
BULK |
BUSSED |
9 |
FLAT |
22000 ohm |
100 |
||||||||||||||||||||||||||
|
TE Connectivity |
FIXED RESISTOR |
THROUGH HOLE MOUNT |
.2 W |
125 Cel |
5 % |
70 Cel |
1 |
THICK FILM |
RECTANGULAR PACKAGE |
8 |
BULK, BOX |
BUSSED |
9 |
FLAT |
22.86mm x 2.5mm |
10000 ohm |
-55 Cel |
200 |
100 V |
||||||||||||||||||||
|
TE Connectivity |
FIXED RESISTOR |
THROUGH HOLE MOUNT |
.2 W |
125 Cel |
5 % |
70 Cel |
1 |
THICK FILM |
RECTANGULAR PACKAGE |
8 |
BULK, BOX |
BUSSED |
9 |
FLAT |
22.86mm x 2.5mm |
100000 ohm |
-55 Cel |
200 |
100 V |
Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.
Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.
Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.
Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.