Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Nominal Attenuation | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Insertion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Psemi |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
24 |
CMOS |
31 dBm |
31 dB |
.2 mA |
COMPONENT |
3.3 |
LCC24,.16SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
2.8 dB |
e4 |
.009 MHz |
6000 MHz |
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|
Analog Devices |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
CMOS |
27.99 dBm |
31.5 dB |
COMPONENT |
+-3.3 |
LCC24,.16SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
CMOS COMPATIBLE, I/P POWER-MAX(PEAK)=1.26W |
.009 MHz |
40000 MHz |
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|
Psemi |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
CMOS |
34 dBm |
31 dB |
.2 mA |
COMPONENT |
2.5/5 |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Attenuators |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
3.2 dB |
I/P POWER-MAX(PULSE)=1.26W |
e4 |
.009 MHz |
8000 MHz |
|||
|
Psemi |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
CMOS |
23.01 dBm |
31 dB |
.2 mA |
COMPONENT |
3.3 |
LCC32,.2SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
2.8 dB |
I/P POWER-MAX(PULSE)=0.63W |
e4 |
.009 MHz |
6000 MHz |
||||
|
Mini-circuits |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
CMOS |
23.98 dBm |
1.5 |
31.5 dB |
.1 mA |
COMPONENT |
+-3 |
LCC20,.16SQ,20 |
50 ohm |
RF/Microwave Attenuators |
85 Cel |
-40 Cel |
Tin (Sn) |
2.4 dB |
e3 |
0 MHz |
2400 MHz |
|||
|
Analog Devices |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
CMOS |
27.99 dBm |
31.5 dB |
COMPONENT |
+-3.3 |
LCC24,.16SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
CMOS COMPATIBLE, I/P POWER-MAX(PEAK)=1.26W |
e4 |
.009 MHz |
40000 MHz |
||||||
|
Mini-circuits |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
CMOS |
30 dBm |
1.9 |
31.5 dB |
.2 mA |
COMPONENT |
3 |
50 ohm |
105 Cel |
-40 Cel |
3 dB |
0 MHz |
4000 MHz |
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|
Qorvo |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
30 dBm |
30 dB |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Attenuators |
105 Cel |
-40 Cel |
TIN SILVER |
3.5 dB |
e2 |
50 MHz |
6000 MHz |
|||||
Honeywell |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
35.05 dBm |
31 dB |
COMPONENT |
+-5 |
LCC16,.16SQ,25 |
50 ohm |
RF/Microwave Attenuators |
85 Cel |
-40 Cel |
3.4 dB |
CMOS COMPATIBLE |
0 MHz |
2500 MHz |
|||||||
|
Qorvo |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
30 dBm |
30 dB |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Attenuators |
105 Cel |
-40 Cel |
TIN SILVER |
3.5 dB |
e2 |
50 MHz |
6000 MHz |
|||||
|
Qorvo |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
5 |
LCC16,.12SQ,20 |
RF/Microwave Attenuators |
85 Cel |
-40 Cel |
Tin/Silver (Sn/Ag) |
e2 |
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|
Honeywell |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
CMOS |
35 dBm |
1.58 |
31.5 dB |
.05 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
SILVER FLASH OVER NICKEL PALLADIUM GOLD |
5.8 dB |
0 MHz |
4000 MHz |
|||||
|
Psemi |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
CMOS |
23.01 dBm |
31 dB |
.35 mA |
COMPONENT |
3.3/5 |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Attenuators |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
2.8 dB |
CMOS COMPATIBLE |
e3 |
.009 MHz |
6000 MHz |
|||
|
Psemi |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
CMOS |
28 dBm |
31.75 dB |
.2 mA |
COMPONENT |
2.5/5 |
LCC32,.2SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
3.2 dB |
CMOS COMPATIBLE |
e4 |
50 MHz |
8000 MHz |
||||
|
Psemi |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
CMOS |
28 dBm |
31.75 dB |
.2 mA |
COMPONENT |
2.5/5 |
LCC32,.2SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
3.2 dB |
CMOS COMPATIBLE |
50 MHz |
8000 MHz |
||||||
|
Analog Devices |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
CMOS |
28 dBm |
31.5 dB |
COMPONENT |
+-3.3 |
LCC24,.16SQ,20 |
50 ohm |
105 Cel |
-55 Cel |
.009 MHz |
40000 MHz |
|||||||||
|
NXP Semiconductors |
VARIABLE ATTENUATOR |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
CMOS |
30 dBm |
1.22 |
7 dB |
3 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
1 dB |
50 MHz |
4000 MHz |
RF/Microwave attenuators are electronic devices designed to reduce the strength or amplitude of an RF or microwave signal without significantly affecting its waveform. They are used in a variety of applications, including signal conditioning, power level control, and impedance matching.
There are various types of RF/Microwave attenuators, including fixed, variable, and programmable. Fixed attenuators provide a fixed amount of attenuation and are used in applications where the signal level needs to be reduced by a specific amount. Variable attenuators allow for the adjustment of the signal level by rotating a knob or sliding a lever, and are used in applications where the signal level needs to be continuously adjusted. Programmable attenuators can be controlled electronically and offer greater flexibility in adjusting the signal level.
Attenuators can be designed using different technologies, such as resistive, capacitive, and diode-based. Resistive attenuators use resistors to dissipate energy and reduce signal strength. Capacitive attenuators use capacitors to block high-frequency signals and allow low-frequency signals to pass through. Diode-based attenuators use PIN diodes or varactor diodes to control signal strength.
RF/Microwave attenuators are used in a wide range of applications, including in wireless communication systems, test and measurement equipment, radar systems, and satellite communication systems. They play an important role in controlling signal levels and ensuring the integrity of signals in these systems.