16 RF/Microwave Mixers 25

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Supply Current	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Maximum Conversion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
AD8342ACPZ-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR	12 dBm	113 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN			e3	50 MHz	2400 MHz
AD608AR-REEL	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY				MODULE	3	SOP16,.25	50 ohm	RF/Microwave Mixers	85 Cel	-25 Cel	TIN LEAD			e0
HMC1063LP3ETR	Analog Devices	IMAGE REJECTION	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	13 dBm		COMPONENT		LCC16,.12SQ,20	50 ohm		85 Cel	-40 Cel	MATTE TIN			e3	24000 MHz	28000 MHz
LTC5576IUF#PBF	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY		15 dBm	112 mA	COMPONENT	3.3/5	LCC16,.16SQ,25	50 ohm		105 Cel	-40 Cel	MATTE TIN			e3	3000 MHz	8000 MHz
AD8344ACPZ-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR	12 dBm	95 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN			e3	400 MHz	1200 MHz
AD8344ACPZ-WP	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR	12 dBm	95 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN			e3	400 MHz	1200 MHz
HMC663LC3TR	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	CERAMIC	GAAS					LCC16,.12SQ,20		RF/Microwave Mixers	85 Cel	-40 Cel
AD8344ACPZ	Analog Devices		SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR				5	LCC16,.12SQ,20		RF/Microwave Mixers	85 Cel	-40 Cel
HMC663LC3	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	CERAMIC	GAAS	23 dBm		COMPONENT		LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	14 dB		e4	6000 MHz	12000 MHz
AD8342ACPZ-R2	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR	12 dBm	113 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN			e3	50 MHz	2400 MHz
HMC663LC3RTR	Analog Devices		SURFACE MOUNT	16	CERAMIC	GAAS					LCC16,.12SQ,20		RF/Microwave Mixers	85 Cel	-40 Cel
AD8342ACPZ-WP	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR	12 dBm	113 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN			e3	50 MHz	2400 MHz
LTC5567IUF#TRPBF	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	CMOS	15 dBm	105 mA	COMPONENT	3.3	LCC16,.16SQ,25	50 ohm		105 Cel	-40 Cel	MATTE TIN			e3	300 MHz	4000 MHz
LTC5567IUF#PBF	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	CMOS	15 dBm	105 mA	COMPONENT	3.3	LCC16,.16SQ,25	50 ohm		105 Cel	-40 Cel	MATTE TIN			e3	300 MHz	4000 MHz
HMC1043LC3TR	Analog Devices	TRIPLE BALANCED	SURFACE MOUNT	16	CERAMIC	GAAS					LCC16,.12SQ,20		RF/Microwave Mixers	85 Cel	-55 Cel
LTC5576IUF#TRPBF	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY		15 dBm	112 mA	COMPONENT	3.3/5	LCC16,.16SQ,25	50 ohm		105 Cel	-40 Cel	MATTE TIN			e3	3000 MHz	8000 MHz
TFF1013HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY					5	LCC16,.1X.14,20		RF/Microwave Mixers	85 Cel	-40 Cel
MC13142DR2	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		26 mA		3	SOP16,.25		RF/Microwave Mixers	85 Cel	-40 Cel
TDA6131XS	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		13.1 mA	COMPONENT	2.7/4.5	TSSOP16,.25		RF/Microwave Mixers	85 Cel	-40 Cel			LOW NOISE			3000 MHz
IAM-92516-TR1	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm	30 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)	6.9 dB		e3	400 MHz	3500 MHz
IAM-93516-TR1	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm	125 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)			e3	400 MHz	3000 MHz
IAM-92516-TR2	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm	30 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)	6.9 dB		e3	400 MHz	3500 MHz
IAM-93516-BLK	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm	125 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)			e3	400 MHz	3000 MHz
IAM-93516-TR2	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm	125 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)			e3	400 MHz	3000 MHz
IAM-92516-BLK	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm	30 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)	6.9 dB		e3	400 MHz	3500 MHz

RF/Microwave Mixers

RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.

RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.

RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.