Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
IMAGE REJECTION |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11.5 dB |
e4 |
6000 MHz |
26500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11.5 dB |
e4 |
6000 MHz |
26500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold/Nickel (Au/Ni) |
11.5 dB |
e4 |
6000 MHz |
26500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
9.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
9.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
4000 MHz |
8500 MHz |
|||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
9.5 dB |
e4 |
8500 MHz |
13500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
2500 MHz |
8500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
GAAS |
16 dBm |
COMPONENT |
LCC20,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
8000 MHz |
12000 MHz |
|||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
I/P POWER-MAX (PEAK)=23DBM |
e4 |
8500 MHz |
13500 MHz |
|||||||||||
|
Analog Devices |
IMAGE REJECTION |
16 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
8000 MHz |
12000 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
8.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
2500 MHz |
8500 MHz |
||||||||||||
|
Broadcom |
IMAGE REJECTION |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
8 dB |
5000 MHz |
30000 MHz |
|||||||||||
|
Analog Devices |
IMAGE REJECTION |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
24000 MHz |
28000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
LCC16,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
24000 MHz |
28000 MHz |
||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
8.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Broadcom |
IMAGE REJECTION |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
8 dB |
5000 MHz |
30000 MHz |
||||||||||||||
|
Broadcom |
IMAGE REJECTION |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
8 dB |
5000 MHz |
30000 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
13 dB |
22000 MHz |
32000 MHz |
||||||||
|
Analog Devices |
IMAGE REJECTION |
23 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15 dB |
20000 MHz |
42000 MHz |
||||||||||||||
Analog Devices |
IMAGE REJECTION |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10.5 dB |
e4 |
5900 MHz |
12000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
11000 MHz |
16000 MHz |
||||||||||||
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
8500 MHz |
13500 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
9.5 dB |
e4 |
6000 MHz |
10000 MHz |
||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
13 dB |
22000 MHz |
32000 MHz |
|||||||||
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||||||||
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
11000 MHz |
16000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
14 dB |
e4 |
54000 MHz |
64000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
8500 MHz |
13500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
4000 MHz |
8500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
13 dB |
e4 |
15000 MHz |
23000 MHz |
||||||
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
11.5 dB |
e4 |
15000 MHz |
23600 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
11 dB |
e4 |
11000 MHz |
16000 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
8500 MHz |
13500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
11 dB |
e4 |
19000 MHz |
33000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
15 dB |
26000 MHz |
33000 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
12 dB |
e4 |
11000 MHz |
16000 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
13 dB |
22000 MHz |
32000 MHz |
|||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
20 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
13 dB |
e4 |
22000 MHz |
32000 MHz |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.