Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
TRIPLE BALANCED |
28 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
11 dB |
e4 |
3000 MHz |
10000 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
28 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
11 dB |
e4 |
3000 MHz |
10000 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
GAAS |
28 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
TUNGSTEN NICKEL GOLD |
11 dB |
3000 MHz |
10000 MHz |
||||||||||||
M/a-com Technology Solutions |
TRIPLE BALANCED |
COAXIAL |
50 ohm |
100 Cel |
-54 Cel |
11.5 dB |
SMA, I/P POWER-MAX (PEAK)=26DBM |
2000 MHz |
18000 MHz |
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|
Analog Devices |
TRIPLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
16 dB |
20000 MHz |
40000 MHz |
||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
23 dBm |
168 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
10 dB |
e3 |
2000 MHz |
2700 MHz |
||||
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
168 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
9.4 dB |
e3 |
9000 MHz |
15000 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
9.4 dB |
e3 |
9000 MHz |
15000 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
23 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
12 dB |
e3 |
3100 MHz |
3900 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
195 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
||||||||||
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
23 dBm |
168 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
10 dB |
e0 |
2000 MHz |
2700 MHz |
|||||
Analog Devices |
TRIPLE BALANCED |
23 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
12 dB |
e0 |
3100 MHz |
3900 MHz |
|||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
168 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
||||||||||
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
195 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
13 dB |
11000 MHz |
18000 MHz |
|||||||||||
|
Analog Devices |
TRIPLE BALANCED |
38535V;34K;Cls S |
15.5 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
85 Cel |
-40 Cel |
13.5 dB |
26000 MHz |
32000 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
26 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
11.5 dB |
e4 |
3000 MHz |
10000 MHz |
||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold Flash (Au) - with Nickel (Ni) barrier |
14 dB |
7000 MHz |
34000 MHz |
|||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
15.5 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
13 dB |
e4 |
26000 MHz |
32000 MHz |
||||||||||||
Analog Devices |
TRIPLE BALANCED |
17 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
14 dB |
15000 MHz |
36000 MHz |
|||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
CERAMIC |
GAAS |
LCC16,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
GOLD OVER NICKEL |
e4 |
||||||||||||||||||||
Infineon Technologies |
TRIPLE BALANCED |
SURFACE MOUNT |
10 |
PLASTIC/EPOXY |
BIPOLAR |
COMPONENT |
2.7/4.5 |
TSSOP10,.19,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
LOW NOISE |
e0 |
3000 MHz |
||||||||
|
Infineon Technologies |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
BIPOLAR |
13.1 mA |
COMPONENT |
2.7/4.5 |
TSSOP16,.25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
LOW NOISE |
3000 MHz |
|||||||||
Infineon Technologies |
TRIPLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
BIPOLAR |
COMPONENT |
2.7/4.5 |
SOP8,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
LOW NOISE |
e0 |
2000 MHz |
||||||||
|
Broadcom |
TRIPLE BALANCED |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
10 dB |
15000 MHz |
50000 MHz |
||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
10 dB |
15000 MHz |
50000 MHz |
||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
12 dB |
18000 MHz |
40000 MHz |
|||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
12 dB |
18000 MHz |
40000 MHz |
|||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
30 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
6.9 dB |
e3 |
400 MHz |
3500 MHz |
||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
125 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
e3 |
400 MHz |
3000 MHz |
|||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
30 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
6.9 dB |
e3 |
400 MHz |
3500 MHz |
||||||
Broadcom |
TRIPLE BALANCED |
3 |
MODULE |
50 ohm |
100 Cel |
-55 Cel |
10 dB |
50 MHz |
2500 MHz |
|||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
||||||||||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
||||||||||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
125 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
e3 |
400 MHz |
3000 MHz |
|||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
12 dB |
18000 MHz |
40000 MHz |
|||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
125 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
e3 |
400 MHz |
3000 MHz |
|||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
30 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
6.9 dB |
e3 |
400 MHz |
3500 MHz |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.