SURFACE MOUNT RF/Microwave Splitter/Combiners 42

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Minimum Isolation	Maximum Insertion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
GP2Y+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	12			31.76 dBm	1.2		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel		17 dB	1.5 dB	ISOLATION-MIN (DB):17		1600 MHz	3300 MHz
WP4S+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.5		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver/Nickel (Sn/Ag/Ni)	16 dB	1.8 dB	ISOLATION-MIN (DB):16	e2	3400 MHz	4600 MHz
WP4P+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.4		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver/Nickel (Sn/Ag/Ni)	19 dB	1.4 dB	ISOLATION-MIN (DB):19	e2	1710 MHz	2025 MHz
ADP-2-1W	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			33.01 dBm	1.26		COMPONENT		FL6,.2,100	50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	20 dB	1 dB		e0	1 MHz	650 MHz
ADP-2-1W+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT				33.01 dBm			COMPONENT			50 ohm				Tin (Sn) - with Nickel (Ni) barrier	20 dB	1 dB		e3	1 MHz	650 MHz
GP2Y1+	Mini-circuits	COMBINER	SURFACE MOUNT	12			31.76 dBm	1.4		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier	12 dB	1.9 dB		e2	1550 MHz	4400 MHz
PD0922J5050S2HF	Ttm Technologies	SPLITTER	SURFACE MOUNT	6			33.01 dBm	1.67		COMPONENT		SOLCC6,.05,25	50 ohm		85 Cel	-55 Cel	NICKEL GOLD		.7 dB		e4	950 MHz	2150 MHz
EP2K1+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	24	PLASTIC/EPOXY	GAAS	33.98 dBm	1.5		COMPONENT		LCC24,.16SQ,20	50 ohm		85 Cel	-40 Cel	TIN SILVER OVER NICKEL	6 dB	3.2 dB	ISOLATION-MIN (DB):6	e2	2000 MHz	26500 MHz
ADA4304-4ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
CX4002LNLT	Pulse Electronics	SPLITTER	SURFACE MOUNT	6				1.29		COMPONENT		DILCC6,.25	75 ohm		85 Cel	-40 Cel		17 dB	3 dB			5 MHz	1000 MHz
SCPJ-2-9	Mini-circuits	COMBINER	SURFACE MOUNT	8	PLASTIC/EPOXY		30 dBm	1.42		COMPONENT		FL8,.38,200	50 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.8 dB	ISOLATION-MIN (DB):17	e0	200 MHz	900 MHz
ADP-2-20+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY		30 dBm			COMPONENT			50 ohm				TIN OVER NICKEL	15 dB	1.5 dB		e3	20 MHz	2000 MHz
ADP-2-20	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			30 dBm	2.01		COMPONENT		FL6,.2,100	50 ohm		85 Cel	-40 Cel	TIN LEAD	15 dB	1.5 dB		e0	20 MHz	2000 MHz
SBB-2-23+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			40 dBm	1.29		COMPONENT		SOC6,.28	50 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier	17 dB	1 dB	TR, 7 INCH: 200	e3	2000 MHz	2300 MHz
GP2S+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.2		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin (Sn)	17 dB	1.4 dB	ISOLATION-MIN (DB):17	e3	800 MHz	2100 MHz
TCP-2-10-75+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			26.99 dBm	1.48		MODULE			75 ohm		85 Cel	-40 Cel	TIN OVER NICKEL	14 dB	1.4 dB	ISOLATION-MIN (DB):14	e3	5 MHz	1000 MHz
ADA4304-4ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	54 MHz	865 MHz
EP2-28+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY	GAAS	27.99 dBm	1.3		COMPONENT		SOLCC6(UNSPEC)	50 ohm		105 Cel	-55 Cel		17 dB	2.3 dB			25000 MHz	35000 MHz
GP2X1+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.3		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel		10 dB	1.9 dB	ISOLATION-MIN (DB):10		2800 MHz	7200 MHz
QCN-19	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC, METAL-SEALED COFIRED		41.76 dBm	1.2		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC		41.76 dBm	1.2		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
QCN-19D	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19D+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
ADA4304-2ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4302-4ACP-RL7	Analog Devices	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY				240 mA		5	LCC20,.16SQ,20		RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)				e0
ADA4303-2ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY				90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	0 MHz	1700 MHz
ADA4304-4ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4304-2ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	54 MHz	865 MHz
ADA4303-2ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY				90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	0 MHz	1700 MHz
ADA4304-3ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4304-3ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4302-4ACPZ-RL7	Analog Devices	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY				240 mA	COMPONENT	5	LCC20,.16SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4302-4ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY				240 mA		5	LCC20,.16SQ,20		RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3
ADA4302-4ACP-REEL	Analog Devices	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY				240 mA		5	LCC20,.16SQ,20		RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)				e0
ADA4302-4ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY				240 mA	COMPONENT	5	LCC20,.16SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4304-2ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	54 MHz	865 MHz
ADA4304-3ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	54 MHz	865 MHz
ADA4303-2ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY				90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	0 MHz	1700 MHz
MAX9987ETP-T	Maxim Integrated	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	43.01 dBm	1.7	171 mA	COMPONENT	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)				e0	700 MHz	1100 MHz
MAX9987EGP	Maxim Integrated	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	20 dBm	1.7	171 mA	COMPONENT	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)				e0	700 MHz	1100 MHz
MAX9988ETP-T	Maxim Integrated	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	43.01 dBm	1.7	171 mA	COMPONENT	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)				e0	1500 MHz	2200 MHz
MAX9988EGP	Maxim Integrated	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	20 dBm	1.4	175 mA	COMPONENT	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)				e0	1500 MHz	2200 MHz

RF/Microwave Splitter/Combiners

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.