12 RF/Microwave Splitter/Combiners 9

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Minimum Isolation	Maximum Insertion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
GP2Y+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	12		31.76 dBm	1.2		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel		17 dB	1.5 dB	ISOLATION-MIN (DB):17		1600 MHz	3300 MHz
WP4S+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY	31.76 dBm	1.5		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver/Nickel (Sn/Ag/Ni)	16 dB	1.8 dB	ISOLATION-MIN (DB):16	e2	3400 MHz	4600 MHz
WP4P+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY	31.76 dBm	1.4		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver/Nickel (Sn/Ag/Ni)	19 dB	1.4 dB	ISOLATION-MIN (DB):19	e2	1710 MHz	2025 MHz
GP2Y1+	Mini-circuits	COMBINER	SURFACE MOUNT	12		31.76 dBm	1.4		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier	12 dB	1.9 dB		e2	1550 MHz	4400 MHz
GP2S+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY	31.76 dBm	1.2		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin (Sn)	17 dB	1.4 dB	ISOLATION-MIN (DB):17	e3	800 MHz	2100 MHz
GP2X1+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY	31.76 dBm	1.3		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel		10 dB	1.9 dB	ISOLATION-MIN (DB):10		2800 MHz	7200 MHz
ADA4303-2ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY			90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	0 MHz	1700 MHz
ADA4303-2ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY			90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	0 MHz	1700 MHz
ADA4303-2ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY			90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	0 MHz	1700 MHz

RF/Microwave Splitter/Combiners

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.