6 RF/Microwave Splitter/Combiners 12

Reset All

Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Construction	Package Equivalence Code	Characteristic Impedance	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Minimum Isolation	Maximum Insertion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
ADP-2-1W	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			33.01 dBm	1.26	COMPONENT	FL6,.2,100	50 ohm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	20 dB	1 dB		e0	1 MHz	650 MHz
PD0922J5050S2HF	Ttm Technologies	SPLITTER	SURFACE MOUNT	6			33.01 dBm	1.67	COMPONENT	SOLCC6,.05,25	50 ohm	85 Cel	-55 Cel	NICKEL GOLD		.7 dB		e4	950 MHz	2150 MHz
CX4002LNLT	Pulse Electronics	SPLITTER	SURFACE MOUNT	6				1.29	COMPONENT	DILCC6,.25	75 ohm	85 Cel	-40 Cel		17 dB	3 dB			5 MHz	1000 MHz
ADP-2-20+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY		30 dBm		COMPONENT		50 ohm			TIN OVER NICKEL	15 dB	1.5 dB		e3	20 MHz	2000 MHz
ADP-2-20	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			30 dBm	2.01	COMPONENT	FL6,.2,100	50 ohm	85 Cel	-40 Cel	TIN LEAD	15 dB	1.5 dB		e0	20 MHz	2000 MHz
SBB-2-23+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			40 dBm	1.29	COMPONENT	SOC6,.28	50 ohm	85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier	17 dB	1 dB	TR, 7 INCH: 200	e3	2000 MHz	2300 MHz
TCP-2-10-75+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			26.99 dBm	1.48	MODULE		75 ohm	85 Cel	-40 Cel	TIN OVER NICKEL	14 dB	1.4 dB	ISOLATION-MIN (DB):14	e3	5 MHz	1000 MHz
EP2-28+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY	GAAS	27.99 dBm	1.3	COMPONENT	SOLCC6(UNSPEC)	50 ohm	105 Cel	-55 Cel		17 dB	2.3 dB			25000 MHz	35000 MHz
QCN-19	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC, METAL-SEALED COFIRED		41.76 dBm	1.2	COMPONENT	SOLCC6,.06,40	50 ohm	100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC		41.76 dBm	1.2	COMPONENT	SOLCC6,.06,40	50 ohm	100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
QCN-19D	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21	COMPONENT	SOLCC6,.06,40	50 ohm	100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19D+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21	COMPONENT	SOLCC6,.06,40	50 ohm	100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz

RF/Microwave Splitter/Combiners

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.