COMBINER RF/Microwave Splitter/Combiners 39

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Construction	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Minimum Isolation	Maximum Insertion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
WP4S+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.5	COMPONENT	LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver/Nickel (Sn/Ag/Ni)	16 dB	1.8 dB	ISOLATION-MIN (DB):16	e2	3400 MHz	4600 MHz
WP4P+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.4	COMPONENT	LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver/Nickel (Sn/Ag/Ni)	19 dB	1.4 dB	ISOLATION-MIN (DB):19	e2	1710 MHz	2025 MHz
GP2Y1+	Mini-circuits	COMBINER	SURFACE MOUNT	12			31.76 dBm	1.4	COMPONENT	LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier	12 dB	1.9 dB		e2	1550 MHz	4400 MHz
AD4PS-1	Mini-circuits	COMBINER					26.99 dBm	1.14	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.8 dB	ISOLATION-MIN (DB):18	e0	1 MHz	500 MHz
AD4PS-1+	Mini-circuits	COMBINER					26.99 dBm	1.14	COMPONENT		50 ohm		85 Cel	-40 Cel	TIN OVER NICKEL		1.8 dB	ISOLATION-MIN (DB):18	e3	1 MHz	500 MHz
SCA-4-10+	Mini-circuits	COMBINER					26.99 dBm	1.38	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin (Sn)		2.5 dB	ISOLATION-MIN (DB):15	e3	5 MHz	1000 MHz
SCA-4-10	Mini-circuits	COMBINER					26.99 dBm	1.2	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		2.5 dB	ISOLATION-MIN (DB):15	e0	5 MHz	1000 MHz
SCA-4-10-75+	Mini-circuits	COMBINER					26.99 dBm	1.64	COMPONENT		75 ohm		85 Cel	-40 Cel	Tin (Sn)		2.5 dB	ISOLATION-MIN (DB):15	e3	10 MHz	1000 MHz
SCA-4-10-75	Mini-circuits	COMBINER					26.99 dBm	1.64	COMPONENT		75 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		2.5 dB	ISOLATION-MIN (DB):15	e0	10 MHz	1000 MHz
SBTC-2-10L+	Mini-circuits	COMBINER					26.99 dBm	1.17	MODULE		50 ohm		85 Cel	-40 Cel	TIN		1.4 dB	ISOLATION-MIN (DB):16	e3	5 MHz	1000 MHz
TCP-2-33W	Mini-circuits	COMBINER					26.99 dBm	2.9	COMPONENT		50 ohm		85 Cel	-40 Cel			2.1 dB			50 MHz	3000 MHz
JSPQ-350	Mini-circuits	COMBINER					30 dBm	1.27	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1 dB	ISOLATION-MIN (DB):13	e0	150 MHz	350 MHz
JSPQ-350+	Mini-circuits	COMBINER					30 dBm	1.27	COMPONENT		50 ohm		85 Cel	-40 Cel			1 dB	ISOLATION-MIN (DB):13		150 MHz	350 MHz
JCPS-8-850-75+	Mini-circuits	COMBINER					30 dBm	1.38	COMPONENT		75 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		3 dB	ISOLATION-MIN (DB):15	e3	10 MHz	850 MHz
JCPS-8-850-75	Mini-circuits	COMBINER					30 dBm	1.38	COMPONENT		75 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		3 dB	ISOLATION-MIN (DB):15	e0	10 MHz	850 MHz
SCPJ-2-9	Mini-circuits	COMBINER	SURFACE MOUNT	8	PLASTIC/EPOXY		30 dBm	1.42	COMPONENT	FL8,.38,200	50 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.8 dB	ISOLATION-MIN (DB):17	e0	200 MHz	900 MHz
ZX10R-14-S+	Mini-circuits	COMBINER					22.04 dBm	1.26	COAXIAL		50 ohm		85 Cel	-40 Cel			1.8 dB	SMA		0 MHz	10000 MHz
GP2S+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.2	COMPONENT	LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel	Tin (Sn)	17 dB	1.4 dB	ISOLATION-MIN (DB):17	e3	800 MHz	2100 MHz
TCP-2-10-75X	Mini-circuits	COMBINER					26.99 dBm	1.48	COMPONENT		75 ohm		85 Cel	-40 Cel			1.4 dB			5 MHz	1000 MHz
ZAPD-2-S	Mini-circuits	COMBINER					40 dBm	1.26	COAXIAL		50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)		.6 dB	SMA, ISOLATION-MIN (DB):19	e0	1000 MHz	2000 MHz
ZB4PD1-500-S	Mini-circuits	COMBINER					30 dBm	1.14	COAXIAL		50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)		1.5 dB	SMA	e0	5 MHz	500 MHz
ZB4PD1-500-S+	Mini-circuits	COMBINER					30 dBm	1.14	COAXIAL		50 ohm		100 Cel	-55 Cel			1.5 dB	SMA		5 MHz	500 MHz
SP-2G1+	Mini-circuits	COMBINER					31.76 dBm	1.5	COMPONENT		50 ohm		85 Cel	-40 Cel			1.3 dB	ISOLATION-MIN (DB):20		1200 MHz	2000 MHz
GP2X1+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.3	COMPONENT	LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel		10 dB	1.9 dB	ISOLATION-MIN (DB):10		2800 MHz	7200 MHz
JEPS-12-10+	Mini-circuits	COMBINER					26.99 dBm	1.12	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		4 dB	ISOLATION-MIN (DB):14	e3	50 MHz	1000 MHz
QCN-19	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC, METAL-SEALED COFIRED		41.76 dBm	1.2	COMPONENT	SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC		41.76 dBm	1.2	COMPONENT	SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
QCN-19D	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21	COMPONENT	SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19D+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21	COMPONENT	SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
JPS-2-1	Mini-circuits	COMBINER					30 dBm	1.3	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		.9 dB	ISOLATION-MIN (DB):20	e0	1 MHz	500 MHz
JPS-2-1+	Mini-circuits	COMBINER					30 dBm	1.3	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		.9 dB	ISOLATION-MIN (DB):20	e3	1 MHz	500 MHz
JPS-2-1-75	Mini-circuits	COMBINER					30 dBm	1.19	COMPONENT		75 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		.7 dB	ISOLATION-MIN (DB):18	e0	5 MHz	500 MHz
JPS-2-1-75+	Mini-circuits	COMBINER					30 dBm	1.19	COMPONENT		75 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		.7 dB	ISOLATION-MIN (DB):18	e3	5 MHz	500 MHz
SCN-2-35	Mini-circuits	COMBINER					36.02 dBm		COMPONENT		50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)		1.3 dB	ISOLATION-MIN (DB):13	e0	2825 MHz	3700 MHz
SCN-2-35+	Mini-circuits	COMBINER					36.02 dBm		COMPONENT		50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier		1.3 dB	ISOLATION-MIN (DB):13	e3	2825 MHz	3700 MHz
SCP-4-4	Mini-circuits	COMBINER					30 dBm	1.61	COMPONENT		50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.5 dB	ISOLATION-MIN (DB):17	e0	800 MHz	1000 MHz
X3DC23P1S	Ttm Technologies	COMBINER
LRPS-2-11	Mini-circuits	COMBINER					30 dBm	1.98	COMPONENT		50 ohm		85 Cel	-40 Cel	TIN LEAD		1.5 dB	ISOLATION-MIN (DB):15	e0	20 MHz	2000 MHz
LRPS-2-11+	Mini-circuits	COMBINER					30 dBm	1.98	COMPONENT		50 ohm		85 Cel	-40 Cel	MATTE TIN OVER NICKEL		1.5 dB	ISOLATION-MIN (DB):15	e3	20 MHz	2000 MHz

RF/Microwave Splitter/Combiners

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.