Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Minimum Isolation | Maximum Insertion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Api Technologies |
SPLITTER |
33.01 dBm |
1.35 |
COAXIAL |
.4 dB |
SMA-F, ISOLATION-MIN (DB):20 |
4000 MHz |
8000 MHz |
||||||||||||||||
|
Ttm Technologies |
SPLITTER |
SURFACE MOUNT |
6 |
33.01 dBm |
1.67 |
COMPONENT |
SOLCC6,.05,25 |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.7 dB |
e4 |
950 MHz |
2150 MHz |
||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.5 dB |
ISOLATION-MIN (DB):17 |
e4 |
2300 MHz |
2800 MHz |
|||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
Commscope |
SPLITTER |
58.45 dBm |
1.2 |
COAXIAL |
50 ohm |
7/16-F, HIGH RELIABILITY, USABLE TO 2500 MHZ |
800 MHz |
2200 MHz |
||||||||||||||||
|
M/a-com Technology Solutions |
SPLITTER |
23.98 dBm |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
3.2 dB |
ISOLATION-MIN (DB):15 |
5 MHz |
2150 MHz |
|||||||||||||
Cobham Plc |
SPLITTER |
30 dBm |
1.3 |
50 ohm |
7.5 dB |
0 MHz |
18000 MHz |
|||||||||||||||||
M/a-com Technology Solutions |
SPLITTER |
30 dBm |
1.5 |
50 ohm |
85 Cel |
-55 Cel |
.85 dB |
10 MHz |
500 MHz |
|||||||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Nickel/Gold (Ni/Au) |
1.3 dB |
ISOLATION-MIN (DB):13 |
e4 |
3100 MHz |
5000 MHz |
|||||||||||
|
Pulse Electronics |
SPLITTER |
SURFACE MOUNT |
6 |
1.29 |
COMPONENT |
DILCC6,.25 |
75 ohm |
85 Cel |
-40 Cel |
17 dB |
3 dB |
5 MHz |
1000 MHz |
||||||||||
M/a-com Technology Solutions |
SPLITTER |
30 dBm |
1.5 |
50 ohm |
85 Cel |
-55 Cel |
.75 dB |
.4 MHz |
400 MHz |
|||||||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
.7 dB |
ISOLATION-MIN (DB):17 |
1700 MHz |
2200 MHz |
|||||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.8 dB |
ISOLATION-MIN (DB):10.5 |
e4 |
950 MHz |
2150 MHz |
|||||||||||
|
Anaren |
SPLITTER |
40 dBm |
1.4 |
COAXIAL |
50 ohm |
.6 dB |
SMA-F, ISOLATION-MIN (DB):18 |
4000 MHz |
12000 MHz |
||||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
54 MHz |
865 MHz |
|||||||
|
Ttm Technologies |
SPLITTER |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
||||||||||||||||||||
Cobham Plc |
SPLITTER |
30 dBm |
1.2 |
COAXIAL |
50 ohm |
125 Cel |
-65 Cel |
SMA, I/P POWER-MAX(PEAK)=1000W |
0 MHz |
6000 MHz |
||||||||||||||
Pulsar Microwave |
SPLITTER |
|||||||||||||||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.6 dB |
e4 |
800 MHz |
1000 MHz |
||||||||||||
|
Ttm Technologies |
SPLITTER |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
||||||||||||||||||||
|
Skyworks Solutions |
SPLITTER |
31.76 dBm |
1.4 |
COMPONENT |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
.6 dB |
e3 |
1420 MHz |
1660 MHz |
||||||||||||
|
Synergy Microwave |
SPLITTER |
44.77 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
1.5 dB |
ISOLATION-MIN (DB):17 |
10 MHz |
1000 MHz |
|||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
Analog Devices |
SPLITTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
240 mA |
5 |
LCC20,.16SQ,20 |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
e0 |
||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
90 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
0 MHz |
1700 MHz |
|||||||
Analog Devices |
SPLITTER |
|||||||||||||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
41.14 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
SMA-F |
e4 |
500 MHz |
18000 MHz |
||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
90 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
0 MHz |
1700 MHz |
|||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
13.01 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
SMA-F |
e4 |
500 MHz |
18000 MHz |
||||||||||||
Analog Devices |
SPLITTER |
|||||||||||||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
240 mA |
COMPONENT |
5 |
LCC20,.16SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
Analog Devices |
SPLITTER |
|||||||||||||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
240 mA |
5 |
LCC20,.16SQ,20 |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
|||||||||||
Analog Devices |
SPLITTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
240 mA |
5 |
LCC20,.16SQ,20 |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
e0 |
||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
240 mA |
COMPONENT |
5 |
LCC20,.16SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
13.01 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
SMA-F |
e4 |
500 MHz |
18000 MHz |
||||||||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
54 MHz |
865 MHz |
|||||||
|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
90 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
0 MHz |
1700 MHz |
|||||||
|
Analog Devices |
SPLITTER |
43.01 dBm |
1.7 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1500 MHz |
2200 MHz |
||||||||||||
|
Analog Devices |
SPLITTER |
Matte Tin (Sn) - annealed |
e3 |
||||||||||||||||||||
Phoenix Contact |
SPLITTER |
36.99 dBm |
MODULE |
50 ohm |
85 Cel |
-40 Cel |
1 dB |
902 MHz |
928 MHz |
|||||||||||||||
Maxim Integrated |
SPLITTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
43.01 dBm |
1.7 |
171 mA |
COMPONENT |
5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
e0 |
700 MHz |
1100 MHz |
|||||
|
Maxim Integrated |
SPLITTER |
43.01 dBm |
1.7 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
700 MHz |
1100 MHz |
RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.
A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.
Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.
Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.