SPLITTER AND COMBINER RF/Microwave Splitter/Combiners 28

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Construction	Package Equivalence Code	Characteristic Impedance	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Minimum Isolation	Maximum Insertion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
GP2Y+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	12			31.76 dBm	1.2		COMPONENT	LCC12,.12SQ,20	50 ohm	85 Cel	-40 Cel		17 dB	1.5 dB	ISOLATION-MIN (DB):17		1600 MHz	3300 MHz
ADP-2-1W	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			33.01 dBm	1.26		COMPONENT	FL6,.2,100	50 ohm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	20 dB	1 dB		e0	1 MHz	650 MHz
ADP-2-1W+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT				33.01 dBm			COMPONENT		50 ohm			Tin (Sn) - with Nickel (Ni) barrier	20 dB	1 dB		e3	1 MHz	650 MHz
1591	Cobham Plc	SPLITTER AND COMBINER					33.01 dBm	1.35		COAXIAL		50 ohm	125 Cel	-55 Cel	GOLD			TNC-F	e4	0 MHz	2000 MHz
SBTC-2-10LX+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	1.17		MODULE		50 ohm	85 Cel	-40 Cel			1.4 dB	ISOLATION-MIN (DB):16		5 MHz	1000 MHz
EP2K1+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	24	PLASTIC/EPOXY	GAAS	33.98 dBm	1.5		COMPONENT	LCC24,.16SQ,20	50 ohm	85 Cel	-40 Cel	TIN SILVER OVER NICKEL	6 dB	3.2 dB	ISOLATION-MIN (DB):6	e2	2000 MHz	26500 MHz
SBTC-2-10L	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	1.17		MODULE		50 ohm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.4 dB	ISOLATION-MIN (DB):16	e0	5 MHz	1000 MHz
TCP-2-33W+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	2.9		MODULE		50 ohm	85 Cel	-40 Cel			2.1 dB	ISOLATION-MIN (DB):8		50 MHz	3000 MHz
ADP-2-20+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY		30 dBm			COMPONENT		50 ohm			TIN OVER NICKEL	15 dB	1.5 dB		e3	20 MHz	2000 MHz
ADP-2-20	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			30 dBm	2.01		COMPONENT	FL6,.2,100	50 ohm	85 Cel	-40 Cel	TIN LEAD	15 dB	1.5 dB		e0	20 MHz	2000 MHz
SBB-2-23+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			40 dBm	1.29		COMPONENT	SOC6,.28	50 ohm	85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier	17 dB	1 dB	TR, 7 INCH: 200	e3	2000 MHz	2300 MHz
SBB-2-23	Mini-circuits	SPLITTER AND COMBINER					40 dBm	1.29		COMPONENT		50 ohm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1 dB	ISOLATION-MIN (DB):17	e0	2000 MHz	2300 MHz
TCP-2-10-75+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6			26.99 dBm	1.48		MODULE		75 ohm	85 Cel	-40 Cel	TIN OVER NICKEL	14 dB	1.4 dB	ISOLATION-MIN (DB):14	e3	5 MHz	1000 MHz
TCP-2-10-75	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	1.48		MODULE		75 ohm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.4 dB	ISOLATION-MIN (DB):14	e0	5 MHz	1000 MHz
TCP-2-10-75X+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	1.48		MODULE		75 ohm	85 Cel	-40 Cel	TIN OVER NICKEL		1.4 dB	ISOLATION-MIN (DB):14	e3	5 MHz	1000 MHz
ZAPD-2-S+	Mini-circuits	SPLITTER AND COMBINER	PANEL MOUNT				40 dBm	1.26	800 mA	COAXIAL		50 ohm	100 Cel	-55 Cel		19 dB	.6 dB	SMA		1000 MHz	2000 MHz
EP2-28+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY	GAAS	27.99 dBm	1.3		COMPONENT	SOLCC6(UNSPEC)	50 ohm	105 Cel	-55 Cel		17 dB	2.3 dB			25000 MHz	35000 MHz
ZFSC-2-1-N+	Mini-circuits	SPLITTER AND COMBINER	PANEL MOUNT				30 dBm	1.14		COAXIAL		50 ohm	100 Cel	-55 Cel		20 dB	.8 dB	N		5 MHz	500 MHz
ZFSC-2-1-N	Mini-circuits	SPLITTER AND COMBINER	PANEL MOUNT				30 dBm	1.14		COAXIAL		50 ohm	100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	20 dB	.8 dB	N	e0	5 MHz	500 MHz
EP2W1+	Mini-circuits	SPLITTER AND COMBINER					33.98 dBm	1.7		COMPONENT		50 ohm	85 Cel	-40 Cel			4.5 dB	ISOLATION-MIN (DB):6.3		500 MHz	9500 MHz
SBTC-2-10-75LX+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	1.35		MODULE		75 ohm	85 Cel	-40 Cel			1.4 dB	ISOLATION-MIN (DB):17		10 MHz	1000 MHz
ZFSC-2-372-S+	Mini-circuits	SPLITTER AND COMBINER					44.77 dBm	1.99		COAXIAL		50 ohm	85 Cel	-40 Cel			1.6 dB	SMA		10 MHz	3700 MHz
JPS-2-1N+	Mini-circuits	SPLITTER AND COMBINER					30 dBm	1.22		COMPONENT		50 ohm	85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		.5 dB	ISOLATION-MIN (DB):20	e3	350 MHz	550 MHz
JPS-2-1W+	Mini-circuits	SPLITTER AND COMBINER					30 dBm	1.1		COMPONENT		50 ohm	85 Cel	-40 Cel	TIN OVER NICKEL		1.4 dB	ISOLATION-MIN (DB):16	e3	3 MHz	750 MHz
TCP-2-25X+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	2.27		MODULE		50 ohm	85 Cel	-40 Cel			1.3 dB	ISOLATION-MIN (DB):10		200 MHz	2500 MHz
ADAR5000ACBZ-R7	Analog Devices	SPLITTER AND COMBINER
ADAR5000ACBZ	Analog Devices	SPLITTER AND COMBINER
PSP-1002	Broadcom	SPLITTER AND COMBINER					30 dBm	1.7		MODULE		50 ohm	85 Cel	-55 Cel			1 dB			0 MHz	10000 MHz

RF/Microwave Splitter/Combiners

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.