BICMOS RF/Microwave Splitter/Combiners 4

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Manufacturers
    • Analog Devices
    • Anaren
    • Api Technologies
    • Broadcom
    • Cobham Plc
    • Commscope
    • M/a-com Technology Solutions
    • Maxim Integrated
    • Mini-circuits
    • Phoenix Contact
    • Pulsar Microwave
    • Pulse Electronics
    • Skyworks Solutions
    • Synergy Microwave
    • Ttm Technologies
RF or Microwave Device Type
    • COMBINER
    • SPLITTER
    • SPLITTER AND COMBINER
Mounting Feature
    • PANEL MOUNT
    • SURFACE MOUNT
No. of Terminals
    • 12
    • 16
    • 20
    • 24
    • 6
    • 8
Package Body Material
    • CERAMIC
    • CERAMIC, METAL-SEALED COFIRED
    • PLASTIC/EPOXY
Technology (1)
    • BICMOS
    • GAAS
    • HYBRID
Maximum Input Power (CW)
    • 13.01 dBm
    • 20 dBm
    • 22.04 dBm
    • 23.98 dBm
    • 26.99 dBm
    • 27.99 dBm
    • 30 dBm
    • 31.76 dBm
    • 33.01 dBm
    • 33.98 dBm
    • 36.02 dBm
    • 36.99 dBm
    • 40 dBm
    • 41.14 dBm
    • 41.76 dBm
    • 43.01 dBm
    • 44.77 dBm
    • 58.45 dBm
Maximum Voltage Standing Wave Ratio
    • 1.1
    • 1.12
    • 1.14
    • 1.17
    • 1.19
    • 1.2
    • 1.21
    • 1.22
    • 1.26
    • 1.27
    • 1.29
    • 1.3
    • 1.35
    • 1.38
    • 1.4
    • 1.42
    • 1.48
    • 1.5
    • 1.61
    • 1.64
    • 1.67
    • 1.7
    • 1.98
    • 1.99
    • 2.01
    • 2.27
    • 2.9
Maximum Supply Current
    • 105 mA
    • 171 mA
    • 175 mA
    • 240 mA
    • 800 mA
    • 90 mA
Construction
    • COAXIAL
    • COMPONENT
    • MODULE
Power Supplies (V)
    • 5
Package Equivalence Code
    • DILCC6,.25
    • FL6,.2,100
    • FL8,.38,200
    • LCC12,.12SQ,20
    • LCC16,.12SQ,20
    • LCC20,.16SQ,20
    • LCC20,.20SQ,25
    • LCC24,.16SQ,20
    • SOC6,.28
    • SOLCC6(UNSPEC)
    • SOLCC6,.05,25
    • SOLCC6,.06,40
Characteristic Impedance
    • 50 ohm
    • 75 ohm
Sub-Category
    • RF/Microwave Splitter/Combiners
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 125 Cel
    • 85 Cel
Minimum Operating Temperature
    • -40 Cel
    • -55 Cel
    • -65 Cel
Terminal Finish
    • GOLD
    • Gold (Au) - with Nickel (Ni) barrier
    • MATTE TIN
    • MATTE TIN OVER NICKEL
    • Matte Tin (Sn)
    • Matte Tin (Sn) - annealed
    • NICKEL GOLD
    • Nickel/Gold (Ni/Au)
    • TIN
    • TIN LEAD
    • TIN OVER NICKEL
    • TIN SILVER OVER NICKEL
    • Tin (Sn)
    • Tin (Sn) - with Nickel (Ni) barrier
    • Tin/Lead (Sn/Pb)
    • Tin/Lead (Sn85Pb15)
    • Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier
    • Tin/Silver/Nickel (Sn/Ag/Ni)
Minimum Isolation
    • 10 dB
    • 12 dB
    • 14 dB
    • 15 dB
    • 16 dB
    • 17 dB
    • 19 dB
    • 20 dB
    • 6 dB
Maximum Insertion Loss
    • .4 dB
    • .5 dB
    • .6 dB
    • .7 dB
    • .75 dB
    • .8 dB
    • .85 dB
    • .9 dB
    • 1 dB
    • 1.3 dB
    • 1.4 dB
    • 1.5 dB
    • 1.6 dB
    • 1.8 dB
    • 1.9 dB
    • 2.1 dB
    • 2.3 dB
    • 2.5 dB
    • 3 dB
    • 3.2 dB
    • 4 dB
    • 4.5 dB
    • 7.5 dB
Additional Features
    • 7/16-F, HIGH RELIABILITY, USABLE TO 2500 MHZ
    • ISOLATION-MIN (DB):10
    • ISOLATION-MIN (DB):10.5
    • ISOLATION-MIN (DB):13
    • ISOLATION-MIN (DB):14
    • ISOLATION-MIN (DB):15
    • ISOLATION-MIN (DB):16
    • ISOLATION-MIN (DB):17
    • ISOLATION-MIN (DB):18
    • ISOLATION-MIN (DB):19
    • ISOLATION-MIN (DB):20
    • ISOLATION-MIN (DB):6
    • ISOLATION-MIN (DB):6.3
    • ISOLATION-MIN (DB):8
    • N
    • SMA
    • SMA, I/P POWER-MAX(PEAK)=1000W
    • SMA, ISOLATION-MIN (DB):19
    • SMA-F
    • SMA-F, ISOLATION-MIN (DB):18
    • SMA-F, ISOLATION-MIN (DB):20
    • TNC-F
    • TR, 7 INCH: 200
JESD-609 Code
    • e0
    • e2
    • e3
    • e4
Minimum Operating Frequency
    • .4 MHz
    • 0 MHz
    • 1 MHz
    • 10 MHz
    • 1000 MHz
    • 1100 MHz
    • 1200 MHz
    • 1420 MHz
    • 150 MHz
    • 1500 MHz
    • 1550 MHz
    • 1600 MHz
    • 1700 MHz
    • 1710 MHz
    • 20 MHz
    • 200 MHz
    • 2000 MHz
    • 2300 MHz
    • 25000 MHz
    • 2800 MHz
    • 2825 MHz
    • 3 MHz
    • 3100 MHz
    • 3400 MHz
    • 350 MHz
    • 4000 MHz
    • 5 MHz
    • 50 MHz
    • 500 MHz
    • 54 MHz
    • 700 MHz
    • 800 MHz
    • 902 MHz
    • 950 MHz
Maximum Operating Frequency
    • 1000 MHz
    • 10000 MHz
    • 1100 MHz
    • 12000 MHz
    • 1660 MHz
    • 1700 MHz
    • 18000 MHz
    • 1925 MHz
    • 2000 MHz
    • 2025 MHz
    • 2100 MHz
    • 2150 MHz
    • 2200 MHz
    • 2300 MHz
    • 2500 MHz
    • 26500 MHz
    • 2800 MHz
    • 3000 MHz
    • 3300 MHz
    • 350 MHz
    • 35000 MHz
    • 3700 MHz
    • 400 MHz
    • 4400 MHz
    • 4600 MHz
    • 500 MHz
    • 5000 MHz
    • 550 MHz
    • 6000 MHz
    • 650 MHz
    • 7200 MHz
    • 750 MHz
    • 8000 MHz
    • 850 MHz
    • 865 MHz
    • 900 MHz
    • 928 MHz
    • 9500 MHz
Reset All
Part RoHS Manufacturer RF or Microwave Device Type Mounting Feature No. of Terminals Package Body Material Technology Maximum Input Power (CW) Maximum Voltage Standing Wave Ratio Maximum Supply Current Construction Power Supplies (V) Package Equivalence Code Characteristic Impedance Sub-Category Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Minimum Isolation Maximum Insertion Loss Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency

MAX9987ETP-T

Maxim Integrated

SPLITTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BICMOS

43.01 dBm

1.7

171 mA

COMPONENT

5

LCC20,.20SQ,25

50 ohm

RF/Microwave Splitter/Combiners

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

700 MHz

1100 MHz

MAX9987EGP

Maxim Integrated

SPLITTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BICMOS

20 dBm

1.7

171 mA

COMPONENT

5

LCC20,.20SQ,25

50 ohm

RF/Microwave Splitter/Combiners

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

700 MHz

1100 MHz

MAX9988ETP-T

Maxim Integrated

SPLITTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BICMOS

43.01 dBm

1.7

171 mA

COMPONENT

5

LCC20,.20SQ,25

50 ohm

RF/Microwave Splitter/Combiners

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

1500 MHz

2200 MHz

MAX9988EGP

Maxim Integrated

SPLITTER

SURFACE MOUNT

20

PLASTIC/EPOXY

BICMOS

20 dBm

1.4

175 mA

COMPONENT

5

LCC20,.20SQ,25

50 ohm

RF/Microwave Splitter/Combiners

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

1500 MHz

2200 MHz
RF/Microwave Splitter/Combiners

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.