SURFACE MOUNT RF/Microwave Up/Down Converters 328

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum RF Output Frequency	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Minimum RF Output Frequency	Construction	Minimum RF Input Frequency	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Minimum Up Conversion Gain	Maximum Operating Temperature	Minimum Down Conversion Gain	Maximum Output Power	Minimum Intermediate Frequency (IF)	Maximum RF Input Frequency	Minimum Operating Temperature	Terminal Finish	LO Tunable	Maximum Noise Figure	Additional Features	JESD-609 Code	Minimum Input Power (CW)	Maximum Intermediate Frequency (IF)
MAX9996ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			240 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3		350 MHz
MAX9996ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			240 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3		350 MHz
MAX9996ETP+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			240 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3		350 MHz
MAX9986ETP+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3		250 MHz
MAX9984ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers		85 Cel			50 MHz	1000 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3		250 MHz
MAX9986ETP+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3		250 MHz
MAX19997AETX+TD	Analog Devices		SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS			420 mA				3.3/5	LCC36,.25SQ,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
MAX9994ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			235 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7.2 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3		350 MHz
MAX9984ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	400 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Mixers		85 Cel			50 MHz	1000 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3		250 MHz
MAX9996ETP+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			240 mA		COMPONENT	1700 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	7 dB		40 MHz	2200 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.7 dB		e3		350 MHz
MAX9986ETP+TD	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3		250 MHz
MAX9986ETP+D	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS			265 mA		COMPONENT	815 MHz	5	LCC20,.20SQ,25	50 ohm	RF/Microwave Up/Down Converters		85 Cel	9 dB		50 MHz	995 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	9.3 dB		e3		250 MHz
MAX2261EUT-T	Analog Devices		SURFACE MOUNT	6	PLASTIC/EPOXY				11.3 mA				3/5	TSOP6,.11,37		RF/Microwave Up/Down Converters		85 Cel					-40 Cel	TIN LEAD				e0
MAX2263EUT-T	Analog Devices		SURFACE MOUNT	6	PLASTIC/EPOXY				4.1 mA				3/5	TSOP6,.11,37		RF/Microwave Up/Down Converters		85 Cel					-40 Cel	TIN LEAD				e0
MAX2680AUT+	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY			1.5	7.7 mA		COMPONENT	400 MHz	3	TSSOP6,.08	50 ohm			85 Cel			10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	11.7 dB		e3		500 MHz
MAX2260EUT-T	Analog Devices		SURFACE MOUNT	6	PLASTIC/EPOXY				6.6 mA				3/5	TSOP6,.11,37		RF/Microwave Up/Down Converters		85 Cel					-40 Cel	TIN LEAD				e0
MAX2680EUT+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR		1.5	7.7 mA		COMPONENT	400 MHz	3/5	TSOP6,.11,37	50 ohm	RF/Microwave Up/Down Converters		85 Cel	5.7 dB		10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3		500 MHz
MAX2680AUT+T	Analog Devices	DOWN CONVERTER	SURFACE MOUNT	6	PLASTIC/EPOXY			1.5	7.7 mA		COMPONENT	400 MHz	3	TSSOP6,.08	50 ohm			85 Cel			10 MHz	2500 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES	11.7 dB		e3		500 MHz
LA7784-TLM-E	Onsemi		SURFACE MOUNT	34	PLASTIC/EPOXY	BIPOLAR			130 mA				5	SOP34,.3,32		RF/Microwave Up/Down Converters		70 Cel					-20 Cel	Tin/Bismuth (Sn/Bi)				e6
LA7784FN	Onsemi		SURFACE MOUNT	32	PLASTIC/EPOXY								5	LCC32,.2SQ,16		RF/Microwave Up/Down Converters		70 Cel					-20 Cel
LA8153LF	Onsemi		SURFACE MOUNT	28	PLASTIC/EPOXY				130 mA				3.3	LCC28,.2SQ,20		RF/Microwave Up/Down Converters		70 Cel					-20 Cel
STA5630	STMicroelectronics		SURFACE MOUNT	32	PLASTIC/EPOXY	CMOS							1.8	LCC32,.2SQ,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel	Silver (Ag)				e4
STW82100BTR	STMicroelectronics	DOWN CONVERTER	SURFACE MOUNT	44	PLASTIC/EPOXY	BICMOS					COMPONENT	1850 MHz	3.3,5	LCC44,.28SQ,20	50 ohm	RF/Microwave Up/Down Converters		85 Cel				2400 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3
STW82100B	STMicroelectronics	DOWN CONVERTER	SURFACE MOUNT	44	PLASTIC/EPOXY	BICMOS					COMPONENT	1850 MHz	3.3,5	LCC44,.28SQ,20	50 ohm	RF/Microwave Up/Down Converters		85 Cel				2400 MHz	-40 Cel	Matte Tin (Sn) - annealed	YES			e3
TFF1015HN/N1,135	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1014HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
SA9503	NXP Semiconductors	DOWN CONVERTER	SURFACE MOUNT	32	PLASTIC/EPOXY	BICMOS			34.5 mA		COMPONENT	869 MHz	3	LCC32,.16SQ,20		RF/Microwave Up/Down Converters		85 Cel	10.5 dB		50 MHz	894 MHz	-40 Cel		NO	11 dB	DOWN CONVERSION GAIN FOR FM IS 6.5			300 MHz
MRFIC1813	NXP Semiconductors	UP CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	2500 MHz		35 mA	1700 MHz	COMPONENT		3	TSSOP16,.25		RF/Microwave Up/Down Converters	12 dB	85 Cel			70 MHz		-30 Cel	Tin/Lead (Sn/Pb)	YES			e0		350 MHz
TFF1012HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
MRFIC1502	NXP Semiconductors	DOWN CONVERTER	SURFACE MOUNT	48	PLASTIC/EPOXY	BIPOLAR		2	60 mA		COMPONENT		5	QFP48,.35SQ,20	50 ohm	RF/Microwave Up/Down Converters		100 Cel	65 dB		4.5 MHz	1575 MHz	-40 Cel	Tin/Lead (Sn/Pb)	NO			e0		14.5 MHz
TFF1017HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1012HN/N1,135	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TDA8060ATS	NXP Semiconductors	DOWN CONVERTER	SURFACE MOUNT	24	PLASTIC/EPOXY				93 mA		COMPONENT		5	SSOP24,.3	50 ohm	RF/Microwave Up/Down Converters		85 Cel					-20 Cel		YES	16 dB
TFF1004HN/N1/T3	NXP Semiconductors		SURFACE MOUNT	24	PLASTIC/EPOXY				125 mA				3.3	LCC24,.16SQ,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1017HN/N1,135	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1014HN/N1,135	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1013HN/N1,135	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1018HN/N1,135	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TFF1018HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
TDA8260TW	NXP Semiconductors	DOWN CONVERTER	SURFACE MOUNT	38	PLASTIC/EPOXY						COMPONENT	950 MHz	5	TSSOP38,.25,20		RF/Microwave Up/Down Converters		85 Cel				2175 MHz	-20 Cel		NO	18 dB
TFF1015HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY								5	LCC16,.1X.14,20		RF/Microwave Up/Down Converters		85 Cel					-40 Cel
CGY360	Infineon Technologies	DOWN CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS							+-5	SOP16,.35,32		RF/Microwave Up/Down Converters		85 Cel				3500 MHz	-40 Cel	Tin/Lead (Sn/Pb)	NO			e0	0 dBm
PMB2332	Infineon Technologies	DOWN CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR							2.7/4.5	TSSOP16,.25	50 ohm	RF/Microwave Mixers		85 Cel				1100 MHz	-40 Cel	Tin/Lead (Sn/Pb)	YES			e0		3000 MHz
TUA6110XS	Infineon Technologies	DOWN CONVERTER	SURFACE MOUNT	28	PLASTIC/EPOXY	BIPOLAR			32 mA				5	SSOP28,.3		RF/Microwave Mixers		80 Cel					-20 Cel	Tin/Lead (Sn/Pb)				e0
CMY200	Infineon Technologies	DOWN CONVERTER	SURFACE MOUNT	5	PLASTIC/EPOXY	GAAS			70 mA		COMPONENT	1000 MHz	5	TSOP5/6,.11,37	50 ohm	RF/Microwave Up/Down Converters			6 dB	17 dBm	40 MHz	1400 MHz		Tin/Lead (Sn/Pb)	YES	10 dB		e0		100 MHz
CGY340	Infineon Technologies	UP CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	3450 MHz			3425 MHz	COMPONENT		+-5	SOP16,.35,32		RF/Microwave Up/Down Converters		85 Cel		0 dBm	1066 MHz		-40 Cel	Tin/Lead (Sn/Pb)	NO			e0		1091 MHz
PMB2110	Infineon Technologies		SURFACE MOUNT	10	PLASTIC/EPOXY				34 mA				2.8	TSSOP10,.19,20		RF/Microwave Up/Down Converters		70 Cel					-20 Cel	Tin/Lead (Sn/Pb)				e0
PMB2333	Infineon Technologies	UP/DOWN CONVERTER	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR					COMPONENT		2.7/4.5	TSSOP16,.25	50 ohm	RF/Microwave Mixers		85 Cel				3000 MHz	-40 Cel	Tin/Lead (Sn/Pb)	YES			e0		3000 MHz

RF/Microwave Up/Down Converters

RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.

Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.

Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.

RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.